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Mar. 28, 2006
10G 1310nm XFP Transceiver
(Up to 10km transmission)
Members of FlexonTM Family
Compliant with ITU-T G.959 Compliant with IEEE 802.3ae-2002 Compliant with 10GFC standard Compliant with FCC 47 CFR Part 15, Class B Compliant with FDA 21 CFR 1040.10 and 1040.11, Class I RoHS compliance
Description Features
Up to 11.1Gbps data-rate Up to 10km transmission 1310nm uncooled EML and PIN receiver XFI electrical interface 2-wire interface for integrated Digital Diagnostic monitoring XFP MSA package with duplex LC connector Hot pluggable Very low EMI and excellent ESD protection +5V, +3.3V power supply Power consumption less than 2.5 W Operating case temperature: 0 to +70 The module is hot pluggable into the 30-pin connector. The high-speed electrical interface is base on low voltage logic, with nominal 100 Ohms differential impedance and AC coupled in the module. The optical output can be disabled by LVTTL logic high-level input of TX_DIS. Loss of SDH I-64.1 at 9.953Gbps 10G Ethernet 10GBASE-LR at 10.3125Gbps 10G Fiber Channel at 10.51875Gbps OC192 over FEC at 10.709Gbps 10GE over G.709 at 11.09Gbps Other optical links A serial EEPROM in the transceiver allows the user to access transceiver monitoring and configuration data via the 2-wire XFP Management Interface. This interface uses a single address, A0h, with a memory map divided into a lower and upper area. Basic digital diagnostic (DD) data is held in the lower area Compliant with XFP MSA Compliant with ITU-T G.691 while specific data is held in a series of tables in the high memory area.
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FTM-33X1C-X10G is a high performance, cost effective modules, used for 10G SDH/SONET and 10G Ethernet, supporting data-rate from 9.953Gbps to 11.1Gbps and transmission distance up to 10km. The transceiver consists of two sections: The transmitter section incorporates a 1310nm uncooled EML, driver and re-timer. The receiver section consists of a PIN photodiode integrated with a transimpedance preamplifier (TIA) and CDR.
Applications
signal (RX_LOS) output is provided to indicate the loss of an input optical signal of receiver.
Standard
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Regulatory Compliance
The transceivers are tested according to American and European product safety and electromagnetic compatibility regulations (See Table 1). For further information regarding regulatory certification, please refer to Fiberxon regulatory specification and safety guidelines, or contact with Fiberxon, Inc. America sales office listed at the end of the documentation. Table 1- Regulatory Compliance Feature Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) to the Duplex LC Receptacle Electromagnetic Interference (EMI) Immunity Laser Eye Safety Component Recognition Standard MIL-STD-883E Method 3015.7 IEC 61000-4-2 GR-1089-CORE FCC Part 15 Class B EN55022 Class B (CISPR 22B) VCCI Class B IEC 61000-4-3 FDA 21CFR 1040.10 and 1040.11 EN60950, EN (IEC) 60825-1,2 UL and CSA Compliant with standards Compliant with Class 1 laser product. TUV Certificate No. 50083024 UL file E223705 Compliant with standards Performance Class 1(>500 V) Compliant with standards
Absolute Maximum Ratings
Stress in excess of the maximum absolute ratings can cause permanent damage to the module. Table 2 - Absolute Maximum Ratings Parameter Storage Temperature Supply Voltage Operating Relative Humidity Symbol TS VCC5 VCC3 RH Min. -40 -0.5 -0.5 Max. +85 6.0 4.0 85 Unit C V V %
Recommended Operating Conditions
Table 3 - Recommended Operating Conditions Parameter Operating Case Temperature Power Supply Voltage Power Supply Current Power Dissipation Data Rate Symbol TC VCC5 VCC3 ICC5 ICC3 PD 9.953 Min. 0 4.75 3.13 5.0 3.3 Typical Max. +70 5.25 3.47 200 500 2.5 11.1
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Unit C V mA W Gbps
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Optical Characteristics
