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 SiW1721B
0
Features
* Integrated RF transceiver and modem for Bluetooth wireless technology. * Manufactured using low-power 0.18-micron CMOS process technology. * Digital baseband interface connects directly to an integrated Bluetooth controller. * Direct conversion RF architecture improves receiver-blocking performance. * Low out-of-band spurious emissions minimize interference with mobile phone operations. * Hardware AGC dynamically adjusts receiver performance in changing environments. * 50 RF I/O does not need additional external impedance matching components. * On-chip voltage regulation simplifies system design. * -88 dBm receiver sensitivity and +2 dBm transmitter power typical performance specifications. * Bluetooth Specification V2.0 qualified. Complies with Bluetooth specifications V1.1, V1.2 and V2.0.
Reference Clock Ext Power SiW1721B Radio Modem Single-ended LNA ADC and Downconverter Single-ended Driver DAC and Upconverter GFSK Demodulator GFSK Modulator Radio Programming and Control SPI CLK Circuit Analog Regulator Digital Regulator Mobile Phone Chip Set
BLUETOOTH(R) RADIO MODEM
Modem I/F & Data
Reference PLL
Modem Clock Generator
Integrated Bluetooth Baseband
Bluetooth Subsystem Using the SiW1721B Radio Modem
Summary
The SiW1721B is a 2.4-GHz radio transceiver for Bluetooth wireless technology. This highly integrated transceiver is specifically designed for use with a third party Bluetooth baseband controller chipset requiring an external Bluetooth RF transceiver. Due to its low power CMOS process, the design minimizes current draw in both active and standby modes. The SiW1721B combines a radio transceiver and Gaussian Frequency Shift Keying (GFSK) modem with digital control and interface logic. The IC also incorporates analog and digital voltage regulators and a reference Phase Lock Loop (PLL) capable of accepting various reference clock frequencies. The level of integration enables a low system cost with fewer external components. The SiW1721B is packaged in a 5-by-5-mm, Pb-free, 32-pin QFN package that meets RoHS (Green) requirements. Operating temperature range is guaranteed from -40C to +85C.
Applications
* Mobile phones with integrated controller for Bluetooth wireless technology.
Ordering Information
SiW1721B Bluetooth(R) Radio Modem See page 12 for details.
Optimum Technology Matching(R) Applied
Si BJT Si Bi-CMOS GaInP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS
RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com
60 0076 R00F SiW1721B Radio Modem IC DS
October 6, 2006
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SiW1721B
Description
The following figure shows the SiW1721B Radio Modem functional block diagram. During the receive process, the radio signal is taken from the single-ended RF input pin that feeds into the low noise amplifier (LNA). The signal from the LNA is directly down-converted to I/Q baseband, filtered with an anti-aliasing filter, and converted to a digital signal with a high resolution analog-to-digital converter. The critical channel filtering is done in the digital domain for stable and repeatable performance. The signal is then processed by a high performance GFSK demodulator. The IC has multiple internal selfcalibration circuits to maintain stable and repeatable performance from part-to-part as well as over the full temperature range. The IC has two fully integrated regulators: one for the radio (analog regulator) and one for the digital logic (digital regulator). The digital regulator can be used to supply a Bluetooth baseband controller. Both regulators can be bypassed if external regulation is desired.
Note: When bypassing the analog regulator, the VBATT_ANA and VCC_OUT pins must be tied together and the external analog voltage (1.8 V) should be applied to the VBATT_ANA pin. When bypassing the digital regulator, the VBATT_DIG pin should be left unconnected and the external digital voltage (1.8 V) should be applied to the VBB_OUT pin.
The IC also provides power on reset and glitch-free clock start-up. A reference PLL can be enabled to support a number of different reference frequencies. Digital control functions and a programming interface provide radio modem control and a flexible interface to external Bluetooth link controllers.
