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No. STSE-CC5029A SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED MODEL : NESW505CT NICHIA CORPORATION -0- Nichia STSE-CC5029A Symbol IF IFP IR PD Topr Tstg Tsld Absolute Maximum Rating 15 50 85 60 -40 ~ +100 -40 ~ +100 Reflow Soldering : 260C Dip Soldering : 260C Hand Soldering : 350C (Ta=25C) Unit mA mA mA mW C C for 10sec. for 10sec. for 3sec. IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=10[mA] IF=10[mA] IF=10[mA] IF=10[mA] Typ. (3.6) (600) 0.31 0.32 (Ta=25C) Max. Unit 4.0 V mcd (Ta=25C) Max. Unit 1000 mcd 720 mcd 500 mcd (3) Ranking Item Luminous Intensity Rank T Rank S Rank R Symbol Iv Iv Iv Condition IF=10[mA] IF=10[mA] IF=10[mA] Min. 720 500 360 Luminous Intensity Measurement allowance is 10%. Color Ranks x y x y 0.280 0.248 0.296 0.276 Rank a0 0.264 0.283 0.267 0.305 Rank b2 0.287 0.330 0.295 0.339 0.296 0.276 0.330 0.318 x y x y 0.287 0.295 0.330 0.318 (IF=10mA,Ta=25C) Rank b1 0.283 0.330 0.330 0.305 0.360 0.339 Rank c0 0.330 0.361 0.360 0.385 0.356 0.351 Color Coordinates Measurement allowance is 0.01. One delivery will include up to two consecutive color ranks and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. -1- Nichia STSE-CC5029A 2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure's page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure's page. Material as follows ; Package : Encapsulating Resin : Electrodes : Heat-Resistant Polymer Epoxy Resin (with Diffused + Phosphor) Ag Plating Copper Alloy 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STSE-CC5029A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Dip Soldering) Solderability (Dip Soldering) Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=235 5C, 2sec. (using flux) Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (using flux, Lead Solder) -40C ~ 100C 1min. (10sec.) 1min. (Pre treatment 30C,70%,168hrs.) -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=15mA Ta=85C, IF=7.2mA 60C, RH=90%, IF=7.5mA Ta=-40C, IF=10mA JEITA ED-4701 500 501 JEITA ED-4701 400 403 JEITA ED-4701 300 304 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 200m/s2, 100 ~ 2000Hz (Sweep 4min.) 48min., 3directions 75cm R=1.5k, C=100pF Test Voltage=2kV Note 1 time Number of Damaged 0/22 1 time over 95% 2 times 0/22 0/22 1 time over 95% 100 cycles 0/22 0/100 Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1 time 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/22 Vibration Drop Electrostatic Discharge 4 times 3 times 3 times Negative/Positive 0/10 0/10 0/22 (2) CRITERIA FOR JUDGING THE DAMAGE Criteria for Judgement Item Forward Voltage Luminous Intensity Condition 1 Luminous Intensity Condition 2 Symbol VF IV IV Test Conditions IF=10mA IF=10mA IF=10mA Min. L.S.L.**) L.S.L.**) 0.7 0.5 Max. U.S.L.*) 1.1 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level --3-3 These test items are judged by the criteria of Luminous Intensity Condition 2. Nichia STSE-CC5029A 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrode sections are comprised of a silver plated copper alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC5029A Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 260C Max. 240C Max. 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) Dip Soldering Pre-heat Pre-heat time Solder bath temperature Dipping time 100C Max. 60 sec. Max. 260C Max. 10 sec. Max. Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only) After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. <1 : Lead Solder> 2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max. Above 200C <2 : Lead-free Solder> 1~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max. Above 220C 240C Max. 10sec. Max. 1~ 5C / sec. 260C Max. 10sec. Max. 2.5 ~ 5C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] Use the following conditions shown in the figure. 