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 M48Z512BV
3.3 V, 4 Mbit (512 K x 8 bit) ZEROPOWER(R) SRAM
Features

Integrated, ultra-low power SRAM, power-fail control circuit, and battery Conventional SRAM operation; unlimited WRITE cycles
32
10 years of data retention in the absence of power Automatic power-fail chip deselect and WRITE protection 3.0 to 3.6 V operation - 2.9 V power-fail deselect Pin and function compatible with JEDEC standard 512 K x 8 SRAMs PMDIP32 is an ECOPACK(R) package For 5 V applications, refer to the M48Z512A
1
PMDIP32 (PM) module
Description
The M48Z512BV ZEROPOWER(R) RAM is a nonvolatile, 4,194,304-bit static RAM organized as 524,288 words by 8 bits. The devices combine an internal lithium battery, a CMOS SRAM and a control circuit in a plastic, 32-pin DIP module.
August 2008
Rev 1
1/20
www.st.com 1
Contents
M48Z512BV
Contents
1 2 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 2.2 2.3 2.4 READ mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 WRITE mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 VCC noise and negative going transients . . . . . . . . . . . . . . . . . . . . . . . . . 12
3 4 5 6 7
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/20
M48Z512BV
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 READ mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 WRITE mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PMDIP32 - 32-pin plastic DIP module, package mechanical data. . . . . . . . . . . . . . . . . . . 17 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3/20
List of figures
M48Z512BV
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Chip enable or output enable controlled, READ mode AC waveforms. . . . . . . . . . . . . . . . . 8 Address controlled, READ mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 WRITE enable controlled, WRITE AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Chip enable controlled, WRITE AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Supply voltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PMDIP32 - 32-pin plastic DIP module, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4/20
M48Z512BV
Device overview
1
Device overview
Figure 1. Logic diagram
VCC
19 A0-A18
8 DQ0-DQ7
W E G
M48Z512BV
VSS
AI02043
Table 1.
Signal names
A0-A18 DQ0-DQ7 E G W VCC VSS Address inputs Data inputs/outputs Chip enable input Output enable input WRITE enable input Supply voltage Ground
5/20
Device overview Figure 2. DIP connections
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS 1 2 3 4 5 6 7 8 M48Z512BV 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A15 A17 W A13 A8 A9 A11 G A10 E DQ7 DQ6 DQ5 DQ4 DQ3
M48Z512BV
AI02044
Figure 3.
Block diagram
VCC
A0-A18
POWER E VOLTAGE SENSE AND SWITCHING CIRCUITRY
512K x 8 SRAM ARRAY
DQ0-DQ7
E W G
INTERNAL BATTERY
VSS
AI02045
6/20
M48Z512BV
Operating modes
2
Operating modes
The M48Z512BV also has its own power-fail detect circuit. The control circuitry constantly monitors the single VCC supply for an out of tolerance condition. When VCC is out of tolerance, the circuit WRITE protects the SRAM, providing a high degree of data security in the midst of unpredictable system operation brought on by low VCC. As VCC falls below the switchover voltage (VSO), the control circuitry connects the battery which maintains data until valid power returns. The ZEROPOWER(R) RAM replaces industry standard SRAMs. It provides the nonvolatility of PROMs without any requirement for special WRITE timing or limitations on the number of WRITEs that can be performed. Table 2.
Mode Deselect WRITE 3.0 to 3.6 V READ READ Deselect Deselect VSO to VPFD (min)(2)
Operating modes(1)
VCC E VIH VIL VIL VIL X X VSO(2) G X X VIL VIH X X W X VIL VIH VIH X X DQ0-DQ7 High Z DIN DOUT High Z High Z High Z Power Standby Active Active Active CMOS standby Battery backup mode
