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| IPG20N06S2L-35 OptiMOS(R) Power-Transistor Product Summary V DS R DS(on),max4) ID 55 35 20 V m A Features * Dual N-channel Logic Level - Enhancement mode * AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green Product (RoHS compliant) * 100% Avalanche tested PG-TDSON-8-4 Type IPG20N06S2L-35 Package PG-TDSON-8-4 Marking 2N06L35 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current one channel active2) Symbol ID Conditions T C=25 C, V GS=10 V1) Value Unit A 20 T C=100 C, V GS=10 V Pulsed drain current2) one channel active Avalanche energy, single pulse2, 4) Avalanche current, single pulse4) Gate source voltage Power dissipation one channel active Operating and storage temperature IEC climatic category; DIN IEC 68-1 20 I D,pulse E AS I AS V GS P tot T j, T stg - I D=10A T C=25 C - 80 100 15 20 65 -55 ... +175 55/175/56 mJ A V W C Rev. 1.0 page 1 2009-09-07 IPG20N06S2L-35 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics2) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area3) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current4) V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=27 A V DS=55 V, V GS=0 V, T j=25 C V DS=55 V, V GS=0 V, T j=125 C2) Gate-source leakage current4) Drain-source on-state resistance4) I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=10A V GS=10 V, I D=15A 55 1.2 1.6 0.01 2.0 1 A V 100 60 2.3 K/W - 1 1 35 28 100 100 44 35 nA m Rev. 1.0 page 2 2009-09-07 IPG20N06S2L-35 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics2) Input capacitance4) Output capacitance4) Reverse transfer capacitance4) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2, 4) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) one channel active Diode pulse current one channel active 2) C iss C oss Crss t d(on) tr t d(off) tf V DD=27.5 V, V GS=10 V, I D=20 A, R G=11 V GS=0 V, V DS=25 V, f =1 MHz - 610 180 65 3 5 25 15 790 230 100 - pF ns Q gs Q gd Qg V plateau V DD=44 V, I D=20 A, V GS=0 to 10 V - 2 6.5 18 3.5 2.6 10 23 - nC V IS T C=25 C I S,pulse V GS=0 V, I F=15 A, T j=25 C V R=27.5 V, I F=I S, di F/dt =100 A/s - - 20 A - - 80 Diode forward voltage V SD - 1.0 1.3 V Reverse recovery time2) t rr - 40 - ns Reverse recovery charge2, 4) 1) Q rr - 40 - nC Current is limited by bondwire; with an R thJC =2.3 K/W the chip is able to carry 30.4A at 25C. Specified by design. Not subject to production test. 2) 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 4) Per channel Rev. 1.0 page 3 2009-09-07 IPG20N06S2L-35 1 Power dissipation P tot = f(T C); V GS 6 V; one channel active 2 Drain current I D = f(T C); V GS 6 V; one channel active 70 25 60 20 50 15 P tot [W] 40 30 I D [A] 10 5 0 0 50 100 150 200 0 50 100 150 200 20 10 0 T C [C] T C [C] 3 Safe operating area I D=f(V DS); T C=25C; D =0; one channel active parameter: t p 100 1 s 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 10 s 100 s 100 0.5 10 Z thJC [K/W] I D [A] 0.1 0.05 1 ms 10-1 0.01 single pulse 1 1 10 100 10-2 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.0 page 4 2009-09-07 IPG20N06S2L-35 5 Typ. output characteristics4) I D = f(V DS); T j = 25 C parameter: V GS 80 10 V 5V 6 Typ. drain-source on-state resistance4) R DS(on) = f(I D); T j = 25 C parameter: V GS 100 3V 3.5 V 4V 4.5 V 60 4.5 V 80 40 4V R DS(on) [m] I D [A] 60 20 3.5 V 40 5V 3V 10 V 0 0 1 2 3 4 5 20 0 20 40 60 80 V DS [V] I D [A] 7 Typ. transfer characteristics4) I D = f(V GS); V DS = 6V parameter: T j 80 -55 C 25 C 8 Typ. drain-source on-state resistance4) R DS(on) = f(T j); I D = 15 A; V GS = 10 V 60 60 175 C 50 R DS(on) [m] 1 2 3 4 5 6 40 I D [A] 40 30 20 20 0 10 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.0 page 5 2009-09-07 IPG20N06S2L-35 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 2.5 10 Typ. Capacitances4) C = f(V DS); V GS = 0 V; f = 1 MHz 104 2 103 Ciss 270A V GS(th) [V] 1.5 27A C [pF] 1 102 Coss Crss 0.5 0 -60 -20 20 60 100 140 180 101 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis4) IF = f(VSD) parameter: T j 102 12 Avalanche characteristics4) I A S= f(t AV) parameter: T j(start) 100 10 25 C 100 C 150 C 10 1 175 C 25 C I AV [A] 1 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 10 I F [A] 100 100 1000 V SD [V] t AV [s] Rev. 1.0 page 6 2009-09-07 IPG20N06S2L-35 13 Avalanche energy4) E AS = f(T j) parameter: I D 250 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 65 200 5A 62 V BR(DSS) [V] 10 A 15 A 150 59 E AS [mJ] 100 56 50 53 0 25 50 75 100 125 150 175 50 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge4) V GS = f(Q gate); I D = 20 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS 11 V 44 V 10 Qg 8 V GS [V] 6 V g s(th) 4 2 Q g (th) Q gs 0 5 10 15 20 Q sw Q gd Q gate 0 Q gate [nC] Rev. 1.0 page 7 2009-09-07 IPG20N06S2L-35 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2009 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2009-09-07 IPG20N06S2L-35 Revision History Version Date Changes Revision 1.0 07.09.2009 Final Data Sheet Rev. 1.0 page 9 2009-09-07 |
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