XTAL_P/CLK VBATT_ANA CHG_PUMP VBATT_DIG VCC_OUT VBB_OUT RESET_N
BB_CLK
VTUNE
PLL Control
Clock Distribution LNA
Voltage Regulators and Power Distribution
ADC 0 90 Internal 50-Ohm Match Network ADC PLL Synthesizer Power Control 0 90 DAC GFSK Modem
RF_IO IDAC
VDD_IO RX_TX_DATA CD_TXEN ENABLE_RM HOP_STROBE TX_RX_SWITCH
TX_BIAS SPI_SS SPI_TXD SPI_RXD SPI_CLK
Serial Programming Interface (SPI)
DAC
Register File
System Control
SiW1721B Block Diagram
Radio Interface An internal power control loop maintains a very stable RF_IO signal level over the full temperature range and from part to part. This means predictable and repeatable range at any temperature. Modem Interface The modem interface transfers the Bluetooth data between the SiW1721B Radio Modem and the ASIC. For reference purposes, the pin description table (Table 1) provides a brief description of typical interface modes. Clock Signals Multiple reference clock frequencies can be used as a reference for the RF circuits, to synthesize clocks for most of the internal digital circuits, and to supply external processors with timing signals. Serial Programming Interface (SPI) The serial programming interface (SPI) is used to access the internal registers of the SiW1721B Radio Modem. The SPI is a synchronous serial interface that can be clocked to a nominal speed of 8MHz. Power The SiW1721B Radio Modem includes both analog and digital voltage regulators. Input options are based on factors such as voltage source, where internal regulators are used, and I/O voltage. 2 of 12 60 0076 R00F SiW1721B Radio Modem IC DS
VCC
SiW1721B
Pin Description
The SiW1721B Radio Modem's radio and modem interface (SPI), a single clock input, and supply voltage are required for proper operation.
Name
RF_IO IDAC
Pad Type
Analog Analog
Description
Combined 50 input and output pin in normal mode. Rx only in power class 1 mode. Power control to external power amplifier. This output provides a variable current source that can be used to control the external power amp. Leave unconnected if not used. Output signal to indicate the current state of the radio. The polarity is programmable with the default set as: Low=Transmit mode. High=Non-transmit mode. Bias for the output driver in normal mode, transmit output in power class 1 mode.
Radio Interface Signal Description
TX_RX_SWITCH TX_BIAS
CMOS output Analog CMOS bi-directional CMOS bi-directional
Modem Interface Description
RX_TX_DATA Received sliced-mode data from radio; or transmit data to radio. Dual function carrier detect and transmit enable. This bi-directional signal can be enabled through internal registers. During transmit, this pin can be used as an INPUT to indicate valid transmit data (TXEN). During receive, this pin can be used as an OUTPUT to indicate carrier detect (CD). Input only, output, or bi-directional. Sleep/wake control signal from baseband controller. Used to command the SiW1721B Radio Modem from idle to sleep mode, and to awaken the SiW1721B Radio Modem from sleep mode. Signal generated by the baseband to indicate the start of TX or RX ramp-up. Reset for digital circuits only. State machines and internal registers reset to their default state. This signal is an asynchronous input with a minimum pulse width requirement of 10 s. System clock crystal positive input or reference clock input. For additional information see the "Crystal Requirements" and "External Reference Requirements" sections. System clock crystal negative input. If a reference clock frequency is used, this pin should be left unconnected. Selectable clock output to external baseband controller. Five frequencies are supported (in MHz): reference frequency, reference frequency/2, 12, 13, 16, 32, 48, and 52. BB_CLK stops oscillating when ENABLE_RM is de-asserted (low). SPI data output from SiW1721B. SPI data input to SiW1721B. Clock input used for synchronous data transfer on the SPI bus. SPI slave select that enables the SiW1721B Radio Modem as the target. Supply voltage to internal analog voltage regulator. Supply voltage to internal digital voltage regulator. Regulated output from internal analog regulator. Regulated output from internal digital regulator. Supply voltage to on-chip analog circuits. Supply voltage to on-chip I/O interface. I/O pins: BB_CLK, CD_TXEN, ENABLE_RM, HOP_STROBE, RESET_N, RX_TX_DATA, SPI_CLK, SPI_RXD, SPI_SS, SPI_TXD, TX_RX_SWITCH. This signal is used to indicate that the internal digital regulator is stable (VBB_OUT). Decoupling capacitor for voltage reference for the internal A/D converter. Decoupling capacitor for voltage reference for the internal A/D converter. Pin for reference PLL loop filter. Pin for RF PLL loop filter.