Table 4 - Optical Characteristics Parameter Operating Data Rate Centre Wavelength Average Output Power Spectral Width Side Mode Suppression Ratio Extinction Ratio Dispersion Penalty Optical Eye Mask Operating Data Rate Centre Wavelength Receiver Sensitivity Receiver Overload LOS Assert LOS Deassert LOS Hysteresis Receiver Reflectance Notes: 1. 2. 3. The optical power is launched into SMF. Measured with a PRBS 231-1 test pattern @9.953Gbps. Measured with a PRBS 231-1 test pattern @9.953Gbps, BER10-12. C PIN PIN LOSA LOSD 1 -1 -25 -15 4 -14 C P0UT SMSR EX DP Receiver 9.953 1260 -16 11.1 1600 -11 Gbps nm dBm dBm dBm dBm dB dB 3 3 30 6 1 Symbol Min. 9.953 1290 -6 Typical Max. 11.1 1330 -1 1 Unit Gbps nm dBm nm dB dB dB 2 2 1 Notes Transmitter
Compliant with ITU-T G.691 and GR-253-CORE
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Electrical Characteristics
Table 5 - Electrical Characteristics Parameter Input Data Rate Differential Data Input Amplitude Input Differential Impedance Output Data Rate Differential Date Output Amplitude Output Differential Impedance Low-speed Signal (LVTTL) Interface Specification Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage 2 Wire Serial Interface (LVTTL) Specification Clock Frequency No reference clock Note: 1. Internally AC coupled fSCL 400 kHz Reference Clock (PECL) Interface Specification 2.0 GND 2.4 GND Vdd1=3.3 0.8 Vdd1=3.3 0.4 V V V V 9.953 500 100 Symbol Min. 9.953 120 100 11.1 800 Typical Max. 11.1 1200 Unit Gbps mVpp Gbps mVpp 1 1 Notes High-speed Signal (CML) Interface Specification
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Management Interface
The structure of the memory map is shown in Figure 1, which is accessible over a 2 wire serial interface at the 8-bit address 1010000X (A0h). The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control function. The monitoring specification is shown in Table 6. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The contents of Table 01h are list in table 7 below. PLS refer INF-8077i (Revision 4.0) for detailed information.
Figure 1, 2-wire Serial Digital Diagnostic Memory Map Table 6 - Monitoring Specification Data Address 96-97 100-101 102-103 104-105 106-107 108-109 Parameter Temperature Bias Current TX Power RX Power VCC5 Voltage VCC3 Voltage Range -10 to 80C 0 to 100mA -9 to 0dBm -16 to 0dBm +4.5V to +5.5V +3.0V to +3.7V Accuracy 3C 10% 2dB 2dB 3% 3%
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Table 7 - Serial ID Memory Contents (Table 01h) Field Addr. 128 129 130 131-138 139 140 141 142 143 144 145 146 147 148-163 164 165-167 168-183 184-185 186-187 188-189 190 191 192-195 196-211 212-219 220 221 222 223 224-255 Size (Bytes) 1 1 1 8 1 1 1 1 1 1 1 1 1 16 1 3 16 2 2 2 1 1 4 16 8 1 1 1 1 32 Identifier Ext. Identifier Connector Transceiver Encoding BR-Min BR-Max Length (9um)-km Length (E-50um) Length (50um) Length (62.5um) Length (copper) Device Tech Vendor name CDR Support Vendor OUI Vendor PN Vendor rev Wavelength Max Case Temp CC_BASE Power Supply Vendor SN Vendor date code Diagnostic type Enhanced option Aux Monitoring CC EXT Vendor specific 7D 96 45 00 xx xx xx xx xx xx xx xx xx xx xx xx xx xx xx xx 08 60 67 xx 06 50 07 44 00 00 00 40 00 00 00 30 63 6F 0A 00 00 00 00 60 46 49 42 45 52 58 4F 4E 20 49 4E 43 2E 20 20 20 F8 00 00 00 46 54 4D 2D 33 33 58 31 43 2D 58 31 30 47 20 20 xx xx 66 58 46 "FTM-33X1C-X10G" (ASC) ASC( "32 61" means 2a revision) 1310nm +/- 20nm 70degC Check sum of bytes 128 - 190 2.5W (max), 1.5W (max, power down mode), 200mA(max, +5.0V), 500mA (max, +3.3V) ASC. 1310nm EML, PIN Detector "FIBERXON INC. "(ASC) CDR supports 9.953Gbps~11.1Gbps XFP TX Ref Clock Input not Required LC Connector 10GBASE-LR/W, I-64.1 SONET Scrambled 9.953Gbps 11.1Gbps 10km Name of Field Hex Description
Wavelength Tolerance0F A0
xx xx xx xx xx xx 20 20 Year (2 bytes), Month (2 bytes), Day (2 bytes) No BER Support, Average Power Optional Soft Tx_Disable and P_Down +5.0V and +3.3V Supply Voltage Check sum of bytes 192 - 222 Reserved By Vendor
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Recommended Host Board Power Supply Circuit
Figure 2 shows the recommended host board power supply circuit.
Figure 2, Recommended Host Board Power Supply Circuit
Recommended Interface Circuit
Figure 3 shows the recommended interface circuit.
