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| IC76 Series Specifications Shrink Dual Inline Package (SDIP) Part Number (Details) 1,000M W min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 20m W max. at 10mA/20mV max. Contact Resistance: 1A max. Current Rating: Operating Temperature Range: -40C to +150C cont. (IC7612) -40C to +170C cont. (IC7620) Mating Cycles: 25,000 to 50,000 insertions IC76 Series No. ** - 40 06 - G 4 MF Housing Material (12=PSF, 20= PES) No. of Contact Pins Materials and Finish Housing: Polysulphone (PSF), glass-filled - UL94V-0 rated Polyethersulphone (PES), glass-filled - UL94V-0 rated Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Row Space (06 = 0.6 inches) Contact Plating (G = Gold Plating) Straight, Through Hole Type MF = Flanged Unmarked = Not Flanged Features i Shrink pitch (1.778mm) sockets for high-density mounting i Dual wipe contacts ensure high reliability Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 0.4 A B H 1.778 3.2 J C B H D G E F Pin Count AE0.7 (Contact pos.) 1.5 4.0 1.2 K 2- AE3.2 2- AE3.2 Spot facing (AE6.2, 3.0 deep) G J 2- AE3.2 1.778 14.5 0.5 0.3 3.0 K 2- AE3.2 Part Number IC76**-2003-G4 ** IC76**-2006-G4 ** IC76**-2203-G4 ** IC76**-2403-G4 ** IC76**-2804-G4 ** IC76**-3004-G4 ** IC76**-4006-G4 ** IC76**-4206-G4 ** IC76**-4806-G4 ** IC76**-5206-G4 ** IC76**-64075-G4** Test & Burn-In Pin Count 20 20 22 24 28 30 40 42 48 52 64 A 20.0 19.5 22.0 24.0 27.5 29.0 38.0 39.5 45.0 48.5 59.5 B 1.778 x 9 = 16.002 1.778 x 9 = 16.002 1.778 x 10 = 17.78 1.778 x 11 = 19.558 1.778 x 13 = 23.114 1.778 x 14 = 24.892 1.778 x 19 = 33.782 1.778 x 20 = 35.56 1.778 x 23 = 40.894 1.778 x 25 = 44.45 1.778 x 31 = 55.118 C 17.0 24.6 17.0 17.0 19.5 19.5 24.6 24.6 24.6 24.6 28.4 D 8.3 15.9 8.3 8.3 10.8 10.8 15.9 15.9 15.9 15.9 19.7 E 2.0 8.0 2.0 2.0 2.9 2.9 8.0 8.0 8.0 8.0 11.8 F 7.5 10.3 7.5 7.5 8.0 8.0 10.3 10.3 10.3 10.3 13.7 G 11.4 19.0 11.4 11.4 13.9 13.9 19.0 19.0 19.0 19.0 22.8 H - - - - - - 25.5 25.5 26.0 28.0 29.5 J 23.0 30.6 23.0 23.0 25.5 25.5 30.6 30.6 30.6 30.6 38.2 K 11.0 11.0 11.0 13.0 16.5 16.5 25.5 25.5 26.0 28.0 29.5 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER IC121 Series Specifications Shrink Dual Inline Package (SDIP) Part Number (Details) 1,000M Wmin. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 20m W max. at 10mA max. Contact Resistance: 1A max. Current Rating: Operating Temperature Range: -40C to +150C Mating Cycles: 25,000 to 50,000 insertions IC121 Series No. - 52 06 - G 4 L MF No. of Contact Pins Row Space (06 = 0.6 inches) Materials and Finish Housing: Polyetherimide (PEI), glass-filled - UL94V-0 rated Contacts: Copper Alloy Plating: Gold over Nickel Contact Plating (G = Gold Plating) Straight Solder Dip Terminal Terminal Length Option: L = 5mm Unmarked = 3mm MF = Flanged Unmarked = Not Flanged Features i Shrink pitch (1.778mm) sockets for high-density mounting i Dual wipe contacts ensure high reliability i Two terminal lengths (3mm / 5mm) available. The 5mm type can be used as a piggy-back socket Outline Socket Dimensions Recommended PC Board Layout Top View from Socket A B R 3.5 1.778 20 30 J 0.1 D 0.1 G F J H K 13.5 AE3.3 AE0.8 1.778 0.05 5.0 0.5 3.0 Part Number IC121-24055-G4 ** IC121-2403-G4 ** IC121-2804-G4 ** IC121-4006-G4 ** IC121-4206-G4 ** IC121-4806-G4 ** IC121-5206-G4 ** IC121-5606-G4 ** IC121-64075-G4 ** IC121-9009-G4 ** Pin Count 24 24 28 40 42 48 52 56 64 90 A 24.50 24.00 27.50 38.20 40.00 45.50 49.00 52.50 60.00 83.54 B 19.558 19.558 23.111 33.782 35.56 40.894 44.45 48.006 55.188 78.232 C 22.80 15.00 17.0 22.8 22.8 22.8 22.8 22.8 26.8 32.2 H 0.1 D 14.86 8.30 10.60 16.54 16.54 16.54 16.54 16.54 19.80 23.50 E 7.27 2.00 3.00 9.27 9.27 9.27 9.27 9.27 11.40 15.60 F 14.86 8.30 10.60 16.54 16.54 16.54 16.54 16.54 19.80 23.50 G 16.46 10.10 12.20 18.14 18.14 18.14 18.14 18.14 21.40 25.10 B 0.1 1.2 AE3.3 Hole 4.0 D C E H 12.0 12.0 16.0 26.0 20.0 26.0 36.0 36.6 40.0 52.0 J 29.0 21.0 23.0 29.0 29.0 29.0 29.0 29.0 32.4 38.2 K - - - 5.5 5.5 5.5 5.5 5.5 9.4 13.6 Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER |
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