CD_TXEN
ENABLE_RM HOP_STROBE RESET_N
CMOS input CMOS input CMOS input
Clock Signals Description
XTAL_P/CLK XTAL_N BB_CLK Analog Analog CMOS output
Serial Programming Interface Description
SPI_TXD SPI_RXD SPI_CLK SPI_SS VBATT_ANA VBATT_DIG VCC_OUT VBB_OUT VCC VDD_IO VBB_RDY VREFP_CAP VREFN_CAP VTUNE CHG_PUMP CMOS output CMOS input CMOS input CMOS input Power Power Power Power Power Power CMOS output Analog Analog Analog Analog
Power Signals Description
Other I/O Description
Table 1. SiW1721B Radio Modem Pin List
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SiW1721B
System Specifications Absolute Maximum Ratings
Parameter
VCC VDD_IO VBATT_ANA VBATT_DIG TST RFMAX Analog circuit supply voltage I/O supply voltage Analog regulator supply voltage Digital regulator supply voltage Storage temperature Maximum RF input level
Description
Min
-0.3 -0.3 -0.3 -0.3 -55 -
Max
3.63 3.63 3.63 3.63 +125 +5
Unit
V V V V C dBm
Note: Absolute maximum ratings indicate limits beyond which the useful life of the device may be impaired or damage may occur.
Recommended Operating Conditions
Parameter
TOP VBATT_ANA VBATT_DIG VCC VDD_IO
Description
Operating temperature (industrial grade) Supply for internal analog voltage regulator Supply for internal digital voltage regulator Analog supply voltage Digital interface I/O supply voltage
Min
-40 2.3 2.3 1.71 1.62
Max
+85 3.63 3.63 1.89 3.63
Unit
C V V V V
ESD Rating
Symbol
ESD
1
Description
ESD protection - all pins
1
Rating
2000 V
This device is a high performance RF integrated circuit with an ESD rating of 2,000 volts (HBM conditions per Mil-Std-883, Method 3015). Handling and assembly of this device should only be done using appropriate ESD controlled processes.
Electrical Characteristics
DC Specification (TOP =+25C, VDD_IO =3.0V) Symbol
VIL VIH VOL VOH IOH IOL IILI Input low voltage Input high voltage Output low voltage Output high voltage Output high current Output high current (pins 16, 19) Output low current Output low current (pins 16, 19) Input leakage current
Description
Min.
GND-0.1 0.7*VDD_IO GND 0.8*VDD_IO - - - - -
Typ.
- - - - 500 4 500 4 <1
Max.
0.3*VDD_IO VDD_IO 0.2*VDD_IO VDD_IO - - - - 1
Unit
V V V V A mA A mA A
AC Characteristics (TOP =+25C, VDD_IO =3.0V, CLOAD =15pF) Symbol Description Min.
tr tf Rise time Rise time (pins 16, 19) Fall time Fall time (pins 16, 19) - - - -
Typ.
- - - -
Max.
30 16 24 13
Unit
ns ns ns ns
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Current Consumption (TOP =+25C, VBATT_ANA, VBATT_DIG = 3.3 V) Symbol
IDD_SLEEP IDD_IDLE IDD_TRANSMIT IDD_RECEIVE
Description
Current during sleep mode Current during idle, synthesizer not running Current during continuous transmit Current during continuous receive
Min.
- - - -
Typ.
15 2 41 41
Max.
