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FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch June 2009 FPF2310/12/13/13L Dual-Output Adjustable Current Limit Switch Features ! 1.8 to 5.5V Input Voltage Range ! Typical RON = 75m at IN = 5.5V ! 400~600mA Adjustable Current Limit ! 10% Current Limit Accuracy from Typical ! Slew Rate Controlled ! ESD Protected, Above 4000V HBM ! Independent Thermal Shutdown ! UVLO ! Output Discharge ! RoHS Compliant Description The FPF2310/12/13/13L are dual-channel load switches of IntelliMAXTM family. The FPF2310/12/13/13L consist of dual, independent, current-limited, and slew rate controlled, P-channel MOSFET power switches. Slew rated turn-on prevent inrush current from glitching supply rails. The input voltage range operates from 1.8V to 5.5V to fulfill today's USB device supply requirements. Switch control is accomplished by a logic input (ON) capable of interfacing directly with low-voltage control signal. For the FPF2312, if the constant current condition persists after 10ms, these parts shut down the switch. The FPF2310 has an auto-restart feature that turns the switch on again after 150ms if the ON pin is still active. FPF2313/13L remains in the constant-current mode until the switch current falls below the current limit. For the FPF2310 through FPF2313/13L, the minimum current limit is 400mA-600mA with 10% accuracy (+25C) for each switch to comply with USB applications in portable devices. FPF2310M/12/13/13L series is available in a spacesaving, 8-Lead, 3X3mm MLP. Applications ! Smart Phones ! Enterprise Equipment ! Peripheral USB Ports and Accessories Figure 1. 8 Lead MLP (3x3mm) Ordering Information Part Number FPF2310MPX FPF2312MPX FPF2313MPX Minimum Current Limit Auto Current Blanking Eco Restart Limit Time Status 400-600mA 400-600mA 400-600mA 10ms 10ms 0ms 0ms ON Pin Activity Active HIGH Mode Restart Package 8-Lead Molded Leadless Package (MLP) 8-Lead Molded Leadless Package (MLP) Green Green Green Green 150ms N/A N/A N/A Active HIGH Latch Off Active HIGH Active LOW Constant 8-Lead Molded LeadCurrent less Package (MLP) Constant 8-Lead Molded LeadCurrent less Package (MLP) FPF2313LMPX 400-600mA For Fairchild's definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Application Circuit IN ISETA ISETB OUTA GND OUTB COUTB *FPF2313L is active LOW TO LOAD A TO LOAD B COUTA FPF2310/12/13/13L* IN = 1.8V-5.5V CIN OFF ON OFF ON ONA ONB Figure 2. Typical Application Functional Block Diagram IN UVLO ONA CONTROL LOGIC A CURRENT LIMIT A THERMAL PROTECTION A OUTA OUTPUT DISCHARGE ISETA ONB CONTROL LOGIC B CURRENT LIMIT B THERMAL PROTECTION B OUTB OUTPUT DISCHARGE ISETB GND Figure 3. Block Diagram (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 2 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Pin Configuration ISETA OUTA OUTB ISETB 8 7 9 6 5 3 ONA 1 2 GND IN 4 ONB MLP 3X3 8L Bottom View Figure 4. 8-Lead MLP 3x3mm (Bottom View) Pin Description Pin 1 2 3 4 5 6 7 8 9 Name GND IN ONA ONB ISETB OUTB OUTA ISETA Thermal Pad Ground Function Supply Input: Input to the power switch and the supply voltage for the IC. ON / OFF control input of power switch A. ON / OFF control input of power switch B. Current limit set input for power switch B: A resistor from ISET to ground sets the current limit for the switch. Switch Output: output of the power switch B. Switch Output: output of the power switch A. Current limit set input for power switch A: A resistor from ISET to ground sets the current limit for the switch. IC substrate, which can be connected to GND for better thermal performance. Do not connect to other pins. (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 3 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter IN, OUTA, OUTB, ON to GND Min. -0.3 Max. 6.0 0.6(1.) 2.2(2.) Unit V W C C/W V V PD TSTG JA ESD Power Dissipation Storage Temperature Thermal Resistance, Junction-to-Ambient Electrostatic Discharge Protection Human Body Model, JESD22-A114 Charged Device Model, JESD22-C101 4000 2000 -65 +150 216(1.) 