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APTGT400U170D4G Single switch Trench + Field Stop IGBT Power Module 1 VCES = 1700V IC = 400A @ Tc = 80C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control Features * Trench + Field Stop IGBT Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated * * * * Kelvin emitter for easy drive M6 connectors for power M4 connectors for signal High level of integration 3 5 2 Benefits * Stable temperature behavior * Very rugged * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Easy paralleling due to positive TC of VCEsat * RoHS Compliant Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C Max ratings 1700 800 400 800 20 2080 800A@1650V Unit V A V W July, 2008 1-5 APTGT400U170D4G - Rev 2 These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGT400U170D4G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 1700V Tj = 25C VGE = 15V IC = 400A Tj = 125C VGE = VCE , IC = 16 mA VGE = 20V, VCE = 0V Min Typ 2.0 2.4 5.8 Max 5 2.4 6.4 400 Unit mA V V nA 5.2 Dynamic Characteristics Symbol Characteristic Cies Input Capacitance Cres Reverse Transfer Capacitance QG Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Isc Gate charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn On Energy Turn Off Energy Short Circuit data Test Conditions VGE = 0V, VCE = 25V f = 1MHz VGE=15V, IC=400A VCE=900V Inductive Switching (25C) VGE = 15V VBus = 900V IC = 400A RG = 3.6 Inductive Switching (125C) VGE = 15V VBus = 900V IC = 400A RG = 3.6 VGE = 15V Tj = 125C VBus = 900V IC = 400A Tj = 125C RG = 3.6 VGE 15V ; VBus = 1000V tp 10s ; Tj = 125C Min Typ 33 1.2 4.6 250 100 850 120 300 100 1000 200 135 mJ 125 1600 A Max Unit nF C ns ns Reverse diode ratings and characteristics Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRRM IF VF Err trr Qrr Maximum Reverse Leakage Current DC forward current Diode Forward Voltage Reverse Recovery Energy Reverse Recovery Time Reverse Recovery Charge IF = 400A VR = 900V IF = 400A VGE = 0V Test Conditions VR=1700V Tj = 25C Tj = 125C Tc=80C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Min 1700 Typ Max 750 1000 400 1.8 1.9 50 96 420 525 100 170 2.2 Unit V A A V mJ ns C July, 2008 2-5 APTGT400U170D4G - Rev 2 di/dt =4200A/s www.microsemi.com APTGT400U170D4G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight M6 M4 IGBT Diode 3500 -40 -40 -40 3 1 Min Typ Max 0.06 0.08 150 125 125 5 2 350 Unit C/W RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz V C N.m g D4 Package outline (dimensions in mm) www.microsemi.com 3-5 APTGT400U170D4G - Rev 2 July, 2008 APTGT400U170D4G Typical Performance Curve Output Characteristics (VGE=15V) Output Characteristics 800 700 600 TJ=125C 800 TJ=25C TJ = 125C VGE=20V 600 IC (A) IC (A) 500 400 300 VGE=13V VGE=15V VGE=9V 400 200 200 100 0 0 0.5 1 1.5 2 2.5 VCE (V) 3 3.5 4 0 0 1 2 3 VCE (V) 4 5 800 700 600 Transfert Characteristics TJ=25C Energy losses vs Collector Current 400 300 E (mJ) VCE = 900V VGE = 15V RG = 3.6 TJ = 125C Eon 500 IC (A) 400 300 200 100 0 5 6 7 8 VGE (V) Switching Energy Losses vs Gate Resistance 500 400 E (mJ) 300 200 100 0 0 5 10 15 20 Gate Resistance (ohms) Er VCE = 900V VGE =15V IC = 400A TJ = 125C TJ=125C TJ=125C 200 100 0 Eoff Er 9 10 11 0 100 200 300 400 500 600 700 800 IC (A) Reverse Bias Safe Operating Area 1000 Eon 800 IC (A) 600 400 200 0 25 0 400 800 1200 1600 2000 VCE (V) VGE=15V TJ=125C RG=3.6 Eoff 0.07 Thermal Impedance (C/W) 0.06 0.05 0.04 0.03 0.02 0.01 0 0.00001 0.5 0.3 0.9 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration IGBT 0.1 0.05 0.0001 0.001 Single Pulse 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) www.microsemi.com 4-5 APTGT400U170D4G - Rev 2 July, 2008 0.7 APTGT400U170D4G Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 25 20 15 10 5 0 0 100 200 300 IC (A) 400 500 600 ZCS ZVS VCE=900V D=50% RG=3.6 TJ=125C TC=75C Forward Characteristic of diode 800 700 600 500 IF (A) 400 300 200 TJ=125C TJ=125C TJ=25C hard switching 100 0 0 0.5 1 1.5 VF (V) 2 2.5 3 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.1 Thermal Impedance (C/W) Diode 0.08 0.06 0.04 0.02 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0.01 0.1 1 10 0 0.00001 rectangular Pulse Duration (Seconds) Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5-5 APTGT400U170D4G - Rev 2 July, 2008 |
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