25 - 45 45
Unit
A mA mA mA
Radio Specification Parameter
VCO operating range PLL lock time Frequency -
Description
Min
2402 -
Typ
- 55
Max
2480 100
Unit
MHz s
Receiver Specification1 (VBATT_ANA, VBATT_DIG =3.3V, VCC =int. analog reg. output, and nominal2 Bluetooth test conditions) Parameter
Receiver sensitivity Maximum usable signal C/I co-channel (0.1% BER) C/I 1MHz (0.1% BER) C/I 2MHz (0.1% BER) C/I 3MHz (0.1% BER) Out-of-band blocking3 Intermodulation Receiver spurious emission
1 2 3
Description
Measured based on BER<0.1% Measured based on BER<0.1%
Min
- -10 - - - - -10 -27 -27 -10 -39 - -
Typ
-88 +5 8.0 -4.0 -38.0 -43 - - - - -36 - -
Max
-82 - 11.0 0 -35.0 -40 - - - - - -57 -47
Unit
dBm dBm dB dB dB dB dBm dBm dBm dBm dBm dBm dBm
Co-channel selectivity Adjacent channel selectivity 2nd adjacent channel selectivity 3rd adjacent channel selectivity 30 MHz to 2000 MHz 2000 MHz to 2399 MHz 2498 MHz to 3000 MHz 3000 MHz to 12.75 GHz Max interferer level to maintain 0.1% BER, interference signals at 3 MHz and 6 MHz offset. 30MHz to 1GHz 1 GHz to 12.75 GHz
Measured into the chip with a 50 source and no band pass filter. Nominal and extreme Bluetooth test conditions as defined by the Bluetooth Test Specification. Out-of-band blocking guaranteed by design.
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SiW1721B
Transmitter Specification1 (VBATT_ANA, VBATT_DIG = 3.3 V, VCC = int. analog reg. output, and nominal Bluetooth test conditions) Parameter
Output RF transmit power Modulation characteristics2 Initial carrier frequency accuracy Carrier frequency drift 20 dB occupied bandwidth In-band spurious emission Out-of-band spurious emission
1Measured 2The 3
Description
At maximum power output level f1avg f2max (For at least 99.9% of all f2max) f1avg/f2avg - One slot packet Two slot packet Five slot packet Max drift rate Bluetooth specification 2 MHz offset >3 MHz offset 30 MHz to 1 GHz, operating mode 1 GHz to 12.75 GHz, operating mode3 1.8 GHz to 1.9 GHz 5.15 GHz to 5.3 GHz
Min
-2 140 115 0.8 -75.0 -25.0 -40.0 -40.0 - - - - - - - -
Typ
+2 155 - - - - - - - 900 -74 -74 -70 -70 - -
Max
+6 175 - - +75.0 +25.0 +40.0 +40.0 400 1000 -55.0 -55.0 -55.0 -50.0 -62.0 -47.0
Units
dBm kHz kHz kHz kHz kHz kHz kHz Hz/s kHz dBm dBm dBm dBm dBm dBm
into the chip with a 50 source and no band pass filter.
modulation characteristic is measured as per test TRM/CA/07/C defined in the Bluetooth Test Specification.
Except transmit harmonics.
Industrial Temperature Performance1 (VBATT_ANA, VBATT_DIG =3.3V and extreme Bluetooth test conditions) Parameter
Receiver sensitivity Output RF transmit power Modulation characteristics2 Initial carrier frequency accuracy Carrier frequency drift 20 dB occupied bandwidth In-band spurious emission Out-of-band spurious emission
1 2 3
Description
Measured based on BER<0.1% At maximum power output level f1avg f2max (For at least 99.9% of all f2max) f1avg/f2avg - One slot packet Two slot packet Five slot packet Max drift rate Bluetooth specification 2MHz offset >3MHz offset 30MHz to 1GHz, operating mode 1GHz to 12.75GHz, operating mode3 1.8GHz to 1.9GHz 5.15GHz to 5.3GHz
Min
- -4 140 115 0.8 -75.0 -25.0 -40.0 -40.0 - - - - - - - -
Typ
-88
+2 155 - - - - - - - 900 -74 -74 -70 -70 - -
Max
-78
+6 175 - - +75.0 +25.0 +40.0 +40.0 +400 1000 -40.0 -55.0 -55.0 -40.0 -62.0 -47.0
Unit
dBm dBm kHz kHz kHz kHz kHz kHz kHz Hz/s kHz dBm dBm dBm dBm dBm dBm
Measured into the chip with a 50 source and no band pass filter. The modulation characteristic is measured as per test TRM/CA/07/C defined in the Bluetooth Test Specification. Except transmit harmonics.
