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TIP2955 TIP3055 Complementary power transistors Features Low collector-emitter saturation voltage Complementary NPN - PNP transistors Applications General purpose Audio Amplifier 3 2 1 Description The devices are manufactured in epitaxial-base planar technology and are suitable for audio, power linear and switching applications. TO-247 Figure 1. Internal schematic diagrams Table 1. Device summary Marking TIP2955 TO-247 TIP3055 TIP3055 tube Package Packaging Order code TIP2955 March 2008 . Rev 5 1/7 www.st.com 7 Absolute maximun rating TIP2955 - TIP3055 1 Absolute maximun rating Table 2. Symbol Absolute maximum rating Parameter NPN PNP Value TIP3055 TIP2955 100 70 60 7 15 7 90 -65 to 150 150 V V V V A A W C C Unit VCBO VCER VCEO VEBO IC IB Ptot Tstg TJ Note: Collector-emitter voltage (IE = 0) Collector-emitter voltage (RBE = 100 ) Collector-emitter voltage (IB = 0) Collector-base voltage (IC = 0) Collector current Base current Total dissipation at Tc 25C Storage temperature Max. operating junction temperature For PNP type voltage and current values are negative 2/7 TIP2955 - TIP3055 Electrical characteristics 2 Electrical characteristics (Tcase = 25 C; unless otherwise specified) Table 3. Symbol ICEX Electrical characteristics Parameter Collector cut-off current (VBE = -1.5 V) Collector cut-off current (IB = 0) Emitter cut-off current (IC = 0) Test conditions VCE = 100 V VCE = 100 V VCE = 30 V VEB = 7 V IC = 200 mA IC = 200 mA IC = 4 A IC = 10 A IC = 4 A IC = 4 A IC = 10 A IB = 400 mA IB = 3.3 A VCE = 4 V VCE = 4 V VCE = 4 V 20 5 60 70 1 3 1.8 70 TC = 150 oC Min. Typ. Max. 1 5 0.7 Unit mA mA mA ICEO IEBO 5 mA Collector-emitter sustaining VCEO(sus)(1) voltage (I = 0) B Collector-emitter sustaining VCER(sus)(1) voltage (R = 100 ) BE VCE(sat)(1) VBE(1) hFE(1) Collector-emitter saturation voltage Base-emitter voltage DC current gain V V V V V 1. Pulse duration = 300 s, duty cycle 1.5% Note: For PNP type voltage and current values are negative 3/7 Package mechanical data TIP2955 - TIP3055 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at : www.st.com 4/7 TIP2955 - TIP3055 Package mechanical data TO-247 Mechanical data mm. Min. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 14.80 4.30 Typ Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 Dim. A A1 b b1 b2 c D E e L L1 L2 oP oR S 5/7 Revision history TIP2955 - TIP3055 4 Revision history Table 4. Date 30-Aug-1999 10-Jan-2008 Document revision history Revision 4 5 Package change from TO-218 to TO-247. Changes 6/7 TIP2955 - TIP3055 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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