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CMT06N60 POWER FIELD EFFECT TRANSISTOR GENERAL DESCRIPTION This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in avalanche and commutation modes. The new energy efficient design also offers a drain-to-source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional and safety margin against unexpected voltage transients. FEATURES Robust High Voltage Termination Avalanche Energy Specified Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode Diode is Characterized for Use in Bridge Circuits IDSS Specified at Elevated Temperature PIN CONFIGURATION TO-220/TO-220FP SYMBOL D Front View GATE SOURCE DRAIN G 1 2 3 S N-Channel MOSFET 2006/10/11 Rev. 1.2 Champion Microelectronic Corporation Page 1 CMT06N60 POWER FIELD EFFECT TRANSISTOR ABSOLUTE MAXIMUM RATINGS Rating Drain to Current Continuous Pulsed Gate-to-Source Voltage Continue Non-repetitive Total Power Dissipation TO-220 TO-220FP Operating and Storage Temperature Range Single Pulse Drain-to-Source Avalanche Energy TJ = 25 (VDD = 100V, VGS = 10V, IL = 6A, L = 10mH, RG = 25) Thermal Resistance Junction to Case Junction to Ambient Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds (1) VDD = 50V, ID = 6A (2) Pulse Width and frequency is limited by TJ(max) and thermal response EAS JC JA TL 180 1.0 62.5 260 /W TJ, TSTG Symbol ID IDM VGS VGSM PD 125 45 -55 to 150 mJ Value 6.0 18 20 40 V V W Unit A ORDERING INFORMATION Part Number CMT06N60N220 CMT06N60N220FP Package TO-220 TO-220FP TEST CIRCUIT Test Circuit - Avalanche Capability 2006/10/11 Rev. 1.2 Champion Microelectronic Corporation Page 2 CMT06N60 POWER FIELD EFFECT TRANSISTOR ELECTRICAL CHARACTERISTICS Unless otherwise specified, TJ = 25. CMT06N60 Characteristic Drain-Source Breakdown Voltage (VGS = 0 V, ID = 250 A) Drain-Source Leakage Current (VDS = 600 V, VGS = 0 V) (VDS = 480 V, VGS = 0 V, TJ = 125) Gate-Source Leakage Current-Forward (Vgsf = 20 V, VDS = 0 V) Gate-Source Leakage Current-Reverse (Vgsr = 20 V, VDS = 0 V) Gate Threshold Voltage (VDS = VGS, ID = 250 A) Static Drain-Source On-Resistance (VGS = 10 V, ID = 3.5A) * Forward Transconductance (VDS = 15 V, ID = 3.0A) * Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Internal Drain Inductance (Measured from the drain lead 0.25" from package to center of die) Internal Drain Inductance (Measured from the source lead 0.25" from package to source bond pad) SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage(1) Forward Turn-On Time Reverse Recovery Time (IS = 6.0 A, dIS/dt = 100A/s) VSD ton trr 0.83 ** 266 1.2 V ns ns LS 7.5 nH (VDS = 25 V, VGS = 0 V, f = 1.0 MHz) (VDD = 300 V, ID = 6.0 A, VGS = 10 V, RG = 9.1) * (VDS = 300 V, ID = 6.0 A, VGS = 10 V)* RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd LD 3.4 1498 158 29 14 19 40 26 35.5 8.1 14.1 4.5 2100 220 60 30 40 80 55 50 1.2 mhos pF pF pF ns ns ns ns nC nC nC nH VGS(th) 2.0 4.0 V IGSSR 100 nA IGSSF IDSS 100 50 100 nA A Symbol V(BR)DSS Min 600 Typ Max Units V * Pulse Test: Pulse Width 300s, Duty Cycle 2% ** Negligible, Dominated by circuit inductance 2006/10/11 Rev. 1.2 Champion Microelectronic Corporation Page 3 CMT06N60 POWER FIELD EFFECT TRANSISTOR TYPICAL ELECTRICAL CHARACTERISTICS 2006/10/11 Rev. 1.2 Champion Microelectronic Corporation Page 4 CMT06N60 POWER FIELD EFFECT TRANSISTOR PACKAGE DIMENSION TO-220 D A c1 F E PIN 1: GATE PIN 2: DRAIN PIN 3: SOURCE E1 A A1 L1 b b1 c c1 D L E E1 e e1 F L b1 e1 e b A1 c Side View L1 Front View TO-220FP 0 0.1 C R J D Q H R1 .5 0 R1 .5 0 B I 8 3.1 A B A C D E E P K O G H I J K M N O P Q R 60 1. G b R b b1 b2 e b1 e Front View b2 R N M Side View Back View 2006/10/11 Rev. 1.2 Champion Microelectronic Corporation Page 5 CMT06N60 POWER FIELD EFFECT TRANSISTOR IMPORTANT NOTICE Champion Microelectronic Corporation (CMC) reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. CMC integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. customer should provide adequate design and operating safeguards. Use of CMC products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer's applications, the HsinChu Headquarter 5F, No. 11, Park Avenue II, Science-Based Industrial Park, HsinChu City, Taiwan T E L : +886-3-567 9979 F A X : +886-3-567 9909 Sales & Marketing 7F-6, No.32, Sec. 1, Chenggong Rd., Nangang District, Taipei City 115, Taiwan T E L : +886-2-2788 0558 F A X : +886-2-2788 2985 2006/10/11 Rev. 1.2 Champion Microelectronic Corporation Page 6 |
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