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APTGT300A170D3G Phase leg Trench + Field Stop IGBT Power Module 3 VCES = 1700V IC = 300A @ Tc = 80C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control Features * Trench + Field Stop IGBT Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated * Kelvin emitter for easy drive * High level of integration * M6 power connectors Benefits * Stable temperature behavior * Very rugged * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Easy paralleling due to positive TC of VCEsat * RoHS Compliant Q1 4 5 Q2 6 7 1 2 Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C Max ratings 1700 400 300 600 20 1470 600A@1650V Unit V September, 2008 1-5 APTGT300A170D3G - Rev 1 A V W These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGT300A170D3G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(on) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter on Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 1700V Tj = 25C VGE = 15V IC = 300A Tj = 125C VGE = VCE , IC = 12 mA VGE = 20V, VCE = 0V Min Typ 2.0 2.4 5.8 Max 3 2.5 6.4 400 Unit mA V V nA 5.2 Dynamic Characteristics Symbol Characteristic Cies Input Capacitance Cres Reverse Transfer Capacitance QG Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Isc Gate charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn On Energy Turn Off Energy Short Circuit data Test Conditions VGE = 0V, VCE = 25V f = 1MHz VGE=15V, IC=300A VCE=900V Inductive Switching (25C) VGE = 15V VBus = 900V IC = 300A RG = 4.7 Inductive Switching (125C) VGE = 15V VBus = 900V IC = 300A RG = 4.7 VGE = 15V Tj = 25C VBus = 900V Tj = 125C IC = 300A Tj = 25C RG = 4.7 Tj = 125C VGE 15V ; VBus = 1000V tp 10s ; Tj = 125C Min Typ 27 0.9 3.5 280 80 850 120 300 100 1000 200 71 105 64 94 1200 Max Unit nF C ns ns mJ A Reverse diode ratings and characteristics Symbol Characteristic VRRM IRRM IF VF trr Qrr Err Maximum Peak Repetitive Reverse Voltage Test Conditions Tj = 25C Tj = 125C Tc = 80C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Min 1700 Typ Max 750 1000 Unit V A A Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy VR=1700V IF = 300A IF = 300A VR = 900V mJ www.microsemi.com 2-5 APTGT300A170D3G - Rev 1 di/dt =3500A/s 490 76 124 35 70 ns C September, 2008 300 1.8 1.9 385 2.2 V APTGT300A170D3G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight For terminals To Heatsink M6 M6 IGBT Diode 3500 -40 -40 -40 3 3 Min Typ Max 0.085 0.13 150 125 125 5 5 350 Unit C/W RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz V C N.m g D3 Package outline (dimensions in mm) 1 A DETAIL A www.microsemi.com 3-5 APTGT300A170D3G - Rev 1 September, 2008 APTGT300A170D3G Typical Performance Curve Output Characteristics (VGE=15V) Output Characteristics 600 500 400 IC (A) TJ = 125C VGE=20V 600 TJ=25C 450 TJ=125C IC (A) 300 300 200 VGE=13V VGE=15V 150 100 VGE=9V 0 0 0.5 1 1.5 2 2.5 VCE (V) 3 3.5 4 0 0 1 2 3 VCE (V) 4 5 600 500 Transfert Characteristics TJ=25C Energy losses vs Collector Current 300 225 VCE = 900V VGE = 15V RG = 4.7 TJ = 125C Eon Eoff 400 300 200 100 0 5 6 7 8 VGE (V) Switching Energy Losses vs Gate Resistance 400 VCE = 900V VGE =15V IC = 300A TJ = 125C Eon TJ=125C E (mJ) IC (A) 150 75 0 TJ=125C Err 9 10 11 0 100 200 300 IC (A) 400 500 600 Reverse Bias Safe Operating Area 700 600 500 IC (A) 400 300 200 100 0 0 VGE=15V TJ=125C RG=4.7 300 E (mJ) 200 Eoff 100 Err 0 0 5 10 15 20 25 30 Gate Resistance (ohms) 35 400 800 1200 1600 2000 VCE (V) 0.09 Thermal Impedance (C/W) 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 0.00001 0.05 0.3 0.1 0.9 0.7 0.5 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration IGBT Single Pulse 0.0001 0.001 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) www.microsemi.com 4-5 APTGT300A170D3G - Rev 1 September, 2008 APTGT300A170D3G Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 20 ZVS VCE=900V D=50% RG=4.7 TJ=125C TC=75C Forward Characteristic of diode 600 500 400 IF (A) 300 200 TJ=125C TJ=25C 15 ZCS 10 5 hard switching 100 0 TJ=125C 0 0 100 200 IC (A) 300 400 0 0.5 1 1.5 VF (V) 2 2.5 3 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.14 Thermal Impedance (C/W) 0.12 0.1 0.08 0.06 0.04 0.02 0.3 0.1 0.05 Single Pulse 0.9 0.7 0.5 Diode 0 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5-5 APTGT300A170D3G - Rev 1 September, 2008 |
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