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IP4359CX4
Dual channel low capacitance high performance ESD protection
Rev. 1 -- 6 August 2010 Product data sheet
1. Product profile
1.1 General description
The IP4359CX4 is a dual channel low capacitance ElectroStatic Discharge (ESD) protection device, providing protection to downstream components from ESD voltages as high as 15 kV contact discharge and > 15 kV air discharge according the IEC 61000-4-2 model, far exceeding standard level 4. The device is optimized for protection of high speed interfaces such as Universal Serial Bus (USB) 2.0, High Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI) and other interfaces requiring very low capacitance ESD protection. The device is available in two different heights. 0.61 mm and reduced maximum height of 0.5 mm. Both versions contain identical circuits and show an identical electrical performance. Both ESD protection channels share common ground connections, but are electrically separated, thereby preventing current back drive into the adjacent channel. IP4359CX4 is fabricated using monolithic silicon technology in a single Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4359CX4 ideal for use in applications requiring component miniaturization such as mobile phone handsets and other portable electronic devices.
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) 2 ultra low input capacity rail-to-rail ESD protection diodes with C(I/O-GND) = 1.3 pF Rdyn = 0.45 Integrated ESD protection withstanding 15 kV contact discharge and > 15 kV air discharge, far exceeding IEC 61000-4-2 level 4 Standard height version (0.61 mm) available as IP4359CX4/LF Reduced height version (maximum height of 0.5 mm) available as IP4359CX4/LF-H500 2 x 2 solder ball WLCSP with 0.4 mm pitch
1.3 Applications
High-speed interface ESD protection such as USB 2.0, HDMI, DVI etc. Interfaces with special requirements on low capacitive ESD protection Interfaces requiring separation of the positive clamping voltage/current path
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
2. Pinning information
Table 1. Pin A1 and A2 B1 and B2 Pinning Description ESD protection ground
bump A1 index area 1 2 A1 A2
Simplified outline
Graphic symbol
A
B1
B2
008aaa239
B
008aaa236
transparent top view, solder balls facing down
3. Ordering information
Table 2. Ordering information Package height standard[1] reduced[2] Package Name IP4359CX4/LF IP4359CX4/LF-H500
[1] [2] For details see Table 5. For details see Table 6.
Type number
Description wafer level chip-size package; 4 bumps (2 x 2) wafer level chip-size package; 4 bumps (2 x 2)
Version IP4359CX4 IP4359CX4
WLCSP4 WLCSP4
IP4359CX4
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
2 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
4. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage Conditions pins A1 and A2 to ground (B1, B2) pins A1 and A2 to ground (B1, B2) contact discharge air discharge IEC 61000-4-2 level 4; pins A1 and A2 to ground (B1, B2) contact discharge air discharge Tstg Tamb
[1]
[1] [1]
Min Max -0.5 +5.5 -15 -20 +15 +20
Unit V kV kV
-8 -15 -55 -35
+8 +15 260 +85
kV kV C C
storage temperature ambient temperature
+150 C
Treflow(peak) peak reflow temperature 10 s maximum
Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge).
5. Characteristics
Table 4. Electrical characteristics Tamb = 25 C; unless otherwise specified. Symbol C(I/O-GND) ILR VBRzd VF Rdyn Parameter input/output to ground capacitance Conditions pins A1 and A2 to ground (B1, B2); VI = 3.3 V; f = 1 MHz
[1]
Min 6 -
Typ Max 1.3 0.7 1.5 100 9 -
Unit pF nA V V
reverse leakage current pins A1 and A2 to ground (B1, B2); VI = 3.3 V Zener diode breakdown Itest = 1 mA voltage forward voltage dynamic resistance Itest = 1 A; IEC 61000-4-5 positive discharge negative discharge
-
0.45 0.45 -
[1]
Guaranteed by design.
IP4359CX4
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
3 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
6. Application information
6.1 Insertion loss
The IP4359CX4 is mainly designed as an ESD protection device for high speed interfaces such as USB 2.0, DVI and HDMI high speed data lines etc. The insertion loss measurement configuration of a typical 50 NetWork Analyzer (NWA) system for evaluation of the IP4359CX4 is shown in Figure 1. The insertion loss of IP4359CX4 is depicted in Figure 2.
IN
50
DUT
OUT
50
TEST BOARD
Vgen 001aai755
Fig 1.
Frequency response measurement configuration
5 s21 (dB) -5
008aaa237
-15
-25
-35 10-1
1
10
102
103 f (MHz)
104
Pin A1 and pin A2 to ground.
