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| IPD70N04S3-07 OptiMOS(R)-T Power-Transistor Product Summary V DS R DS(on),max ID 40 6.0 82 V m A Features * N-channel - Enhancement mode * Automotive AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green package (RoHS compliant) * 100% Avalanche tested PG-TO252-3-11 Type IPD70N04S3-07 Package PG-TO252-3-11 Marking QN0407 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol ID Conditions T C=25 C, V GS=10 V T C=100 C, V GS=10 V1) Pulsed drain current1) Avalanche energy, single pulse Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS V GS P tot T j, T stg T C=25 C T C=25 C I D=50 A Value 82 58 280 145 20 79 -55 ... +175 55/175/56 mJ V W C Unit A Rev. 1.0 page 1 2007-05-03 IPD70N04S3-07 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics1) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area2) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=50 A V DS=40 V, V GS=0 V, T j=25 C V DS=40 V, V GS=0 V, T j=125 C2) Gate-source leakage current Drain-source on-state resistance I GSS RDS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=70 A 40 2.1 3.0 4.0 1 A V 1.9 62 40 K/W - 4.9 100 100 6.0 nA m Rev. 1.0 page 2 2007-05-03 IPD70N04S3-07 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics1) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics1) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current1) Diode pulse current1) Diode forward voltage Reverse recovery time1) Reverse recovery charge1) IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=70 A, T j=25 C V R=20 V, I F=I S, di F/dt =100 A/s 1 34 36 70 280 1.3 V ns nC A Q gs Q gd Qg V plateau V DD=32 V, I D=70 A, V GS=0 to 10 V 12 8 30 6.0 16 14 40 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=20 V, V GS=10 V, I D=70 A, R G=3.5 V GS=0 V, V DS=25 V, f =1 MHz 2050 610 90 13 8 17 7 2700 800 130 ns pF 1) 2) Defined by design. Not subject to production test. Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 page 3 2007-05-03 IPD70N04S3-07 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 90 80 70 60 100 80 60 P tot [W] 40 30 20 10 0 0 50 100 150 200 I D [A] 40 20 0 0 50 100 150 200 50 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 1000 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 1 s 0.5 10 s 100 100 100 s 0.1 Z thJC [K/W] I D [A] 1 ms 0.05 10-1 0.01 10 10-2 single pulse 1 0.1 1 10 100 10-3 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.0 page 4 2007-05-03 IPD70N04S3-07 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 200 10 V 6 Typ. drain-source on-state resistance R DS(on) = f(I D); T j = 25 C parameter: V GS 20 5.5 V 6V 6.5 V 18 16 7V 160 14 R DS(on) [m] 120 I D [A] 12 10 7V 6.5 V 80 6V 8 6 40 5.5 V 10 V 4 5V 0 0 2 4 6 8 2 0 20 40 60 80 100 120 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 6V parameter: T j 320 -55 C 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 70 A; V GS = 10 V 9 280 240 8 7 25 C R DS(on) [m] 200 I D [A] 6 160 175 C 120 80 40 0 2 3 4 5 6 7 8 5 4 3 2 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.0 page 5 2007-05-03 IPD70N04S3-07 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 4 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 104 3.5 Ciss 500 A 3 V GS(th) [V] C [pF] 103 Coss 50 A 2.5 2 102 Crss 1.5 1 -60 -20 20 60 100 140 180 101 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 103 12 Typ. avalanche characteristics I A S= f(t AV) parameter: T j(start) 100 25 C 100 C 150 C 102 I AV [A] 101 175 C 25 C I F [A] 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.0 page 6 2007-05-03 IPD70N04S3-07 13 Typical avalanche energy E AS = f(T j) parameter: I D 700 14 Typ. drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 55 600 50 500 12.5 A E AS [mJ] 400 300 25 A V BR(DSS) [V] 50 A 45 40 200 35 100 0 25 75 125 175 30 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 70 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS 8V 32 V 10 Qg 8 V GS [V] 6 V g s(th) 4 2 Q g (th) Q gs 0 10 20 30 40 Q sw Q gd Q gate 0 Q gate [nC] Rev. 1.0 page 7 2007-05-03 IPD70N04S3-07 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2007 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2007-05-03 IPD70N04S3-07 Revision History Version Date Changes Rev. 1.0 page 9 2007-05-03 |
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