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
External Reference Requirements It is possible to provide a number of reference frequencies that are typical on most cellular phones directly into pin 26 (XTAL_P/CLK) of the SiW1721BFIG. The following reference frequencies (in MHz) can be used: 3.84, 9.6, 12, 12.8, 13, 14.4, 15.36, 16, 16.8, 19.2, 19.68, 19.8, 26, 32, 38.4, and 48. For other frequencies, please contact applications support. Parameter
Phase noise
Description
100 kHz offset 1 kHz offset 10 kHz offset AC coupled amplitude DC coupled low peak voltage DC coupled high peak voltage
Min
- - - 0.5 0 VCC - 0.3
Max
-100 -120 -140 VCC 0.3 VCC
Unit
dBc/Hz dBc/Hz dBc/Hz VP-P V V
Drive level
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SiW1721B
Pin Out
(Top View)
SiW1721BFIG (32-pin QFN)
XTAL_P/CLK 26
TX_BIAS
32 IDAC VREFP_CAP VREFN_CAP VCC_OUT VBATT_ANA VCC VCC CHG_PUMP 1 2 3 4
31
30
29
28
27
25 24 NC 23 HOP_STROBE 22 SPI_SS 21 CD_TXEN
SiW1721B 5 6 7 8 9 ENABLE_RM 10 TX_RX_SWITCH 11 RESET_N 12 SPI_RXD 13 SPI_CLK 14 SPI_TXD 15 VDD_IO 16 BB_CLK
GROUND PAD ON BOTTOM
XTAL_N 20 VBB_READY 19 RX_TX_DATA 18 VBATT_DIG 17 VBB_OUT
VTUNE
RF_IO
VCC
VCC
Note: NC indicates "no connect" or unused pins.
Pin Assignments
Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Pin Name
IDAC VREFP_CAP VREFN_CAP VCC_OUT VBATT_ANA VCC VCC CHG_PUMP ENABLE_RM TX_RX_SWITCH RESET_N SPI_RXD SPI_CLK SPI_TXD VDD_IO BB_CLK 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
VCC
Pin
Pin Name
VBB_OUT VBATT_DIG RX_TX_DATA VBB_READY CD_TXEN SPI_SS HOP_STROBE NC XTAL_N XTAL_P/CLK VCC VTUNE VCC TX_BIAS RF_IO VCC
Note:
NC indicates no connect.
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Radio Modem Application Circuit for Plastic QFN Package (SiW1721BFIG)
C1
ANTENNA
Place L1 close to pin 30 of the SiW1721B. Place C1 as close as possible to L1 and ensure the ground of C1 is as close as possible to the paddle of the SiW1721B.
FL1 4 OUT IN 2
8.2pF L1 2.7nH
3
Y1 OSC, CRYSTAL 32MHz 1
C3 18pF
C2 18pF
LFB312G45SG2A509
Keep the traces from C2 and C3 to pins 25 and 26 of the SiW1721B short.
32
31
30
29
28
27
26
U1
TX_BIAS
VTUNE
1 L2 2.2nH C6 0.1uF C7 0.1uF VDD_A 2 3 4 5 6 7
XTAL_P/CLK
XTAL_N
RF_IO
VCC
VCC
VCC
25
C4 and C9 must have 1 ohm < ESR < 10 ohms.
C4 1uF
C5 2.7pF
IDAC VREFP_CAP VREFN_CAP VCC_OUT VBATT_ANA VCC VCC TX_RX_SWITCH CHG_PUMP ENABLE_ RM
NC HOP_STROBE SPI_SS
24 23 22 21 20 19 VDD_D 18 17 C9 1uF
HOP_STROBE SPI_SS CD_TXEN VBB_READY RX_BB/TX_BB
SiW1721B 5 mm x 5 mm
CD_TXEN VBB_READY RX_TX_DATA VBATT_DIG VBB_OUT
The ground for C10 needs to be as close as possible to the paddle of the SiW1721B. Keep the traces from R2 and C10 to pin 8 of the SiW1721B short.
RESET_N
SPI_RXD
SPI_TXD
SPI_CLK
C8 1pF C10 22pF
8
10
11
12
13
14
15
16
9
BB_CLK
VDD_IO
C4 and C9 must have 1 ohm < ESR < 10 ohms.