57(2.) Notes: 1. Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3. 2. Soldered thermal pad on a four-layer PCB without vias connected with GND plane based on JEDEC STD51-5, 7. Recommended Operating Range The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol IN TA Parameter Supply Input Ambient Operating Temperature Min. 1.8 -40 Max. 5.5 +85 Unit V C (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 4 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Electrical Characteristics IN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at IN = 3.3V and TA = 25C. Symbol Parameter Basic Operation VIN IQ ISD RON RPD VIH VIL ION Protections ILIM Current Limit Operating Voltage Quiescent Current IN Shutdown Current On Resistance Output Pull-Down Resistance ON Input Logic High Voltage (ON) ON Input Logic Low Voltage ON Input Leakage Conditions Min. Typ. Max. Units 1.8 5.5 52.5 94.5 1 75 90 70 0.8 1.4 0.5 0.9 -1 1 140 V A A m V V A IN = 5.5V, IOUT = 0mA, VON = 5.5V (FPF2310/2/3), VON = 0V (FPF2313L) IN = 5.5V, OUTA = OUTB = Short to GND, VON = 0V (FPF2310/2/3), VON = 5.5V (FPF2313L) IN = 5.5V, IOUT = 200mA, TA = 25C IN = 5.5V, IOUT = 200mA, TA = -40C to +85C IN = 3.3V, TA = 25C VON = 0V (FPF2310/2/3), VON = 3.3V(FPF2313L) IN = 1.8V IN = 5.5V IN = 1.8V IN = 5.5V VON = IN or GND IN = 3.3V, OUTA = OUTB = 3V, RSET = 690, TA = 25C Shutdown Threshold Return from Shutdown Hysteresis IN Increasing 1.55 450 500 140 130 10 1.65 50 550 mA TSD VUVLO VUVLO_HYS Dynamic tON tOFF tR tF tBLANK tRSTRT tCLR Thermal Shutdown Under-Voltage Shutdown Under-Voltage Shutdown Hysteresis Turn-On Time Turn-Off Time OUTA, OUTB Rise Time OUTA, OUTB Fall Time Over-Current Blanking Time Auto-Restart Time Current Limit Response Time OUT C 1.75 V mV RL = 500, CL = 0.1F RL = 500 RL = 500, CL = 0.1F RL = 500 FPF2310, FPF2312 FPF2310 IN = 3.3V, Moderate Over-Current Condition 90% 10% 90% 10% 111 5 13 2 5 75 10 150 20 20 300 s s s s ms ms s tR ON 50% tF 50% OUT tDON 90% 10% tDOFF tOFF = tF + tDOFF tON = tR + tDON Figure 5. Timing Diagram (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 5 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Typical Characteristics 60.00 55.00 SUPPLY CURRENT (uA) 50.00 45.00 40.00 35.00 30.00 25.00 20.00 1.8 25C -40C O = O = IN NA NB RSET = 698 O s hm 85C IQ CURRENT (uA) 50.00 40.00 30.00 20.00 10.00 0.00 -40 IN = 1.8V IN = 5.5V 70.00 60.00 O = O = IN NA NB RSET = 698 O s hm IN = 3.3V 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5 -15 10 35 60 85 SUPPLY VO G (V) LTA E TJ, JUNCTION TEM PERA TURE (C) Figure 6. Quiescent Current vs. Supply Voltage Figure 7. Quiescent Current vs. Temperature 2.0 IN SHUTDOWN CURRENT (uA) IN SHUTDOWN CURRENT (uA) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -15 10 35 60 85 IN = 5.5V O = O = 0V N UT RSET = 698 O s hm 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -15 10 35 60 85 IN = 5.5V O = O = 0V N UT RSET = 698 O s hm TJ, JUNCTIO TEM N PERA TURE (C) TJ, JUNCTIO TEM N PERA TURE (C) Figure 8. IN Shutdown Current vs. Temperature Figure 9. RON vs. Supply Voltage 110 100 90 80 RON B 70 RON A 60 50 -40 85 PULL-DOWN RESISTANCE (Ohm) IN = 5.5V O = ONB = 5.5V NA RSET = 698 O s hm IOUT = 200m A TA = 25C ON RESISTANCE (mOhm) 80 RPD A RPD B 70 O = O = 0V NA NB RSET = 698 O s hm IOUT = 1m A TA = 25C 75 65 -15 10 35 60 85 60 1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5 TJ, JUNCTIO TEM N PERA TURE (C) SUPPLY VOLTA (V) GE Figure 10. RON vs. Temperature Figure 11. RPD vs. Supply Voltage (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 6 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Typical Characteristics 80 PULL-DOWN RESISTANCE (Ohm) 75 RPDA 70 RPDB 65 60 55 50 -40 1.5 ON THRESHOLD VOLTAGE (V) 1.3 1.0 0.8 0.5 0.3 0.0 -15 10 35 60 85 RSET = 698 O s hm TA = 25C VIH VIL IN = 5.5V O = O = 0V NA NB RSET = 698 O s hm IOUT = 1m A 1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5 TJ, JUNCTIO TEM N PERA