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TC9350BFN-T00,TC9350BFN-T01
TOSHIBA CMOS Type Integrated Circuit Silicon Monolithic
TC9350BFN-T00,TC9350BFN-T01
USB Mouse Controller IC
The TC9350BFN is a USB 1.1 mouse controller IC. It can communicate with Agilent's ADNS-2610 optical mouse sensor.
Features
* * * Conforms to USB HID specification version 1.1 Supports Agilent's ADNS-2610 optical mouse sensor. The TC9350BFN-T00 enables the built-in pull-up resistors of the encoder input pins (PT3A, PT3B) when the mouse is operating. It is suitable for a mechanical encoder. (The pull-up resistors are disabled in suspend mode.) Weight: 0.07 g (typ.)
* *
The TC9350BFN-T01 maintains the encoder input pins (PT3A, PT3B) always in high-impedance state. It is suitable for an optical encoder (phototransistor and LED). Input/output ports USB input/output driver: 2 pins (DP/DM) Switch input: 3 pins (SW1, SW2, SW3) Serial port clock output: 1 pin (SCK) Serial data input/output: 1 pin (SDIO) VDD control (for controlling the power supply for the ADNS-2610 optical mouse sensor): 1 pin (VCNT) Encoder input: 2 pins (PT3A, PT3B) LED driver: 1 pin (LED) Operating voltage: 4.35 to 5.25 V Operating temperature: 0 to 70C Operating frequency: 6 MHz 0.6-m CMOS monolithic IC Small package: SSOP16: SSOP16-P-225-0.65B
* * * * *
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Pin Description
Symbol SW1 SW2 SW3 SCK SDIO VCNT NU PT3A PT3B LED DM DP VDD GND XOUT XIN I/O I I I O I/O O I I I O I/O I/O O I Pin No. 15 14 2 4 3 6 5 12 13 7 9 10 11 8 1 16 Description Switch input pin 1 (left switch signal input pin). Switch input pin 2 (middle switch signal input pin). Switch input pin 3 (right switch signal input pin). Serial port clock (output) pin. Serial data input and output pin. VDD (Optical Sensor) Control pin (for controlling the power supply for the ADNS-2610 optical mouse sensor). No use (please connect to GND). Encoder input pin A. Encoder input pin B. LED driver output. USB DM pin. USB DP pin. Power supply pin. Ground pin. Ceramic resonator output pin. Ceramic resonator input pin.
Pin Assignment (top view)
XOUT SW3 SDIO SCK (Connect to GND) NU VCNT LED GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
XIN SW1 SW2 PT3B PT3A VDD DP DM
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Pin Explanation
Symbol VDD GND XIN XOUT LED 5 V power supply. Guaranteed 4.35 to 5.25 V. Ground. Connected to a 6-MHz ceramic resonator (ceramic resonator input pin). Connected to a 6-MHz ceramic resonator (ceramic resonator output pin). When the mouse is operating, the LED is always turned on by current drive with N-MOS turned on. The sink current is 50 mA maximum. Current drive is turned off in suspend mode. Connected to the buttons (left, middle, and right) of the mouse. Pulled up to VDD by built-in resistors. To prevent chattering noise, the SW signals are not recognized until 15 ms after the first change in their state, allowing the signals to be sufficiently stabilized before entering the internal circuit. The pins are assigned to the mouse switches as follows: SW1: Left switch SW2: Middle switch SW3: Right switch Serial port clock (output) pin. Serial data input and output pin. VDD control pin (for controlling the power supply for the ADNS-2610 optical mouse sensor) When the mouse is operating, the TC9350BFN supplies power to the optical mouse sensor via an external transistor by current drive with N-MOS turned on. In suspend mode, N-MOS is turned off, stopping power supply to the optical mouse sensor. No use pin. Please connect to GND. Encoder input pins. PT3A and PT3B are used as scroll pins. Data is sampled at intervals of 100 s. The TC9350BFN-T00 enables the built-in pull-up resistors of the encoder input pins (PT3A, PT3B) when the mouse is operating. It is suitable for a mechanical encoder. (The pull-up resistors are disabled in suspend mode.) When using a mechanical encoder, it is recommended to use an external capacitor to reduce chattering and bouncing. In stable state, PT3A = PT3B. The TC9350BFN-T01 maintains the encoder input pins (PT3A, PT3B) always in high-impedance state. It is suitable for an optical encoder (phototransistor and LED). It connects with the both-directions data bus line of USB. Description
SW [1:3]
SCK SDIO
VCNT
NU
PT3A/B
DP, DM
Note:
Any short circuit (between adjacent pins or between a pin and VCC or ground) or misinsertion of pins may damage the IC chip. When designing an application and mounting the chip, be careful not to apply overvoltage or overcurrent to peripheral components.
