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| Reflexlichtschranke mit Schmitt-Trigger Reflective Interrupter with Schmitt-Trigger Lead (Pb) Free Product - RoHS Compliant SFH 9240 Wesentliche Merkmale * IR-GaAs-Lumineszenzdiode in Kombination mit einem Schmitt-Trigger IC * SFH 9240: Output active low * Tageslichtsperrfilter * Einschaltstrom: typ. 3 mA * Sender und Empfanger galvanisch getrennt * Vorbehandlung nach JEDEC Level 4 Anwendungen * Optischer Schalter * Pulsformer * Zahler Typ Type SFH 9240 Bestellnummer Ordering Code Q65110A2714 Features * IR-GaAs-emitter in combination with a Schmitt-Trigger IC * SFH 9240: Output active low * Daylight cut-off filter * Threshold current: typ. 3 mA * Emitter and detector electrically isolated * Preconditioning acc. to JEDEC Level 4 Applications * Optical threshold switch * Pulseformer * Counter IF,ON [mA] (VCC = 5 V, d = 1 mm Kodak neutral white test card with 90% reflection) 3 (< 10) 2007-04-02 1 SFH 9240 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Sperrspannung Reverse voltage Vorwartsgleichstrom Forward current Stostrom (tP 10 s) Surge current (tP 10 s) Verlustleistung Power dissipation Empfanger (Schmitt-Trigger IC) Detector (Schmitt-Trigger IC) Versorgungsspannung Supply voltage Ausgangsspannung Output voltage Ausgangsstrom Output current (TA = 25 C) Verlustleistung Power dissipation Reflexlichtschranke Light Reflection Switch Betriebs- und Lagertemperatur Operating and storage temperature range Verlustleistung Power dissipation Symbol Symbol Wert Value Einheit Unit VR IF IFSM Ptot 5 50 1.5 80 V mA A mW VCC VO IO Ptot - 0.5 ... + 20 - 0.5 ... + 20 50 175 V V mA mW Top, Tstg Ptot - 40 ... + 100 150 C mW 2007-04-02 2 SFH 9240 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Durchlassspannung Forward voltage IF = 50 mA Sperrstrom Reverse current VR = 5 V Kapazitat Capacitance VR = 0 V, f = 1 MHz Symbol Symbol Wert Value Einheit Unit VF 1.25 ( 1.65) V IR 0.01 ( 1) A CO 25 pF Warmewiderstand (Montage auf PC-Board mit RthJA > 5 mm2 Padgroe) Thermal resistance (mounting on pcb with > 5 mm2 pad size) 270 K/W Empfanger (Schmitt-Trigger IC) (wenn nicht anders angegeben, VCC = 5 V) Detector (Schmitt-Trigger IC) (unless otherwise specified, VCC = 5 V) Ausgangsspannung high" Output voltage "high" IO = 0 Ausgangsspannung low" Output voltage "low" IO = 16 mA Stromaufnahme Supply current VCC = 5 V VCC = 18 V Anstiegszeit 10% bis 90% Rise time 10% to 90% RL = 280 , IF = 20 mA Abfallzeit 90% bis 10% Fall time 90% to 10% RL = 280 , IF = 20 mA VOH VCC (> 4.0) V VOL 0.15 (< 0.4) V ICC 3.3 (< 5) 5.0 mA tr 20 ns tf 10 ns 2007-04-02 3 SFH 9240 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Ausgangsverzogerungszeit Propagation delay time "ON" RL = 280 , IF = 20 mA Ausgangsverzogerungszeit Propagation delay time "OFF" RL = 280 , IF = 20 mA Reflexlichtschranke Light Reflection Switch Schaltschwelle Threshold current, Kodak neutral white test card with 90% reflection VCC = 5 V, d = 1 mm Hysterese Hysteresis Symbol Symbol Wert Value 1 Einheit Unit s tON tOFF 2 s IF, ON 3 (< 10) mA IF, OFF / IF, ON 0.6 (0.5 ... 0.9) - d Reflector with 90% reflexion (Kodak neutral white test card) OHM02257 Zulassiger Arbeitsbereich Operating Conditions Bezeichnung Parameter Versorgungsspannung Supply voltage Ausgangsstrom Output current Symbol Symbol Wert Value 4 ... 