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STP12NM50 - STP12NM50FP STB12NM50 - STB12NM50-1 N-channel 550V @ tjmax - 0.30 - 12A TO-220/FP/D2/I2PAK MDmeshTM Power MOSFET General features Type STB12NM50 STB12NM50-1 STP12NM50 STP12NM50FP VDSS (@Tjmax) 550V 550V 550V 550V RDS(on) <0.35 <0.35 <0.35 <0.35 ID 12A 12A 12A 12A 3 1 3 1 2 3 1 2 TO-220 TO-220FP High dv/dt and avalanche capabilities Low input capacitance and gate charge 100% avalanche tested Low gate input resistance Tight process control and high manufacturing yields DPAK 3 12 IPAK Internal schematic diagram Description The MDmeshTM is a new revolutionary MOSFET technology that associates the Multiple Drain process with the Company's PowerMESHTM horizontal layout. The resulting product has an outstanding low on-resistance, impressively high dv/dt and excellent avalanche characteristics. The adoption of the Company's proprietary strip technique yields overall dynamic performance that is significantly better than that of similar competition's products. Applications Switching application Order codes Part number STB12NM50T4 STB12NM50-1 STP12NM50 STP12NM50FP Marking B12NM50 B12NM50 P12NM50 P12NM50FP Package DPAK IPAK TO-220 TO-220FP Packaging Tape & reel Tube Tube Tube July 2006 Rev 11 1/17 www.st.com 17 Contents STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 6 Test circuit ................................................ 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Electrical ratings 1 Electrical ratings Table 1. Symbol Absolute maximum ratings Value Parameter TO-220/DPAK/IPAK 30 12 7.5 48 160 1.28 -15 -65 to 150 12 (1) (1) Unit TO-220FP V A A A W W/C V V/ns C VGS ID ID IDM(2) PTOT Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC=100C Drain current (pulsed) Total dissipation at TC = 25C Derating Factor 7.5 48(1) 35 0.28 2500 VISO dv/dt(3) TJ Tstg Insulation winthstand voltage (DC) Peak diode recovery voltage slope Operating junction temperature Storage temperature 1. Limited only by maximum temperature allowed 2. Pulse width limited by safe operating area 3. ISD 12A, di/dt 400A/s, VDD =80%V(BR)DSS Table 2. Thermal data Value Symbol Parameter TO-220/DPAK/ I PAK Unit TO-220FP 3.57 C/W C/W C Rthj-case Rthj-a Tl Thermal resistance junction-case Max Thermal resistance junction-ambient Max Maximum lead temperature for soldering purpose 0.78 62.5 300 Table 3. Symbol IAS EAS Avalanche characteristics Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) Single pulse avalanche energy (starting Tj=25C, Id=Iar, Vdd=50V) Value 6 400 Unit A mJ 3/17 Electrical characteristics STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250 A, VGS= 0 VDS = Max rating, VDS = Max rating @125C VGS = 30V VDS= VGS, ID = 50A VGS= 10V, ID= 6A 3 4 0.30 Min. 500 1 10 100 Typ. Max. Unit V A A nA V 5 0.35 Table 5. Symbol gfs (1) Ciss Coss Crss Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Test conditions VDS =15V, ID = 6A Min. Typ. 5.5 1000 250 20 90 20 10 28 8 18 1.6 39 Max. Unit S pF pF pF pF ns ns nC nC nC VDS =25V, f=1 MHz, VGS=0 Equivalent output Coss eq(2). capacitance td(on) tr Qg Qgs Qgd Rg Turn-on Delay Time Rise Time Total gate charge Gate-source charge Gate-drain charge Gate input resistance VGS=0, VDS =0V to 400V VDD = 250V, ID = 6A, RG = 4.7, VGS = 10V (see Figure 14) VDD=400V, ID = 12A VGS =10V (see Figure 15) f=1MHz Gate DC Bias=0 test signal level=20mV open drain 1. Pulsed: pulse duration=300s, duty cycle 1.5% 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS inceases from 0 to 80% VDSS 4/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Electrical characteristics Table 6. Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD=12A, VGS=0 ISD=12A, di/dt = 100A/s, VDD=100V, Tj=25C (see Figure 16) ISD=12A, di/dt = 100A/s, VDD=100V, Tj=150C (see Figure 16) 270 2.23 16.5 Test conditions Min Typ. Max 11 48 1.5 Unit A A V ns C A Reverse recovery time Reverse recovery charge Reverse recovery current 340 3 18 ns C A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% 5/17 Electrical characteristics STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 2.1 Figure 1. Electrical characteristics (curves) Safe operating area Figure 2. Thermal impedance Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP Figure 5. Output characterisics Figure 6. Transfer characteristics 6/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Figure 7. Transconductance Figure 8. Electrical characteristics Static drain-source on resistance Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature Figure 12. Normalized on resistance vs temperature 7/17 Electrical characteristics Figure 13. Source-drain diode forward characteristics STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 8/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Test circuit 3 Test circuit Figure 15. Gate charge test circuit Figure 14. Switching times test circuit for resistive load Figure 16. Test circuit for inductive load Figure 17. Unclamped Inductive load test switching and diode recovery times circuit Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform 9/17 Package mechanical data STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Package mechanical data TO-220 MECHANICAL DATA DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154 oP Q 11/17 Package mechanical data STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 TO-220FP MECHANICAL DATA mm. MIN. 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 16 28.6 9.8 2.9 15.9 9 3 30.6 10.6 3.6 16.4 9.3 3.2 1.126 .0385 0.114 0.626 0.354 0.118 TYP MAX. 4.6 2.7 2.75 0.7 1 1.7 1.7 5.2 2.7 10.4 MIN. 0.173 0.098 0.098 0.017 0.030 0.045 0.045 0.195 0.094 0.393 0.630 1.204 0.417 0.141 0.645 0.366 0.126 inch TYP. MAX. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.204 0.106 0.409 DIM. A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 O A B L3 L6 L7 F1 F D G1 H F2 L2 L5 E 123 L4 12/17 G STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0 4.88 15 1.27 1.4 2.4 0.4 4 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch 3 1 13/17 Package mechanical data STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 TO-262 (I2PAK) MECHANICAL DATA mm. DIM. MIN. A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 TYP MAX. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 MIN. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 TYP. MAX. 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 inch 14/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Packaging mechanical data 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 15/17 Revision history STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 6 Revision history Table 7. Date 14-Mar-2004 15-Feb-2006 05-Apr-2006 27-Jul-2006 Revision history Revision 8 9 10 11 Preliminary version New voltage value on first page at tjmax. Inserted ecopack indication New template, no content change Changes 16/17 STP12NM50-STP12NM50FP-STB12NM50-STB12NM50-1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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