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Symbol
I/O
Pin No.
Description
Circuit
SW1
I
15
Switch input 1 (left).
VDD
SW2
I
14
Switch input 2 (middle). (SW [1-3])
(Signal) GND
SW3
I
2
Switch input 3 (right).
VDD PT3A I 12 Encoder input pins A.
(PT3A/B) PT3B I 13 Encoder input pins B.
(Signal)
GND
VDD SDIO I/O 3 Serial data input and output. (Signal) (SDIO) GND
VDD SCK O 4 Serial port clock (output).
(SCK) GND
VDD LED O 7 LED driver output.
(LED) GND
VDD VCNT O 6 VDD Control pin. (Controling the power supply for the Optical Mouse Sensor).
(VCNT) GND
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Symbol I/O Pin No. Description Circuit VDD (Signal) DM I/O 9 USB DM pin. (Signal) (DM) (DP) GND (Signal)
VDD (Signal) (Signal) DP I/O 10 USB DP pin. (DP) (DM) GND VDD GND 11 8 Power supply. Ground. VDD XOUT O 1 Ceramic resonator out. (XIN) GND VDD XIN I 16 Ceramic resonator in. (Signal)
(XOUT) GND
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Block Diagram
Resonator 6 MHz (2 pin) Internal OSC 300 kHz Control logic Clock generator 6 MHz LED port 14 bit timer SDIO port SCK port LED (1 pin) SDIO (1 pin) SCK (1 pin)
Power on reset
USB data I/O port
Switch input port
Encoder input port
VDD_CNTL port
(4 pin) D+, D- Vbus/GND
(3 pin) SW [1:3]
(2 pin) PT3A/B
(1 pin) VCNT
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Example of Circuit
TC9350BFN-T00
TR1 REB1 C RB1 C
Resonator (6 MHz) USB cable 7.5 k VBUS D- D+ GND SLD XOUT SW3 SDIO SCK NU VCNT LED GND 1 2 3 4 5 6 7 8 C 16 15 14 13 12 11 10 9 C XIN SW1 SW2 PT3B PT3A VDD DP DM C 8 REFA OSC_OUT GND 6 2 Wheel encoder ADNS 2610 3 4 SDIO TR2 24 MHz SCK LED_CNTL OSC_IN Sur face 5 RB2 1 7 VDD Image sensor LED1
RLED1
REB2
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TC9350BFN-T01
TR1 REB1 C RB1 C
Resonator (6 MHz) USB cable 7.5 k VBUS D- D+ GND SLD XOUT SW3 SDIO SCK NU VCNT LED GND 1 2 3 4 5 6 7 8 C 16 15 14 13 12 11 10 9 C XIN SW1 SW2 PT3B PT3A VDD DP DM C 8 REFA OSC_OUT GND 6 2 ADNS 2610 PhotoTr. (wheel) LED2 RLED2 7 VDD Image sensor SDIO TR2 24 MHz SCK LED_CNTL OSC_IN Sur face 5 RB2 1 LED1
3 4
RLED1
REB2
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Maximum Ratings (Ta = 25C)
Characteristics Storage temperature range Operating ambient temperature range Power supply voltage DC input voltage DC output voltage at high impedance LED output pin current VCNT output pin current SDIO output pin current SCK output pin current Power consumption Elector static destruction Latch up current Symbol Tstg TA VDD VIN VOUT ILED IVCNT ISDIO ISCK PD VESD ILATCH Rating -40~ + 150 0~ + 70 -0.5~ + 5.5 -0.5~ VDD + 0.25 -0.5~ VDD + 0.25 70 7 5 5 100 MIL: -2 k~ + 2 k 200 Unit C C V V V mA mA mA mA mW V mA
Electrical Characteristics (Ta = 25C)
(1) General
Characteristics Power supply voltage 2 Power supply current (normal operation) Power supply current (suspend mode) Symbol VDD IDD ISB IC only. IC only. Test Condition Min 4.35 Typ. 5.0 Max 5.25 5 250 Unit V mA A
