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APTGT75A120T1G Phase leg Fast Trench + Field Stop IGBT(R) Power Module 5 Q1 7 8 Q2 9 10 1 2 12 CR2 3 4 NTC 6 11 VCES = 1200V IC = 75A @ Tc = 80C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control Features * Fast Trench + Field Stop IGBT(R) Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated * Very low stray inductance - Symmetrical design * Internal thermistor for temperature monitoring * High level of integration Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * RoHS Compliant CR1 Pins 1/2 ; 3/4 ; 5/6 must be shorted together Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C Max ratings 1200 110 75 175 20 357 150A @ 1150V Unit V A V W August, 2007 1-5 APTGT75A120T1G - Rev 0 These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGT75A120T1G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 1200V Tj = 25C VGE =15V IC = 75A Tj = 125C VGE = VCE , IC = 3 mA VGE = 20V, VCE = 0V Min 1.4 5.0 Typ 1.7 2.0 Max 250 2.1 6.5 400 Unit A V V nA Dynamic Characteristics Symbol Cies Coes Cres Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGE = 0V VCE = 25V f = 1MHz Inductive Switching (25C) VGE = 15V VBus = 600V IC = 75A RG = 4.7 Inductive Switching (125C) VGE = 15V VBus = 600V IC = 75A RG = 4.7 VGE = 15V Tj = 125C VBus = 600V IC = 75A Tj = 125C RG = 4.7 Min Typ 5340 280 240 260 30 420 70 285 50 520 90 7 mJ 8.1 Max Unit pF ns ns Reverse diode ratings and characteristics Symbol Characteristic VRRM IRM IF VF trr Qrr Er Maximum Peak Repetitive Reverse Voltage Test Conditions Tj = 25C Tj = 125C Tc = 80C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Min 1200 Typ Max 350 600 Unit V A A Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy VR=1200V IF = 75A 75 1.6 1.6 170 280 7 14 2.8 5.4 2.1 V ns C mJ August, 2007 2-5 APTGT75A120T1G - Rev 0 IF = 75A VR = 600V di/dt =2000A/s www.microsemi.com APTGT75A120T1G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode 2500 -40 -40 -40 2.5 Min Typ Max 0.35 0.58 150 125 100 4.7 80 Unit C/W RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz V C N.m g To heatsink M4 Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic R25 Resistance @ 25C B 25/85 T25 = 298.15 K RT = R25 T: Thermistor temperature 1 1 RT: Thermistor value at T exp B25 / 85 - T25 T Min Typ 50 3952 Max Unit k K SP1 Package outline (dimensions in mm) See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com www.microsemi.com 3-5 APTGT75A120T1G - Rev 0 August, 2007 APTGT75A120T1G Typical Performance Curve Output Characteristics (VGE=15V) Output Characteristics 150 TJ = 125C 125 TJ=125C VGE=17V VGE=13V VGE=15V 150 125 IC (A) TJ=25C 100 IC (A) 100 75 50 25 0 VGE=9V 75 50 25 0 0 1 2 VCE (V) 3 4 0 1 2 VCE (V) 3 4 150 125 100 IC (A) 75 50 25 0 5 Transfert Characteristics 16 TJ=25C TJ=125C Energy losses vs Collector Current 14 12 E (mJ) 10 8 6 4 2 0 0 25 50 75 IC (A) Reverse Bias Safe Operating Area 175 150 Eoff VCE = 600V VGE = 15V RG = 4.7 TJ = 125C Eoff Eon Er TJ=125C 6 7 8 9 10 11 12 100 125 150 VGE (V) Switching Energy Losses vs Gate Resistance 16 14 12 E (mJ) 10 8 6 4 2 0 0 4 8 12 16 20 24 Gate Resistance (ohms) 28 32 Er VCE = 600V VGE =15V IC = 75A TJ = 125C Eon 125 IC (A) 100 75 50 25 0 0 400 800 VCE (V) 1200 1600 VGE=15V TJ=125C RG=4.7 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.4 Thermal Impedance (C/W) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0.00001 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0.01 0.1 1 10 IGBT rectangular Pulse Duration (Seconds) www.microsemi.com 4-5 APTGT75A120T1G - Rev 0 August, 2007 APTGT75A120T1G Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 60 50 40 30 20 10 0 0 20 40 60 IC (A) 80 100 120 Hard switching ZVS ZCS VCE=600V D=50% RG=4.7 TJ=125C Forward Characteristic of diode 150 125 100 IF (A) 75 50 25 0 0 0.4 0.8 1.2 1.6 VF (V) 2 2.4 TJ=125C TJ=125C TJ=25C Tc=75C maximum Effective Transient Thermal Impedance, Junction to case vs Pulse Duration 0.6 Thermal Impedance (C/W) 0.9 0.5 0.7 0.4 0.3 0.2 0.1 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0.01 0.1 1 10 Diode 0 0.00001 rectangular Pulse Duration (Seconds) Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5-5 APTGT75A120T1G - Rev 0 Microsemi reserves the right to change, without notice, the specifications and information contained herein August, 2007 |
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