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| EFA040A-100P UPDATED 11/17/2006 Low Distortion GaAs Power FET * * * * * * NON-HERMETIC 100MIL METAL FLANGE PACKAGE +23.0dBm TYPICAL OUTPUT POWER 9.0dB TYPICAL POWER GAIN AT 12GHz 0.3 X 400 MICRON RECESSED "MUSHROOM" GATE Si3N4 PASSIVATION ADVANCED EPITAXIAL HETEROJUNCTION PROFILE PROVIDES HIGH POWER EFFICIENCY, LINEARITY AND RELIABILITY G D ELECTRICAL CHARACTERISTICS (Ta = 25 OC) SYMBOLS P1dB G1dB PAE IDSS GM VP BVGD BVGS RTH PARAMETERS/TEST CONDITIONS Output Power at 1dB Compression f= 12GHz f= 18GHz VDS = 8V, IDS 50% IDSS Gain at 1dB Compression f= 12GHz f= 18GHz VDS = 8V, IDS 50% IDSS Power Added Efficiency at 1dB Compression f=12GHz VDS = 8V, IDS 50% IDSS Saturated Drain Current Transconductance Pinch-off Voltage Drain Breakdown Voltage Source Breakdown Voltage VDS = 3 V, VGS = 0 V VDS = 3 V, VGS = 0 V VDS = 3 V, IDS = 1.0 mA IGD = 1.0mA IGS = 1.0mA MIN 21.0 7.5 TYP 23.0 23.0 9.0 6.5 35 MAX UNIT dBm dB % 60 45 -13 -7 105 60 -2.0 -15 -14 115* 160 -3.5 mA mS V V V C/W Thermal Resistance (Au-Sn Eutectic Attach) Note: * Overall Rth depends on case mounting. MAXIMUM RATINGS AT 25OC SYMBOLS VDS VGS Igf Igr Pin Tch Tstg Pt PARAMETERS Drain-Source Voltage Gate-Source Voltage Forward Gate Current Reverse Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation ABSOLUTE1 12V -5V 1.8 mA 0.3 mA 20 dBm 175oC -65/175oC 1.2 W CONTINUOUS2 8V -4V 0.6 mA 0.1 mA @ 3dB Compression 175oC -65/175oC 1.2 W Note: 1. Exceeding any of the above ratings may result in permanent damage. 2. Exceeding any of the above ratings may reduce MTTF below design goals. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 page 1 of 2 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Revised November 2006 EFA040A-100P UPDATED 11/17/2006 Low Distortion GaAs Power FET DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 page 2 of 2 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Revised November 2006 |
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