18 < 16 Einheit Unit V mA VCC IO Zur Stabilisierung der Versorgung wird ein Stutzkondensator (angeschlossen zwischen VCC und GND) von typ. 0.1 F empfohlen. A bypass capacitor, 0.1 F typical, connected between VCC and GND is recommended in order to stabilize power supply line. 2007-04-02 4 SFH 9240 Active "Low" Anode Voltage Regulator 10 k OUT + - VCC Cathode OHF03902 GND Figure 1 Block Diagram VCC R L = 280 Input VCC = 5 V SFH 9240 OUT OUT C = 0.1 F R = 47 Figure 2 GND GND OHF00520 Test Circuit for Switching and Response Time SFH 9240 (Active "Low") Input 50% t PHL Output t PLH 90% 50% 10% tf Figure 3 2007-04-02 tr OHF03903 Switching Time Definitions 5 SFH 9240 Threshold Current vs. Distance IF = f (d) F 60 mA 50 OHF00684 Relative Threshold Ee, ON/Ee, ON VCC = 5 V = f (VCC) E e, ON 1.5 E e, ON_5 V 1.3 1.2 1.1 OHF00507 Supply Current ICC = f (VCC) I CC 6 mA OHF00510 F, ON (SFH 9240 H L; SFH 9241 L H) L) F, OFF (SFH 9240 L H; SFH 9241 H 40 4 30 1 0.9 3 20 0.8 0.7 0.6 2 10 1 0 0 1 2 3 4 5 6 7 mm 9 0.5 0 5 10 15 V 20 0 0 5 10 15 V 20 d VCC VCC Output Voltage VOL = f (IOUT, VCC) 3.5 VOL V 3 2.5 2 1.5 5V 10 V 15 V 20 V OHF00512 Supply Current vs. Ambient Temperature ICC = f (TA, VCC) I CC 6 mA 5 OHF00514 VCC = 20 V VCC = 15 V VCC = 10 V VCC = 5 V 4 3 2 1 0.5 0 1 0 10 20 30 40 mA 50 0 -25 0 25 50 75 C 100 I OUT TA Perm. Pulse Handling Capability IF = f (tp), Duty cycle D = parameter, TA = 25 C IF 104 mA OHF02623 Perm. Pulse Handling Capability IF = f (tp), Duty cycle D = parameter, TA = 85 C IF 104 mA OHF02622 D = TP t tP IF T D = TP t tP IF T 103 D= 0.005 0.01 0.02 0.05 0.1 103 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.2 102 0.5 1 102 0.5 1 101 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 101 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp tp 2007-04-02 6 SFH 9240 Mazeichnung Package Outlines 0.15 (0.006) 0.13 (0.005) (0.05 (0.002) typ.) 5.8 (0.228) 3.4 (0.134) 3.0 (0.118) (5) 0...0.1 (0...0.004) 0.2 M A 6.2 (0.244) 4.2 (0.165) 3.8 (0.150) B A (1.2 (0.047) typ.) 0.5 (0.020) 0.3 (0.012) (0.4 (0.016) typ.) 1 2 3 6 5 4 Chip Positionen 0.1 M B Empfanger/Receiver GPLY0504 Type SFH 9240 1 Anode 2 OUT (0.1 (0.004) typ.) Sender/Emitter 3 Vcc 1.27 (0.050) Raster (spacing) 2.54 (0.100) Raster (spacing) 4 - 5 GND Cathode Mae in mm (inch) / Dimensions in mm (inch). 2007-04-02 7 2.1 (0.083) 1.7 (0.067) 6 SFH 9240 Empfohlenes Lotpaddesign Recommended Solder Pad Reflow Loten Reflow Soldering 1.27 (0.050) 0.6 (0.024) 1.2 (0.047) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved Heat dissipation 1.27 (0.050) Cu-Flache >5 mm 2 Cu-area >5 mm 2 Lotstopplack Solder resist 3.9 (0.154) OHPY0030 Mae in mm (inch) / Dimensions in mm (inch). 2007-04-02 8 SFH 9240 Lotbedingungen Soldering Conditions Bauform Type Drypack Level acc. to JEDEC A112-A 4 Tauch-, Schwalllotung Dip, Wave Soldering Reflowlotung Reflow Soldering Max. Time in Peak Zone 20 sec. Kolbenlotung Iron Soldering (Iron temp.) Peak Temp. Max. Time in Peak Temp. (solderbath) Peak Zone (package temp.) n. a. - 260 C SFH 9240 n.a. Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 (nach J-STD-020C) (acc. to J-STD-020C) 300 C 255 C 240 C 217 C 200 OHLA0687 T 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C 260 C +0C -5 245 C 5 C C 235 C +5C -0 10 s min 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 100 s max Ramp Down 6 K/s (max) 50 250 s 300 t 2007-04-02 9 SFH 9240 Gurtung / Polaritat und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehause:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel SMT-Components - Package: SMT-RLS Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered 2007-04-02 10 2 |
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