TURE (C) SUPPLY VO G (V) LTA E Figure 12. RPD vs. Temperature Figure 13. ON Threshold Voltage vs. Supply Voltage 1.4 ON THRESHOLD VOLTAGE (V) 1.2 1.0 0.8 0.6 0.4 0.2 RSET = 698 Ohm s 0.0 -40 -15 10 35 60 85 ON THRESHOLD VOLTAGE (V) IN = 5.5V 1.4 1.2 IN = 5.5V 1.0 IN = 3.3V 0.8 IN = 1.8V 0.6 0.4 0.2 RSET = 698 O s hm 0.0 -40 -15 10 35 60 85 IN = 3.3V IN = 1.8V TJ, JUNCTIO TEM N PERA TURE (C) TJ, JUNCTIO TEM N PERA TURE (C) Figure 14. ON High Voltage vs. Temperature Figure 15. ON Low Voltage vs. Temperature 500 RSET = 698 Ohm s TA = 25C CURRENT LIMIT (mA) CURRENT LIMIT (mA) 500 498 496 494 492 490 488 486 484 482 495 ILIM (Typ)B 490 ILIM (Typ)A 485 IN = 3.3V O UTA = O UTB = 3V O = O = 3.3V NA NB RSET = 698 O s hm ILIM (Typ)B ILIM (Typ)A 480 1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5 480 -40 -15 10 35 60 85 SUPPLY VOLTA (V) GE TJ, JUNCTIO TEM N PERA TURE (C) Figure 16. Current Limit vs. Supply Voltage Figure 17. Current Limit vs. Temperature (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 7 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Typical Characteristics 1000 TURN ON/OFF DELAY TIME (us) IN = 3.3V RL = 500 O s hm CL = 0.1 uF RSET = 698 O s hm 20 18 16 RISE/FALL TIME (us) 14 12 10 8 6 4 2 1 -40 -15 10 35 60 85 0 -40 -15 10 tF IN = 3.3V RL = 500 O s hm hm RSET = 698 O s tR IN = 3.3V RL = 500 O s hm CL = 0.1 uF RSET = 698 O s hm tDON 100 10 tDOFF IN = 3.3V RL = 500 O s hm RSET = 698 O s hm 35 60 85 TJ, JUNCTIO TEM N PERA TURE (C) TJ, JUNCTIO TEM N PERA TURE (C) Figure 18. tDON / tDOFF vs. Temperature Figure 19. tRISE / tFALL vs. Temperature 12.5 12.0 BLANKING TIME (ms) 11.5 11.0 10.5 10.0 9.5 9.0 8.5 -40 O UTB O UTA RESTART TIME (ms) FPF2310/12 IN = 3.3V O = ONB = 3.3V NA RSET = 698 O s hm 200 190 180 170 160 150 140 130 120 110 O UTA FPF2310 IN = 3.3V O = O = 3.3V NA NB RSET = 698 Ohm s O UTB -15 10 35 60 85 100 -40 -15 10 35 60 85 TJ, JUNCTIO TEM N PERA TURE (C) TJ, JUNCTIO TEM N PERA TURE (C) Figure 20. tBLANK vs. Temperature Figure 21. tRSTRT vs. Temperature IN 5V/DIV ON 2V/DIV IN 5V/DIV ON 2V/DIV IOUT 50mA/DIV OUT 5V/DIV 200s/DIV OUT 5V/DIV IN = 5V ON = 3.3V COUT = 0.1F RL = 500 RSET = 680 IN = 5V ON = 3.3V CIN = 10F COUT = 0.1F RL = 500 RSET = 680 200s/DIV Figure 22. tON Response Figure 23. tOFF Response (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 8 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Typical Characteristics IN 5V/DIV ON 2V/DIV IOUT 500mA/DIV OUT 5V/DIV tBLANK IN = 5V ON = 3.3 CIN = 10F COUT = 10F RL = 3.3 RSET = 680 IN 5V/DIV ON 2V/DIV IOUT 500mA/DIV OUT 5V/DIV 4ms/DIV 40ms/DIV IN = 5V ON = 3.3 CIN = 10F COUT = 10F RL = 3.3 RSET = 680 Figure 24. tBLANK Response (FPF2310/12) Figure 25. tRSTRT Response (FPF2310) IN 5V/DIV ON 2V/DIV IOUT 500mA/DIV OUT 5V/DIV 200s/DIV COUT = 47F RL = 10 RSET = 680 IN = 5V ON = 3.3V CIN = 10F IN 5V/DIV ON 2V/DIV COUT = 47F COUT = 100F OUT 5V/DIV COUT = 220F 1ms/DIV COUT = 470F IN = 5V ON = 3.3 RL = 10 RSET = 680 Figure 26. Current Limit Response with 47F Figure 27. Output Voltage Rise Time with Various Load Capacitor IN 5V/DIV ON 2V/DIV IN = 5V ON = 3.3 RL = 10 RSET = 680 COUT = 470F COUT = 220F COUT = 100F COUT = 47F IN 5V/DIV ON 2V/DIV IOUT 500mA/DIV COUT = 470F COUT = 220F COUT = 100F IN = 5V ON = 3.3 RL = 10 RSET = 680 COUT = 47F 40s/DIV 8s/DIV IOUT 500mA/DIV IOUT 500mA/DIV Figure 28. Output Current Inrush at Startup with Various Load Capacitors Figure 29. Output Current Inrush at Startup with Various Load Capacitors (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 9 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Typical Characteristics IN 5V/DIV ON 2V/DIV OUTA 500mV/DIV OUTB 500mV/DIV 400s/DIV IN 5V/DIV ON 2V/DIV IOUT 2A/DIV OUT 5V/DIV 400s/DIV IN = 5V CIN = 150F COUT = 47F CL = 150F RL = 10 RSET = 680 IN = 5V ON = 3.3 COUTA = 100F COUTB = 100F RLA = RLB = 1 RSET = 680 Figure 30. Current Limit Response Time Both Channels are in OC Figure 31. Inrush Response During Capacitive Load Hot Plug-In Event IN 5V/DIV ON 2V/DIV