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| BRUS7 MINIBRIDGE 50 ns. ULTRA-FAST RECOVERY Approximately 25 AMPERES* SINGLE-PHASE, FULL-WAVE BRIDGES SPACE SAVING IN-LINE DESIGN INTEGRALLY MOLDED HEAT SINKS PROVIDE LOW THERMAL RESISTANCE This product has recognition under the component program of Underwriters Laboratories, inc. PRV/LEG TYPE NUMBER 50V BRUS705 100V BRUS710 200V BRUS720 400V BRUS740 500V BRUS750 600V BRUS760 ELECTRICAL CHARACTERISTICS PER LEG (at TA=25 C U nle ss O the rwis e Sp eci fie d) C Average Output Current, lo @ 60 C T O BRUS7 25 1.5 10 200 50 320 1.5 typ. -55 to+150 -55 to+150 UNITS Amps Volts Max.Forward Voltage Drop, VF @ IF=12A pk Max.DC Reverse Current @ PRV and 25 C , I R Max.DC Reverse Current @ PRV and 100 C ,I R Max.Reverse Recovery Time,Trr (Fig.3) Max.Peak Surge Current, lFSM (8.3ms) Thermal Resistance (Total Bridge), R0 j-c A A Nanosec. Amps o C/W o Storage Temperature Range, TSTG Ambient Operating Temperature Range,TA C C o Note 1:Derate Io by 20% for capacitive loads NOTE: Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250 OC. EDI reserves the right to change these specifications at any time without notice. BRUS7 FIG.1 CURRENT DERATING 60 lO.AVERAGE FORWARD CURRENT(AMP) L REDUCE RATING B Y 20% FOR C APACATIVE LOADS FIG.2 NON-REPETITIVE SURGE CURRENT 1000 500 MAX.PEAK SURGE CURRENT IFSM 50 BRIDGE OUTPUT RES.-IND. LOADS 40 200 100 30 20 50 10 20 0 0 25 50 75 100 O 10 125 150 1 2 5 10 20 50 100 TC =TEMPERATURE ( C) NUMBER OF CYCLES AT 60 CPS FIG. 3 REVERSE RECOVERY TEST METHOD T RR ZERO 0.5A REFERENCE R1 50 OHM D.U.T. PULSE GENERATOR R2 1 OHM SCOPE 1.0A 0.25A - R1, R2 NON-INDUCTIVE RESISTORS PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV. IKC REP.RA TE, 10 SEC. PULSE WIDTH ADJUST PULSE AMPLITUDE FOR PEAK IR BRUS7 MECHANICAL OUTLINE Dielectric test voltage 2500 volts rms, max. 50-60Hz. .405 MAX .193 DIA THRU HOLE + 1.125 SQ METAL HEAT SINK _ AC + .625 MIN .750 MIN .050 DIA.TYP. 1/8 NOM. .20TYP ON CENTERS ALL DIMENSIONS IN INCHES NOTE: 1. Corrosion resistant terminals designed for .250 female quick connector, wrap around or solder. 2. A thin film of silicone thermal compound is recommended between the Minibridge R case and mounting surface for improved thermal conduction. 3. Higher dielectric strengths available. Consult factory. ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951. 21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828 Ee-mail:sales@edidiodes.com *Wwebsite: http://www.edidiodes.com |
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