(2) USB interface
Characteristics Output High voltage Output Low voltage Differential signal input common mode range A receiving part single end input threshold voltage Data rising time Data falling time Rising/Falling matching Output cross voltage Symbol VOH VOL VCM VSE TR TF TLRFM VCRS C = 350 pF (10% to 90%) C = 350 pF (10% to 90%) Test Condition Min 2.8 0.8 0.8 75 75 80 1.3 Typ. Max 3.6 0.3 2.5 2.0 300 300 125 2.0 Unit V V V V ns ns % V
Applied to pins DM, DP
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(3) I/O
Characteristics Output low voltage of LED Output low voltage of VCNT Output high voltage of SDIO Output low voltage of SDIO Output high voltage of SCK Output low voltage of SCK Input threshold voltage (SW) Input threshold voltage (PT) Input threshold voltage (SDIO) Leak current Symbol VOLLED VOLVCNT VOHSDIO VOLSDIO VOHSCK VOLSCK VITH1 VITH2 VITH3 IIN Test Condition ILED = 50 mA IVCNT = 5 mA ISDIO = -1 mA ISDIO = 1 mA ISCK = -1 mA ISCK = 1 mA Min VDD - 0.8 VDD - 0.8 25% 30% 30% -1 Typ. Max 0.8 0.8 0.4 0.4 75% 70% 70% 1 Unit V V V V V V VDD VDD VDD A
Applied to pins LED, VCNT, SDIO, SCK, SW1-3, PT3A/B
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Scrolling and the scroll count
The following describes signal processing during scrolling:
<< Scroll signal processing >>
"+1 count" (If the transition of PT3A precedes that of PT3B) (PT3A, PT3B) = (0,0) (1,0) (1,1) or (PT3A, PT3B) = (1,1) (0,1) (0,0) "-1 count" (If the transition of PT3B precedes that of PT3A) (PT3A, PT3B) = (0,0) (0,1) (1,1) or (PT3A, PT3B) = (1,1) (1,0) (0,0)
PT3A : PT3B 0:0
0:1
1:0
PT3A : PT3B 1:1 -1 count +1 count +1 count -1 count
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Package Dimensions
Weight: 0.07 g (typ.)
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Marking (example)
TC9350BFN-T00
50B-T0 215 A1
Type name Weekly code Lot code
TC9350BFN-T01
50B-T1 215 A1
Type name Weekly code Lot code
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Appendix A. Recommended mounting of TC9350BFN
Infrared or hot air reflow
Preheat conditions: 140 to 160C, 60 to 120 seconds Reflow conditions: (a) 240C max., (b) 210C min., within 30 seconds Soldering times: Maximum 2 times Temperature profile:
(C) 240
Package surface temperature
210
160 140 60 to 120 seconds 30 seconds or less
Time (in seconds)
Solder flow (single-wave and double-wave)
Preheat conditions: 140 to 160C, 60 to 120 seconds Reflow conditions: 260C max., within 10 seconds (For double-wave, the total time for primary wave and secondary wave must not exceed 10 seconds.) Reflow cannot be performed more than once. The following figure shows the recommended temperature profile. Temperatures described in mounting requirements are based on the solder bath temperature. The temperature profile indicates the maximum withstand temperature. The application must not cause the chip temperature to fall outside the profile range.
