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1.6 x 0.8 x 0.4mm SMD OSXX0603C1A Dimension
Recommended Solder Pad Top
Features
Outline
Single chip Super high brightness of surface mount LED Sorting for Iv and Vf @ 5mA of If Compact package outline (LxWxT) of 1.6mm x 0.8mm x 0.4mm

Side
WT/BL/YG/YL/OR/HR Anode Cathode
Compatible to IR reflow soldering.
Bottom
TG
Applications
Backlighting (switches, keys, etc.) Marker lights (e.g. steps, exit ways, etc.)
Anode
Cathode
Absolute
Maximum Rating
Symbo l
IF IFP VR PD Topr Tstg Tsol
Directivity
Item
DC Forward Current Pulse Forward Current* Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature
Value WT/BL/TG
YG/YL/OR/HR
Unit
mA mA V mW
30 100
5 100 -40 ~ +85 -40~ +85 260 /5sec
30 100
5 70
*Pulse width Max 0.1ms, Duty ratio max 1/10
Electrical -Optical Characteristics
VF (V) IR(A) Max. Max. VR=5V 100 100 10* 100 100 100 100 Min. 37 Iv(mcd) Typ. 74 23 103 11 40 35 35 Max. 110 37 145 16 71 60 60 Min. IF=5mA X=0.27, Y=0.28 465 520 565 586 600 620 470 525 570 590 605 625 475 530 575 592 610 630 120 120 120 120 120 120 120 D(nm) Typ. Max.
21/2(deg)
Part Number
OSWT0603C1A OSBL0603C1A OSTG0603C1A OSYL0603C1A OSOR0603C1A OSHR0603C1A
Color
White Blue True Green Yellow Orange Red WT BL TG YL OR HR
Min.
Typ. IF=5mA
Typ.
2.7 2.6
2.6
1.7
2.9 2.9
2.9
3.2 3.2
3.1
9
60
OSYG0603C1A Yellow green YG
1.9 1.9 1.9 1.9
2.2 2.2 2.2 2.2
6 27
18 18
1.7 1.7 1.7
Note: * Vf tolerance: 0.05V
*True Green VR=4V
* Dominant wavelength tolerance: 1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:10%
LED & Application Technologies
http://www.optosupply.com VER A.0
1.6 x 0.8 x 0.4mm SMD OSXX0603C1A Optical and electrical characteristics
TYPICAL ELECTRICAL/OPTICAL CHARACTERISTIC CURVES
YG YL
BL
WT O R /H R TG
WT OR/HR
YL BL
YG
TG
WT
OR HR BL TG YG YL
LED & Application Technologies
http://www.optosupply.com
VER A.0
1.6 x 0.8 x 0.4mm SMD OSXX0603C1A
Recommended
Soldering Temperature - Time Profile (Reflow Soldering)
Surface Mounting Condition
In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices.
Soldering Reflow
-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method.
LED & Application Technologies
http://www.optosupply.com
VER A.0
1.6 x 0.8 x 0.4mm SMD OSXX0603C1A
3) Manual Soldering conditions.
- Lead Solder Max. 300 for Max. 3sec, and only one time. - Lead-free Solder Max. 350 for Max. 3sec, and only one time. - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method. - After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times.
LED & Application Technologies
http://www.optosupply.com
VER A.0
1.6 x 0.8 x 0.4mm SMD OSXX0603C1A
Material
True green
White/ Blue/ Yellow green/ Yellow/ Orange/ Red
LED & Application Technologies
http://www.optosupply.com
VER A.0
1.6 x 0.8 x 0.4mm SMD OSXX0603C1A
Taping
and Orientation.
Quantity: 4,000 units/reel Diameter: 178 mm General Tolerance : 0.1
Cautions:
1. After open the package, the LED should be kept at 30 C, 30%RH or less. The LED should be soldered within 24 hours (1 day) after opening the package. 2. Heat generation must be taken into design consideration when using the LED. 3. Power must be applied resistors for protection, over current would be caused the optic damage to the devices and wavelength shift. 4. Manual tip solder may cause the damage to Chip devices, so advised that heat of iron should be lower than 15W with temperature control under 5 seconds at 230-260 deg. C. ( The device would be got damage in re working process, recommended under 5 seconds at 230-260 deg. C) 5. All equipment and machinery must be properly grounded. It is recommended to use a wristband or anti-electrostatic glove when handing the LED. 6. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package and the epoxy, Ultrasonic cleaning should not be done. 7. Damaged LED will show unusual characteristics such as leak current remarkably increase, turn-on voltage becomes lower and the LED get unlight at low current.
LED & Application Technologies
http://www.optosupply.com
VER A.0
1.6 x 0.8 x 0.4mm SMD OSXX0603C1A
Reliability
Test :
Conclusions: The reliability tests were designed to evaluate both package integrity as well as workability of product performance over time. All samples have done well by completed test requirement and passed all the qualification criteria with zero failure. From design standpoint, the package is robust enough to meet its datasheet conditions. Based on the good result shows on the above test, this product is qualified and released for market.
LED & Application Technologies
http://www.optosupply.com
VER A.0

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