IOUT 2A/DIV OUT 5V/DIV 400s/DIV IN = 5V CIN = 150F COUT = 100F CL = 47F RL = 10 RSET = 680 Figure 32. Inrush Response During Capacitive and Resistive Load Hot Plug-In Event (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 10 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Description of Operation The FPF2310/2/3/3L are dual-output current-limit switches designed to meet notebook computers, peripheral USB ports, and point-of-load (POL) application power requirements. Dual-output current can be used where two USB ports are powered by hosts or self-powered hubs. The FPF231X family offers control and protection while providing optimum operation current for a safe design practice. The core of each switch is a typical 75m (IN = 5.5V) P-channel MOSFET and a controller capable of functioning over an input operating range of 1.8 to 5.5V. The FPF231X family offers current limiting, UVLO (under-voltage lockout), and thermal shutdown protection per each switch. In the event of an overcurrent condition, the load switch limits the load to current limit value. The current limit value for each switch can be adjusted through the ISET pins. 400mA-600mA is adjustable for the FPF2310 through FPF2313. The minimum current limit is 400mA600mA with 10% accuracy at +25C with minimum variation over temperature. ON VIN VOUT ILOAD tBLANK RL*ILMIT tRSTRT ILIMIT Over current condtion On/Off Control The ON pin is active HIGH for FPF2310/2/3 and controls the state of the switch. Pulling the ON pin continuous to HIGH holds the switch in the ON state. The switch moves into the OFF state when the ON pin is pulled LOW or if a fault is encountered. FPF2313L is active LOW and performs in reverse order. For all versions, an under-voltage on input voltage or a junction temperature in excess of 140C overrides the ON control to turn off the switch. In addition, excessive currents cause the switch to turn off in the FPF2310 and FPF2312 after 10ms blanking time. The FPF2310 has an autorestart feature that automatically turns the switch ON again after 150ms. For the FPF2312, the ON pin must be toggled to turn on the switch again. The FPF2313 and FPF2313L do not turn off in response to an over-current condition, but remain operating in a constant-current mode as long as ON is enabled and the thermal shutdown or UVLO is not activated. The ON pin does not have a pull-down or pull-up resistor and should not be left floating. Figure 33. FPF2310 Performance While Entering into an Over-Current Condition. Note: 3. An over-current condition signal loads the output with a heavy load current larger than ILIM value. ON VIN VOUT ILOAD ILIMIT Therm wn utdo al Sh Dev Current Limiting The current limit ensures that the current through the switch doesn't exceed a maximum value, while not limiting at less than a minimum value. FPF231X family has dual-output load switches in one package. The current limit of each switch is adjustable through the an external resistor connected to the ISET pin. The current limit range is from 400mA to 600mA with 10% current limit tolerance. The FPF2310 and FPF2312 have a blanking time of 10ms (tBLANK(Typ) = 10ms) during which the switch acts as a constant current source. If the over-current condition persists beyond the blanking time, the FPF2310 latches off and shuts the switch off. If the ON pin is kept active, an auto-restart feature releases the switch and turns the switch on again after a 150ms auto-restart time (tRSTRT). If the over-current condition persists beyond the blanking time, the FPF2312 has a latch-off feature that shuts the switch off. The switch is kept off until the ON pin is toggled. The FPF2313/3L have no current-limit blanking period, so remain in a constant-current state until the ON pin of the affected switch is deactivated or the thermal shutdown turns off the switch. ice Co ols Off Over current condtion Figure 34. FPF2313 Performance While Entering into an Over-Current Condition Note: 4 An over-current condition