Host Board
SerDat Out +
XFP Module
Z=50
TD +
CML
SerDat Out -
Z=50
TD -
100
CML
100 CML
SerDat In +
Z=50
RD +
SerDat In -
Z=50
CML
RD REFCLKP
Vcc (+3.3V) 4.7K to 10K
REFCLKN RX_LOS INTERRUPT SDA SCL MOD_NR MOD_abs TX_DIS MOD_DeSel P_Down/RST
100
Vcc (+3.3V) 10K GND
Figure 3, Recommended Interface Circuit
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Pin Definitions
Figure 4 below shows the pin numbering of XFP electrical interface. The pin functions are described in Table 5 with some accompanying notes.
Figure 4, Pin View Table 8 - Pin Function Definitions Pin 1 2 3 4 5 6 LVTTL-I LVTTL-O LVTTL-I Logic Symbol GND VEE5 Mod_Desel Interrupt TX_DIS VCC5 Module Ground Optional -5.2V Power Supply (Not implemented) Module De-select; When held low allows the module to respond to 2-wire serial interface Interrupt; Indicates presence of an important condition which can be read over the 2-wire serial interface Transmitter Disable; Turns off transmitter laser output +5V Power Supply
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Name/Description
Note 1
2
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 LVTTL-I CML-O CML-O LVTTL-I/O LVTTL-I/O LVTTL-O LVTTL-O LVTTL-O
GND VCC3 VCC3 SCL SDA Mod_Abs Mod_NR RX_LOS GND GND RDRD+ GND VCC2 P_Down/RST
Module Ground +3.3V Power Supply +3.3V Power Supply 2-Wire Serial Interface Clock 2-Wire Serial Interface Data Line Indicates Module is not present. Grounded in the Module Module Not Ready; Indicating Module Operational Fault Receiver Loss Of Signal Indicator Module Ground Module Ground Receiver Inverted Data Output Receiver Non-Inverted Data Output Module Ground +1.8V Power Supply (Not implemented). Power down; When high, requires the module to limit power consumption to 1.5W or below. 2-Wire serial interface must be functional in the low power mode. Reset; The falling edge initiates a complete reset of the module including the2-wire serial interface, equivalent to a power cycle.
1
2 2 2 2 2 1 1
1 3
22 23 24 25 26 27 28 29 30 1. 2. 3. 4. CML-I CML-I PECL-I PECL-I
VCC2 GND RefCLK+ RefCLKGND GND TDTD+ GND
+1.8V Power Supply (Not implemented) Module Ground Not used, internally terminated to 50ohm (100ohm diff). Not used, internally terminated to 50ohm (100ohm diff). Module Ground Module Ground Transmitter Inverted Data Input Transmitter Non-Inverted Data Input Module Ground
3 1 4 4 1 1
1
Module ground pins GND are isolated from the module case and chassis ground within the module. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board. The pins are open within module. Reference Clock is not required.
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Mechanical Design Diagram
Blue Lever
LABEL
Figure 5, Mechanical Design Diagram of XFP
Ordering information
FTM
3
3
X
1
C
X
1
0
G
Wavelength 3: 1310nm Function 3: With CDR Data rate X1: Multi-rate Part No. FTM-33X1C-X10G compliance Product Description
Distance 10: 10km Package X: XFP Receptacle C: LC
G: RoHS Compliance
1310nm EML Laser, Multi-rate from 9.953Gbps to 11.1Gbps, 10km, XFP, RoHS
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10G 1310nm XFP Transceiver Up to 10 km transmission Mar. 28, 2006
Related Documents
INF-8077i (10 Gigabit Small Form Factor Pluggable Module), Revision 4.0
Obtaining Document
You can visit our website: http://www.fiberxon.com Or contact with Fiberxon, Inc. America Sales Office listed at the end of documentation to get the latest documents.
Revision History
Revision Rev. 1a Rev. 1b Initiate Andy.Xiao Andy.Xiao Review Stella.Li Stella.Li Approve Alain.Shang Alain.Shang Subject Initial datasheet Update the max data rate from 10.709G to 11.1G (c) Copyright Fiberxon Inc. 2006 All Rights Reserved. All information contained in this document is subject to change without notice. The products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Fiberxon product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Fiberxon or third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The results obtained in other operating environment may vary. THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN "AS IS" BASIS. In no event will Fiberxon be liable for damages arising directly from any use of the information contained in this document. Contact U.S.A. Headquarter: 5201 Great America Parkway, Suite 340 Santa Clara, CA 95054 U. S. A. Tel: 408-562-6288 Fax: 408-562-6289 Or visit our website: http://www.fiberxon.com
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Release Date Mar. 20, 2006 Mar. 28, 2006

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