1. See Table 10 on page 16 for details. 2. X = VIH or VIL; VSO = battery backup switchover voltage.
2.1
READ mode
The M48Z512BV is in the READ mode whenever W (WRITE enable) is high and E (chip enable) is low. The device architecture allows ripple-through access of data from eight of 4,194,304 locations in the static storage array. Thus, the unique address specified by the 19 address inputs defines which one of the 524,288 bytes of data is to be accessed. Valid data will be available at the data I/O pins within address access time (tAVQV) after the last address input signal is stable, providing that the E (chip enable) and G (output enable) access times are also satisfied. If the E and G access times are not met, valid data will be available after the later of chip enable access time (tELQV) or output enable access time (tGLQV). The state of the eight three-state data I/O signals is controlled by E and G. If the outputs are activated before tAVQV, the data lines will be driven to an indeterminate state until tAVQV. If the address inputs are changed while E and G remain low, output data will remain valid for output data hold time (tAXQX) but will go indeterminate until the next address access.
7/20
Operating modes Figure 4.
M48Z512BV Chip enable or output enable controlled, READ mode AC waveforms
tAVAV
A0-A18 tAVQV tELQV E tELQX tGLQV G tGLQX DQ0-DQ7
VALID tAXQX tEHQZ
tGHQZ
DATA OUT
AI01221
1. WRITE enable (W) = high.
Figure 5.
Address controlled, READ mode AC waveforms
A0-A18 tAVAV tAVQV DQ0-DQ7 DATA VALID
AI01220
tAXQX
1. Chip enable (E) and output enable (G) = low, WRITE enable (W) = high.
8/20
M48Z512BV Table 3.
Symbol tAVAV tAVQV tELQV tGLQV tELQX
(2)
Operating modes READ mode AC characteristics
Parameter(1) READ cycle time Address valid to output valid Chip enable low to output valid Output enable low to output valid Chip enable low to output transition Output enable low to output transition Chip enable high to output Hi-Z Output enable high to output Hi-Z Address transition to output transition 5 5 5 35 25 Min 85 85 85 45 Max Unit ns ns ns ns ns ns ns ns ns
tGLQX(2) tEHQZ(2) tGHQZ(2) tAXQX
2. CL = 5 pF.
1. Valid for ambient operating temperature: TA = 0 to 70C; VCC = 3.0 to 3.6 V (except where noted).
2.2
WRITE mode
The M48Z512BV is in the WRITE mode whenever W and E are active. The start of a WRITE is referenced from the latter occurring falling edge of W or E. A WRITE is terminated by the earlier rising edge of W or E. The addresses must be held valid throughout the cycle. E or W must return high for a minimum of tEHAX from E or tWHAX from W prior to the initiation of another READ or WRITE cycle. Data-in must be valid tDVEH or tDVWH prior to the end of WRITE and remain valid for tEHDX or tWHDX afterward. G should be kept high during WRITE cycles to avoid bus contention; although, if the output bus has been activated by a low on E and G, a low on W will disable the outputs tWLQZ after W falls.
9/20
Operating modes Figure 6. WRITE enable controlled, WRITE AC waveforms
tAVAV A0-A18 VALID tAVWH tAVEL E tWLWH tAVWL W tWLQZ tWHDX DQ0-DQ7 DATA INPUT tDVWH
M48Z512BV
tWHAX
tWHQX
AI01222
1. Output enable (G) = high.
Figure 7.
Chip enable controlled, WRITE AC waveforms
tAVAV
A0-A18
VALID tAVEH tAVEL tELEH tEHAX
E tAVWL W tEHDX DQ0-DQ7 DATA INPUT tDVEH
AI01223
1. Output enable (G) = high.
10/20
M48Z512BV Table 4.
Symbol tAVAV tAVWL tAVEL tWLWH tELEH tWHAX tEHAX tDVWH tDVEH tWHDX tEHDX tWLQZ(2)(3) tAVWH tAVEH tWHQX(2)(3)
2. CL = 5 pF.
Operating modes WRITE mode AC characteristics
Parameter(1) WRITE cycle time Address valid to WRITE enable low Address valid to chip enable low WRITE enable pulse width Chip enable low to chip enable high WRITE enable high to address transition Chip enable high to address transition Input valid to WRITE enable high Input valid to chip enable high WRITE enable high to input transition Chip enable high to input transition WRITE enable low to output Hi-Z Address valid to WRITE enable high Address valid to chip enable high WRITE enable high to output transition 75 75 5 Min 85 0 0 65 75 5 15 35 35 0 10 30 Max Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1. Valid for ambient operating temperature: TA = 0 to 70C; VCC = 3.0 to 3.6 V (except where noted). 3. If E goes low simultaneously with W going low, the outputs remain in the high impedance state.