signal loads the output with a heavy load current larger than ILIM value. (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 11 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Table 1: RSET Selection Guide Output Discharge Resistor Maximum Tolerance Current (%) Limit [mA] 742 707 674 642 611 584 556 518 489 10 10 10 10 10 10 10 10 10 The FPF2310/2/3 and FPF2313L family contains an 70 onchip output pull-down resistor for quick output discharge when the switch is turned off. This features become more attractive when an application requires a large output capacitor to be discharged when switch turns off. However, the OUT pin should not be connected directly to the battery source due to the discharge mechanism of the load switch. RSET [] 511 536 562 590 620 649 681 732 775 Minimum Current Limit [mA] 607 578 552 526 500 478 455 424 400 TypicalCurent Limit [mA] 674 643 613 584 556 531 506 471 445 Thermal Shutdown The thermal shutdown protects the device from internally or externally generated excessive temperatures. Each switch has an individual thermal shutdown protection function and operates independently as adjacent switch temperature increases above 140C. If one switch is in normal operation and shutdown protection of second switch is activated, the first channel continues to operate if the affected channel's heat stays confined. The over-temperature in one channel can shut down both switches due to rapidly generated excessive load currents resulting in very high power dissipation. Generally, a thermally improved board layout can provide heat sinking and allow heat to stay confined and not affect the second switch operation. During an over-temperature condition, the affected switch is turned off. If the temperature of the die drops below the threshold temperature, the switch automatically turns on again. To avoid unwanted thermal oscillations, a 10C (typical) thermal hysteresis is implemented between thermal shutdown entry and exit temperatures. If output of both switches are connected together and an excessive load current activates thermal protection of both, the controller can shutdown the switches after both outputs go LOW and turn on both channels again. This provides a simultaneous switch turn on. Thermal protection is for device protection and should not be used as regular application operation. ILIMIT (mA) RSET () Figure 35. ILIM vs RSET Under-Voltage Lockout (UVLO) The under-voltage lockout feature turns off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active (ON pin is pulled LOW), the input voltage rising above the under-voltage lockout threshold causes a controlled turn-on of the switch and limits current overshoot. The device detects the UVLO condition when input voltage goes below UVLO voltage, but remains above 1.3V (typical). ON device wake-up IN UVLO THRESHOLD RISE TIME 90% VOUT OUT ILOAD 10% VOUT ILIMIT Figure 36. Under-Voltage Lockout (UVLO) (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 12 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Application Information Host (5V) OFF ON 1F OFF ON IN ISETA ISETB FPF2310/2/3 ONA ONA GND OUTA OUTB 33F Down Stream USB Port Down Stream USB Port 33F Figure 37. Typical Application Input Capacitor To limit the voltage drop on the input supply caused by transient inrush currents when the switch is turned on into discharged load capacitors or a short-circuit; an input capacitor, CIN, is recommended between IN and GND. The FPF2310/2/3/3L features a fast current limit response time of 20s. An inrush current (also known as surge current) could occur during the current limit response time while the switch is responding to an over-current condition caused by large output capacitors. A 10F ceramic capacitor, CIN, is required to provide charges for the inrush current and prevent input voltage drop at the turn on. Higher values of CIN to further reduce the voltage drop. Power Dissipation During normal operation as a switch, the power dissipation