Part Number Hot Search : 
MAC7101 PN1010 IRFR3704 C7SH08FU EPS13 1N5400 30BQ100 1008F
Product Description
Full Text Search
 

To Download CBGA Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 data sheet
Ceramic Ball Grid Array Package (CBGA) Amkor's CBGAs incorporate the most advanced assembly processes and designs for today and tomorrow's cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (Si & GaAs). Amkor's CBGAs are designed for low inductance, improved thermal operation and enhanced SMT-ability. Custom performance enhancements, such as ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics. Additionally, these CBGAs utilize industry proven, semiconductor grade materials for reliable, long-term operation while providing the user flexible design parameters. The CBGA is a ceramic substrate package. It consist of a ceramic substrate which is covered with a B-Staged epoxy lid or by encapsulating it. Applications: Semiconductor technologies find enhanced performance by using the integrated design features of Amkor's CBGAs. Microprocessors/controllers, ASICs, Gate Arrays, memory, DSPs and PC chip sets find Amkor's CBGA family to be an ideal package. Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless, PCMCIA cards, laptop PC's, video cameras, disc drives, power amplifiers and other similar products benefit from Amkor's CBGA attributes.
Features:
CERAMIC
/
HERMETIC
CBGA
The CBGA offers a variety of features. From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production.
* * * * * * * * * * * *
Flexible ball counts 10mm to 35mm body sizes 1.0, 1.27, 1.5mm ball pitch available Eutectic (63/37) solder balls Perimeter, stagger and full ball arrays Special packaging for memory available 6 mil coplanarity Multi-layer, ground/power Cavity lid seal or encapsulation Full in-house design capability JEDEC MO-151 standard outlines High thermal conductive ceramic
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
www.amkor.com
DS800 Rev Date: 08'02


▲Up To Search▲   

 
Price & Availability of CBGA

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X