2.3
Data retention mode
With valid VCC applied, the M48Z512BV operates as a conventional BYTEWIDETM static RAM. Should the supply voltage decay, the RAM will automatically power-fail deselect, WRITE protecting itself tWP after VCC falls below VPFD. All outputs become high impedance, and all inputs are treated as "don't care." If power fail detection occurs during a valid access, the memory cycle continues to completion. If the memory cycle fails to terminate within the time tWP, WRITE protection takes place. When VCC drops below VSO, the control circuit switches power to the internal energy source which preserves data. The internal coin cell will maintain data in the M48Z512BV after the initial application of VCC for an accumulated period of at least 10 years when VCC is less than VSO. As system power returns and VCC rises above VSO, the battery is disconnected, and the power supply is switched to external VCC. WRITE protection continues for tER after VCC reaches VPFD to allow for processor stabilization. After tER, normal RAM operation can resume. For more information on battery storage life refer to the application note AN1012.
11/20
Operating modes
M48Z512BV
2.4
VCC noise and negative going transients
ICC transients, including those produced by output switching, can produce voltage fluctuations, resulting in spikes on the VCC bus. These transients can be reduced if capacitors are used to store energy which stabilizes the VCC bus. The energy stored in the bypass capacitors will be released as low going spikes are generated or energy will be absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1 F (see Figure 8) is recommended in order to provide the needed filtering. In addition to transients that are caused by normal SRAM operation, power cycling can generate negative voltage spikes on VCC that drive it to values below VSS by as much as one volt. These negative spikes can cause data corruption in the SRAM while in battery backup mode. To protect from these voltage spikes, ST recommends connecting a schottky diode from VCC to VSS (cathode connected to VCC, anode to VSS). (Schottky diode 1N5817 is recommended for through hole and MBRS120T3 is recommended for surface-mount). Figure 8. Supply voltage protection
VCC VCC
0.1F
DEVICE
VSS
AI02169
12/20
M48Z512BV
Maximum ratings
3
Maximum ratings
Stressing the device above the rating listed in the "Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 5.
Symbol TA TSTG TBIAS TSLD
(1)
Absolute maximum ratings
Parameter Ambient operating temperature Storage temperature (VCC off) Temperature under bias Lead solder temperature for 10 seconds Input or output voltages Supply voltage Output current Power dissipation Value 0 to 70 -40 to 85 0 to 70 260 -0.3 to 4.6 -0.3 to 4.6 20 1 Unit C C C C V V mA W
VIO VCC IO PD
1. For DIP package: soldering temperature not to exceed 260C for 10 seconds (total thermal budget not to exceed 150C for longer than 30 seconds). No preheating above 150C, or direct exposure to IR reflow (or IR preheat) allowed, to avoid damaging the Lithium battery.
Caution:
Negative undershoots below -0.3 V are not allowed on any pin while in the battery backup mode.
13/20
DC and AC parameters
M48Z512BV
4
DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the dc and ac characteristics of the device. The parameters in the following dc and ac characteristic tables are derived from tests performed under the measurement conditions listed in the relevant tables. Designers should check that the operating conditions in their projects match the measurement conditions when using the quoted parameters. Table 6. Operating and AC measurement conditions(1)
Parameter Supply voltage (VCC) Ambient operating temperature (TA) Load capacitance (CL) Input rise and fall times Input pulse voltages Input and output timing ref. voltages
1. Output Hi-Z is defined as the point where data is no longer driven.
Value 3.0 to 3.6 0 to 70 50 5 0 to 3 1.5
Unit V C pF ns V V
Figure 9.