of device is small and has little effect on the operating temperature of the part. The maximum power dissipation for both switches, while the switch is in normal operation, occurs just before both channels enter into current limit. This may be calculated using: PD_MAX(NormalOperation) = 2 x (ILIM(MIN))2 x RON(MAX) (4) For example, for a 5V application maximum normal operation power loss while both switches delivering output current up to 500mA (ILIM(MIN) = 500mA) can be calculated as: PD_MAX(NormalOperation)(IN = 5V) = 2 x (0.5)2 x 0.14 = 70mW (5) Output Capacitor A 0.1F to 1F capacitor, COUT, should be placed between the OUT and GND pins. This capacitor prevents parasitic board inductances from forcing output voltage below GND when the switch turns off. This capacitor should have a low dissipation factor. An X7R MLCC (Multilayer Ceramic Chip) capacitors is recommended. For the FPF2310 and FPF2312, the total output capacitance needs to be kept below a maximum value, COUT(MAX), to prevent the part from registering an over-current condition beyond the blanking time and shutdown. The maximum output capacitance for a giving input voltage can be determined from the following: ILIM(MIN) x tBLANK(MIN) (2) COUT(MAX) = VIN For example, in a 5V application and ILIM(MIN) = 500mA using RSET = 620, COUT(MAX) can be determine as: 0.5A x 5ms (3) COUT(MAX)(IN = 5V) = 5 = 500F The maximum junction temperature should be limited to 125C under normal operation. Junction temperature can be calculated using: (6) TJ = PD x RJA + TA where: TJ is junction temperature; PD is power dissipation across the switch RJA is thermal resistance, junction-to-ambient; and TA is ambient temperature For example, TJ(MAX)(Normal operation) for an MLP 3x3mm package with TA=25C while both switches are delivering up to 1.1A, is calculated as: TJ(MAX)(NormalOperation) = PD_MAX(Normal Operation)(IN = 5V) x 216 + 25 = 40.12C (7) (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 13 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch If the part goes into current limit, the maximum power dissipation occurs when the output of switch is shorted to ground. For the FPF2310, the power dissipation scales with the auto-restart time, tRSTRT, and the over-current blanking time, tBLANK. In this case, the maximum power dissipated for the FPF2310 is: tBLANK PD_MAX(CurrentLimit) = 2 x x IN(MAX) x ILIM(MAX) tBLANK + tRSTRT (8) Which results in: PD_MAX(CurrentLimit) = 2 x 10 x 5.5 x 0.74 = 508mW (9) 10 + 150 ounce copper plating is recommended to create appropriate solder reflow. A smaller size hole prevents the solder from penetrating into the via, resulting in device lift-up. Similarly, a larger via-hole consumes excessive solder and may result in voiding the DAP. 15mil Note that this is below the maximum package power dissipation and the thermal shutdown feature protection provides additional safety to protect the part from damage due to excessive heating. The junction temperature is only able to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON has no effect until the junction temperature drops below the thermal shutdown exit temperature. For the FPF2313 and FPF2313L, a short on the both outputs causes both switches to operate in a constantcurrent state and dissipating a worst-case power of: PMAX = IN(MAX) x ILIM(MAX) = 2 x 5.5 x 0.74 = 8.14W As both FPF2313/3L outputs are connected to GND. This power dissipation is significant and activates both thermal shutdown blocks. The part cycles in and out of thermal shutdown as long as the ON pin is activated (pulled LOW) and the output short is present. (10) 25mil Figure 38. Two Through-Hole Open Vias Embedded in DAP 3. The IN, OUTs, and GND pins dissipate most of the heat generated during a high-load current condition. The layout suggested in Figure 39 illustrates a proper layout for devices in MLP 3x3mm packages. IN, OUTs, and GND pins are connected to adequate copper so that heat may be transferred as efficiently as