(C) 260
Package surface temperature
160 140 60 to 120 seconds 10 seconds or less
Time (in seconds)
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Appendix B. USB Descriptors
Device Descriptor
Offset 0 1 2 4 5 6 7 8 10 12 14 15 16 17 bLength bDescriptorType bcdUSB bDeviceClass bDeviceSubClass bDeviceProtocol bMaxPacketSize0 idVendor idProduct bcdDevice iManufacturer iProduct iSerialNumber bNumConfigurations Field Size 1 1 2 1 1 1 1 2 2 2 1 1 1 1 Value (Hex) 12 01 0110 00 00 00 08 0930 6501 0000 (-T00) 0001 (-T01) 01 02 00 01 Description Size of this descriptor in bytes. Device descriptor type. USB HID Specification Release 1.1. Not supported. Not supported. Protocol depends on selected interface. Maximum packet size on endpoint zero. Vendor ID Product ID Device release number. Index of string descriptor describing manufacture. Index of string descriptor describing product. Not supported. Number of possible configurations.
Configuration Descriptor
Offset 0 1 2 4 5 6 7 8 bLength bDescriptorType wTotalLength bNumInterfaces bConfigurationValue iConfiguration bmAttributes MaxPower Field Size 1 1 2 1 1 1 1 1 Value (Hex) 09 02 0022 01 01 00 A0 32 Description Size of this descriptor in bytes. Configuration descriptor type. Total length of data returned for this configuration including interface, HID, and endpoint. Number of interfaces supported by this configuration. Value to use as an argument to Set Configuration to select this configuration. Not supported. Bus powered and able to perform remote wakeup. Max power
String Descriptor
Index 0 1 2 Size (Character) 2 Max 8 Max 32 Value (Hex) 0409 TOSHIBA USB Wheel Mouse Language ID ASCII Character ASCII Character Description
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Interface Descriptor
Offset 0 1 2 3 4 5 6 7 8 bLength bDescriptorType bInterfaceNumber bAlternateSetting bNumEndpoints bInterfaceClass bInterfaceSubClass bInterfaceProtocol iInterface Field Size 1 1 1 1 1 1 1 1 1 Value (Hex) 09 04 00 00 01 03 01 02 00 Description Size of this descriptor in bytes. Interface descriptor type. Number of interface. Value used to select alternate setting. Number of endpoints. Class code (HID code assigned by USB). Boot interface subclass. Mouse. Not supported.
HID Descriptor
Offset 0 1 2 4 5 6 7 bLength bDescriptorType bcdHID bCountryCode bNumDescriptors bDescriptorType wDescriptorLength Field Size 1 1 2 1 1 1 2 Value (Hex) 09 21 0110 00 01 22 0034 Description Size of this descriptor in bytes. HID descriptor type. HID class specification release number. Country Code USA Number of report descriptors Descriptor Type HID report Descriptor Length
Endpoint Descriptor
Offset 0 1 2 3 4 6 bLength bDescriptorType bEndpointAddress bmAttributes wMaxPacketSize bInterval Field Size 1 1 1 1 2 1 Value (Hex) 07 05 81 03 0004 0A Description Size of this descriptor in bytes. Endpoint descriptor type. The address of the endpoint. Interrupt endpoint. Maximum packet size. Interval for polling endpoint for data transfers.
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HID Report Descriptor
Offset 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 51 Field Usage page Usage Collection Usage Collection Usage page Usage minimum Size 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1 Value (Hex) 0501 0902 A101 0901 A100 0509 1901 2903 1500 2501 9503 7501 8102 9501 7505 8101 0501 0930 0931 0938 1581 257F 7508 9503 8106 C0 C0 Generic Desktop Mouse Application Pointer Linked Buttons Button 1 Button 3 Button open Button close 3 reports Each button report is 1bit. left = bit0, right = bit1, middle = bit2 Variable Data Bit Field with Absolute position 1 report 5 report bits for padding Constant Generic Desktop X Y Scroll -127 127 The x and y reports are 8bit 3 reports Variable, Relative Description
Usage maximum Logical minimum Logical maximum Report count Report size Input Report count Report size Input Usage page Usage Usage Usage Logical minimum Logical maximum Report size Report count Input End collection End collection
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Note:
Any short circuit (between adjacent pins or between a pin and VCC or ground) or misinsertion of pins may damage the IC chip. When designing an application and mounting the chip, be careful not to apply overvoltage or overcurrent to peripheral components.
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
030619EAA
* The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations.
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