AC measurement load circuit
DEVICE UNDER TEST
CL = 50 pF
1.75 V
CL includes JIG capacitance
AI03903
Table 7.
Symbol CIN CIO(3)
Capacitance
Parameter(1)(2) Input capacitance Input/output capacitance Min Max 10 10 Unit pF pF
1. Effective capacitance measured with power supply at 3.3 V; sampled only, not 100% tested. 2. Outputs deselected. 3. At 25C.
14/20
M48Z512BV Table 8.
Sym ILI(2) ILO
(2)
DC and AC parameters DC characteristics
Parameter Input leakage current Output leakage current Supply current Supply current (standby) TTL Supply current (standby) CMOS Input low voltage Input high voltage Output low voltage Output high voltage IOL = 2.1mA IOH = -1mA 2.2 Test condition(1) 0V VIN VCC 0V VOUT VCC E = VIL outputs open E = VIH E VCC - 0.2V -0.3 2.2 Min Max 1 1 50 4 3 0.6 VCC + 0.3 0.4 Unit A A mA mA mA V V V V
ICC ICC1 ICC2 VIL VIH VOL VOH
1. Valid for ambient operating temperature: TA = 0 to 70C; VCC = 3.0 to 3.6 V (except where noted). 2. Outputs deselected.
15/20
DC and AC parameters Table 9.
Symbol tF tR tWP tER
M48Z512BV Power down/up AC characteristics
Parameter(1) Min 150 150 25 70 140 Typ Max Unit s s s ms
VCC fall time, VPFD to VSS VCC rise time, VSS to VPFD WRITE protect time E recovery time
1. Valid for ambient operating temperature: TA = 0 to 70C; VCC = 3.0 to 3.6 V (except where noted).
Table 10.
Symbol VPFD VSO tDR
(3)
Power down/up trip points DC characteristics
Parameter(1)(2) Power-fail deselect voltage Battery backup switchover voltage Expected data retention time 10 Min 2.8 Typ 2.9 2.4 Max 3.0 Unit V V Years
1. All voltages referenced to VSS. 2. Valid for ambient operating temperature: TA = 0 to 70C; VCC = 3.0 to 3.6 V (except where noted). 3. At 25C, VCC = 0 V.
Figure 10. Power down/up mode AC waveforms
tF tR
VCC VPFD VSO VSS tWP INPUTS
RECOGNIZED
tDR tER DON'T CARE HIGH-Z
RECOGNIZED
(Including E)
OUTPUTS
VALID
VALID
AI02385
16/20
M48Z512BV
Package mechanical data
5
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 11. PMDIP32 - 32-pin plastic DIP module, package outline
A
A1 S B e3 D e1
L eA
C
N
E
1 PMDIP
1. Drawing is not to scale.
Table 11.
Symb
PMDIP32 - 32-pin plastic DIP module, package mechanical data
mm Typ Min 9.27 0.38 0.43 0.20 42.42 18.03 2.29 38.10 14.99 3.05 1.91 32 16.00 3.81 2.79 0.59 0.33 43.18 18.80 2.79 1.50 0.590 0.120 0.075 32 0.630 0.150 0.110 Max 9.52 Typ inches Min 0.365 0.015 0.017 0.008 1.670 0.710 0.090 0.023 0.013 1.700 0.740 0.110 Max 0.375
A A1 B C D E e1 e3 eA L S N
17/20
Part numbering
M48Z512BV
6
Part numbering
Table 12.
Example:
Ordering information scheme
M48Z 512BV -85 PM 1
Device type M48Z
Supply voltage and WRITE protect voltage 512BV: VCC = 3.0 to 3.6 V; VPFD = 2.8 to 3.0 V Speed -85 = 85 ns
Package PM = PMDIP32
Temperature range 1 = 0 to 70C
Shipping method blank = ECOPACK(R) package, tubes
For other options, or for more information on any aspect of this device, please contact the ST sales office nearest you.
18/20
M48Z512BV
Revision history
7
Revision history
Table 13.
Date 15-Aug-2008
Document revision history
Revision 1 Initial release Changes
19/20
M48Z512BV
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