possible out of the device. The low-power FLAGB and ON pins' traces may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents. PCB Layout Recommendations For the best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and shortcircuit operation. Using wide traces for IN, OUTs, and GND pins helps minimize parasitic electrical effects along with minimizing the case-to-ambient thermal impedance. Improving Thermal Performance of the FPF231X Family of Devices Improper layout could result in higher junction temperature and triggering the thermal shutdown protection feature. This concern applies particularly to the FPF2313 and FPF2313L, where both channels operate in constant-current mode in the overload conditions and; during fault condition, the outputs are shorted, resulting to large voltage drop across switches. In this case, power dissipation of the switch (PD = (VIN - VOUT) x ILIM(MAX)) could exceed the maximum absolute power dissipation of part. The following techniques improve the thermal performance of this family of devices. These techniques are listed in order of the significance of impact. 1. Thermal performance of the load switch can be improved by connecting the DAP (Die Attach Pad) of MLP 3x3mm package to the GND plane of the PCB. 2. Embedding two exposed through-hole vias into the DAP (pin 9) provides a path for heat to transfer to the back GND plane of the PCB. A drill size of round, 15 mils (0.4mm) with 1- Figure 39. Proper Layout of Output and Ground Copper Area (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 14 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch FPF231X Evaluation Board FPF231X evaluation board has components and circuitry to demonstrate FPF2310/2/3/3L load switches functions and features accommodating both MLP 3x3mm packages. The state of the each channel can be configured using J1 and J2 jumpers. In addition, both channels can be controlled by ONA and ONB test pins. Thermal performance of the board is improved using techniques recommended in the layout recommendations section. R3 and R4 resistors are used on the board to sink a light load current when switches are activated. Figure 42. Bottom and ASB Layers Figure 40. Top, SST, and AST Layers (MLP 3x3mm Package) Figure 41. Zoom In to Top Layer Related Resources FPF2310/12/13/13L Evaluation Board User Guide; Power Switch for USB Applications (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 15 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch Dimensional Outline and Pad Layout Figure 43. 8-Lead Molded Leadless Package (MLP) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 16 www.fairchildsemi.com FPF2310/12/13/13L -- Dual-Output Adjustable Current Limit Switch TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. Auto-SPMTM Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM* TM* F-PFSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GmaxTM GTOTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM MotionMaxTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R) (R) PowerTrench(R) PowerXSTM Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM Saving our world, 1mW/W/kW at a timeTM SmartMaxTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SupreMOSTM SyncFETTM Sync-LockTM (R)* The Power Franchise(R) TM TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM TriFault DetectTM TRUECURRENTTM* SerDesTM Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FETBenchTM FlashWriter(R)* FPSTM PDP SPMTM Power-SPMTM UHC(R) Ultra FRFETTM UniFETTM VCXTM VisualMaxTM XSTM * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDOS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete Product Status Formative / In Design First Production Full Production Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I40 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. (c) 2009 Fairchild Semiconductor Corporation FPF2310/12/13/13L * Rev. 1.1.2 17 www.fairchildsemi.com |
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