8.8 4.0 2.9 2.9 4.0 2.0 (0.25) (1.5) (Unit : mm) : Solder resist * Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board. (5) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- 4.0 Nichia STSE-CC5029A -6- Nichia STSE-CC5029A ICI Chromaticity Diagram 0.9 520 530 0.8 510 0.7 550 540 560 0.6 570 500 0.5 580 590 0.4 600 y b1 0.3 490 c0 b2 610 620 630 a0 0.2 0.1 480 470 460 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 x ! Color Coordinates Measurement allowance is 0.01. -7- Forward Voltage vs. Forward Current 100 Forward Current IFP (mA) 50 20 10 5 Relative Luminosity (a.u.) Ta=25C Forward Current vs. Relative Luminosity Allowable Forward Current IFP (mA) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 60 Forward Current IFP (mA) Ta=25C Duty Ratio vs. Allowable Forward Current 100 Ta=25C 50 20 15 10 1 5 10 20 50 100 Duty Ratio (%) 1 2.5 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) Ambient Temperature vs. Forward Voltage Relative Luminosity (a.u.) Ambient Temperature vs. Relative Luminosity 2.0 Allowable Forward Current IF (mA) IFP=10mA 1.0 Ambient Temperature vs. Allowable Forward Current 25 20 15 10 5 2.5 0 Forward Voltage VF (V) -8- 5.0 4.6 4.2 3.8 3.4 3.0 2.6 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=10mA 0.5 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) 0 20 40 60 80 100 Ambient Temperature Ta (C) Nichia STSE-CC5029A Model NESW505C NICHIA CORPORATION Title No. CHARACTERISTICS 050311537901 Forward Current vs. Chromaticity Coordinate Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25C IF=10mA 0.35 0.34 0.33 1mA 5mA 10mA 50mA Ta=25C y 0.32 0.31 0.30 0.29 0.30 0.31 0.32 0.33 0.34 x Ambient Temperature vs. Chromaticity Coordinate IFP=10mA Directivity 1.0 Relative Luminosity (a.u.) Y 0.35 0.34 0.33 -40C 0C 25C 50C 85C 0 Ta=25C IFP=10mA X-X Y-Y 10 20 X X Y y -9- 30 40 50 0.5 60 70 80 0.32 0.31 0.30 0.29 0.30 0.31 0.32 0.33 0.34 x 0 90 60 30 Radiation Angle 0 0.5 90 1.0 Nichia STSE-CC5029A Model NESW505C NICHIA CORPORATION Title No. CHARACTERISTICS 050311537921 4.2 Internal Circuit Protection device A ITEM MATERIALS Heat-Resistant Polymer Epoxy Resin (with Diffused + Phosphor) Ag Plating Copper Alloy PACKAGE ENCAPSULATING RESIN (0.7) 3 (1) ELECTRODES 4.5 (4) Cathode mark (0.5) K NxSW505C has a protection device built in as a protection circuit against static electricity. (2.2) 0.63 1.25 2.65 2.5 3 1 1.8 -10- Nichia STSE-CC5029A Cathode 1.55 (1.2) 4.3 1.55 Anode Model NxSW505C Unit mm 10/1 Scale Allow 0.2 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 050311537941 Taping part 1.5+0.1 -0 80.1 20.1 40.1 1.750.1 0.30.05 Reel part 3300.2 17.51 13.50.5 Cathode mark 5.50.05 12+0.2 - 0.1 4.750.1 2 1 0.8 13 0.2 2 70 1.5+0.2 -0 3.250.1 3.350.1 Label XXXX LED Reel end of tape No LEDs TYPE NxSx505xT LOT XXXXXXQTY pcs LEDs mounting part No LEDs 801 Pull direction Top cover tape -11Reel Lead Min.40mm (No LEDs) Reel Lead Min.320mm(No LEDs is more than 40) Reel Lead Min.400mm Embossed carrier tape Nichia STSE-CC5029A 2,500pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NxSx505xT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 050311537961 Nichia STSE-CC5029A Moisture proof foil bag Reel Label Seal NICHIA XXXX LED TYPE LOT QTY NxSx505xT xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material Empty space in the box is filled with cushion material. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NxSx505xT PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,500 MAX. Reel/box 4reel MAX. Cardboard box S 3 12reel MAX. Quantity/box (pcs) 10,000 MAX. 30,000 MAX. Dimensions (mm) 380 380 135 4t 400 400 560 4t Model NxSx505xT NICHIA CORPORATION Title No. PACKING 050311537981 -12- |
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