Part Number Hot Search : 
2SK2553S 21002 16200 9N50C C2506 KF426BS MM1027 1N2258
Product Description
Full Text Search
 

To Download PUMX2 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 PUMX2
NPN/NPN general-purpose double transistors
Rev. 02 -- 17 November 2009 Product data sheet
1. Product profile
1.1 General description
NPN/NPN general-purpose double transistors in a small SOT363 (SC-88) Surface Mounted Device (SMD) plastic package.
1.2 Features
Simplifies circuit design Reduces component count Reduces pick and place costs
1.3 Applications
General-purpose switching and amplification
1.4 Quick reference data
Table 1. Symbol VCEO IC hFE Quick reference data Parameter collector-emitter voltage collector current DC current gain VCE = 6 V; IC = 1 mA Conditions open base Min 120 Typ 250 Max 50 150 560 Unit V mA
Per transistor
2. Pinning information
Table 2. Pin 1 2 3 4 5 6 Pinning Description emitter TR1 emitter TR2 base TR2 collector TR2 base TR1 collector TR1
1 2 3 1 2 3
006aaa653
Simplified outline
6 5 4
Symbol
6 TR1 5 4 TR2
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
3. Ordering information
Table 3. Ordering information Package Name PUMX2 SC-88 Description plastic surface mounted package; 6 leads Version SOT363 Type number
4. Marking
Table 4. PUMX2
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
Marking codes Marking code[1] Z1*
Type number
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Per device Ptot Tstg Tj Tamb
[1]
Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation total power dissipation storage temperature junction temperature ambient temperature
Conditions open emitter open base open collector single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C Tamb 25 C
[1]
Min -65 -65
Max 60 50 7 150 200 100 180 300 +150 150 +150
Unit V V V mA mA mA mW mW C C C
Per transistor
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
PUMX2_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 17 November 2009
2 of 8
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Per device Rth(j-a)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to ambient Conditions in free air
[1]
Min -
Typ -
Max 694
Unit K/W
Per transistor
in free air
[1]
-
-
417
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current DC current gain Conditions VCB = 60 V; IE = 0 A VCB = 60 V; IE = 0 A; Tj = 150 C VEB = 7 V; IC = 0 A VCE = 6 V; IC = 1 mA Min 120 100 Typ 250 Max 100 50 100 560 250 3 mV MHz pF Unit nA A nA Per transistor
IEBO hFE VCEsat fT Cc
collector-emitter IC = 50 mA; IB = 5 mA saturation voltage transition frequency collector capacitance VCE = 12 V; IE = 2 mA; f = 100 MHz VCB = 12 V; IE = ie = 0 A; f = 1 MHz
PUMX2_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 17 November 2009
3 of 8
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
8. Package outline
2.2 1.8 6 5 4 0.45 0.15 1.1 0.8
2.2 1.35 2.0 1.15
pin 1 index
1 0.65 1.3 Dimensions in mm
2
3 0.3 0.2 0.25 0.10 06-03-16
Fig 1.
Package outline SOT363 (SC-88)
9. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PUMX2 Package SOT363 Description 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2
[1] [2] [3]
[2] [3]
Packing quantity 3000 -115 -125 10000 -135 -165
For further information and the availability of packing methods, see Section 13. T1: normal taping T2: reverse taping
PUMX2_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 17 November 2009
4 of 8
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
10. Soldering
2.65
solder lands 2.35 1.5 0.6 0.5 (4x) (4x) 0.4 (2x) solder resist solder paste 0.5 (4x) 0.6 (4x) 1.8 0.6 (2x) occupied area Dimensions in mm
sot363_fr
Fig 2.
Reflow soldering footprint SOT363 (SC-88)
1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering
1.3 2.45 5.3
1.3
sot363_fw
Fig 3.
Wave soldering footprint SOT363 (SC-88)
PUMX2_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 17 November 2009
5 of 8
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
11. Revision history
Table 9. PUMX2_2 Modifications: Revision history Release date 20091117 Data sheet status Product data sheet Change notice Supersedes PUMX2_1 Document ID
* * * *
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Figure 1 "Package outline SOT363 (SC-88)": updated Figure 2 "Reflow soldering footprint SOT363 (SC-88)": updated Figure 3 "Wave soldering footprint SOT363 (SC-88)": updated Product data sheet -
PUMX2_1
20051110
PUMX2_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 17 November 2009
6 of 8
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PUMX2_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 17 November 2009
7 of 8
NXP Semiconductors
PUMX2
NPN/NPN general-purpose double transistors
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 3 3 4 4 5 6 7 7 7 7 7 7 8
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 November 2009 Document identifier: PUMX2_2


▲Up To Search▲   

 
Price & Availability of PUMX2

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X