Fig 2.
Measured insertion loss magnitude
IP4359CX4
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
4 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
6.2 Crosstalk
The crosstalk measurement configuration of a typical 50 NWA system for evaluation of the IP4359CX4 is shown in Figure 3. The crosstalk measurement results of IP4359CX4 are depicted in Figure 4.
IN_1
50
DUT
OUT_2 OUT_1
50 50
IN_2
50
TEST BOARD
Vgen 001aai756
Fig 3.
Crosstalk measurement configuration
0 ct (dB) -20
008aaa238
-40
-60
-80
-100
1
10
102
103 f (MHz)
104
Pin A1 to pin A2.
Fig 4.
Measured crosstalk between different channels
IP4359CX4
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
5 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
7. Package outline
WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)
D
bump A1 index area A2 E A
A1
detail X e b
B
e
A
1 European projection
2 X
wlcsp4_2x2_po
Fig 5. Table 5. Symbol A A1 A2 b D E e
Package outline IP4359CX4 (WLCSP4) Dimensions of IP4359CX4/LF for Figure 5 Min 0.57 0.18 0.39 0.21 0.71 0.71 Typ 0.61 0.20 0.41 0.26 0.76 0.76 0.4 Max 0.65 0.22 0.43 0.31 0.81 0.81 Unit mm mm mm mm mm mm mm
IP4359CX4
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
6 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
Dimensions of IP4359CX4/LF-H500 for Figure 5 Min 0.41 0.18 0.23 0.21 0.71 0.71 Typ 0.45 0.20 0.25 0.26 0.76 0.76 0.4 Max 0.49 0.22 0.27 0.31 0.81 0.81 Unit mm mm mm mm mm mm mm
Table 6. Symbol A A1 A2 b D E e
8. Design and assembly recommendations
8.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 7 for the recommended PCB design parameters.
Table 7. Parameter PCB pad diameter Micro-via diameter Solder mask aperture diameter Copper thickness Copper finish PCB material Recommended PCB design parameters Value or specification 250 m 100 m (0.004 inch) 325 m 20 m to 40 m AuNi or OSP FR4
8.2 PCB assembly guidelines for Pb-free soldering
Table 8. Parameter Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder / flux ratio Solder reflow profile Assembly recommendations Value or specification 290 m 100 m (0.004 inch) SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) 50 / 50 see Figure 6
IP4359CX4
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
7 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
T (C) Treflow(peak) 250 230 217 cooling rate
pre-heat
t1
t2 t3 t4 t5
t (s)
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 6. Table 9. Symbol
Pb-free solder reflow profile Characteristics Parameter peak reflow temperature time 1 time 2 time 3 time 4 time 5 rate of change of temperature cooling rate pre-heat soak time time during T 250 C time during T 230 C time during T > 217 C Conditions Min Typ Max Unit 230 60 10 30 2.5 260 180 30 50 150 540 -6 4.0 C s s s s s C/s C/s
Treflow(peak) t1 t2 t3 t4 t5 dT/dt
IP4359CX4
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
8 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
9. Abbreviations
Table 10. Acronym DUT DVI ESD FR4 HDMI IEC NSMD NWA OSP PCB RoHS USB WLCSP Abbreviations Description Device Under Test Digital Visual Interface ElectroStatic Discharge Flame Retard 4 High Definition Multimedia Interface International Electrotechnical Commission Non-Solder Mask Defined NetWork Analyzer Organic Solderability Preservative Printed-Circuit Board Restriction of Hazardous Substances Universal Serial Bus Wafer-Level Chip-Scale Package
10. Revision history
Table 11. Revision history Release date 20100806 Data sheet status Product data sheet Change notice Supersedes Document ID IP4359CX4 v.1
IP4359CX4
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
9 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
11. Legal information
11.1 Data sheet status
Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
(c) NXP B.V. 2010. All rights reserved.
11.3
Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
IP4359CX4
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 1 -- 6 August 2010
10 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4359CX4
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 6 August 2010
11 of 12
NXP Semiconductors
IP4359CX4
Dual channel low capacitance ESD protection
13. Contents
1 1.1 1.2 1.3 2 3 4 5 6 6.1 6.2 7 8 8.1 8.2 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Design and assembly recommendations . . . . 7 PCB design guidelines . . . . . . . . . . . . . . . . . . . 7 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 August 2010 Document identifier: IP4359CX4

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