CLK_REF C11 180pF R2 47K
SPI_MIS0 SPI_CLK SPI_MOSI RESET_N ENABLE_RM
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SiW1721B
Packaging and Product Marking
Package Drawing
32-Pin QFN Drawing and Dimensions
NOTES: 1. SHADED AREA INDICATES PIN 1 LOCATION. 2. ALL UNITS ARE IN MILLIMETERS. 3. TOLERANCES: .XX = AS SHOW N .XXX = AS SHOW N
-A5.00 SQ.
2 PLCS .10 C A
2.50 TYP
3
.90 .85 .70 .65
.05 C .10 .60 .24 TYP .30 2 .18
PIN 1 ID R.20
CAB
.10 C B 2 PLCS 12 MAX .10 C B 2 PLCS -B-C2.37 TYP 4.75 SQ. .10 C A 2 PLCS
.05 .00
3.65 SQ. 3.35
.50 .30
SEATING PLANE
.50
Product Marking
32-Pin QFN Drawing
5 x 5 mm, 32-Pin QFN
1721BFIG YYWW Trace Code
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Carriers
Tape and Reel SiW1721BFIG, 5 X 5 mm, 32-Pin QFN, Tape and Reel Details Carrier tape basic dimensions are based on EIA 481. The pocket is designed to hold the part for shipping and loading onto SMT manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. The individual pocket design can vary from vendor to vendor, but width and pitch will be consistent.
Carrier tape is wound or placed onto a shipping reel either 330 mm (13 inches) in diameter or 178 mm (7 inches) in diameter. The center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary stress on the parts. Prior to shipping, moisture sensitive parts (MSL level 2a-5a) are baked and placed into the pockets of the carrier tape. A cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier ESD bag, which is placed in a cardboard shipping box. It is important to note that unused moisture sensitive parts need to be resealed in the moisture barrier bag. If the reels exceed the exposure limit and need to be baked, most carrier tape and shipping reels are not rated as bakeable at 125C. If baking is required, devices may be baked according to section 4, table 4-1, column 8, of the Joint Industry Standard IPC/JEDEC J-STD-033A. The following tables provide useful information for carrier tape and reels used for shipping the devices described in this document.
RFMD Part Number
SiW1721BFIG-TR13 SiW1721BFIGSR
Reel Diameter Inch (mm)
13 (330) 7 (178)
Hub Diameter Inch (mm)
4 (102) 2.4 (61)
Width (mm)
12 12
Pocket Pitch (mm)
8 8
Feed
Single Single
Units
2500/reel 100/reel
Peel Test
10-50 grams
Peel Angle
165-180
Cover Tape
RS Standard (anti-static)
Leader
500 mm (minimum 400 mm)
Trailer
250 mm (minimum 160 mm)
Peel Speed
300 mm/minute
Notes: 1. All dimensions are in millimeters (mm). 2. Unless otherwise specified, all dimension tolerances per EIA-481.
Ao = 5.30 .10 Bo = 5.30 .10 F = 5.50 .05 Ko = 1.83 .10 P = 8.00 .10 W = 12.00 +.30/-.10
4.00 .10 2.00 .05 O1.50.10 1.75 .10 0.330.020
15-inch Trailer
Pin 1 Location
Part Number YYWW Trace Code Part Number YYWW Trace Code
Top View
15-inch Leader
Sprocket holes toward rear of reel
F
Part Number YYWW Trace Code Part Number YYWW Trace Code Part Number YYWW Trace Code
W
Bo
P
Ao
Ko
Direction of Feed
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SiW1721B
Ordering Information
Part Number
SiW1721BFIG-T13 SiW1721BFIGSR SiW1721BFIG SIW1721BFIGSB
1
Operational Temperature Range1
Industrial Industrial Industrial Industrial
Package
32-pin QFN 32-pin QFN 32-pin QFN 32-pin QFN
Ordering Quantity
2500/reel 100/reel 25/sample bag 5/sample bag
Industrial temperature range: -40C to +85C.
The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RF Micro Devices, Inc. RF Micro Devices reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, UltimateBlueTM, and the SiW product name prefix are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RF Micro Devices, Inc. All other trade names, trademarks and registered trademarks are the property of their respective owners.
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60 0076 R00F SiW1721B Radio Modem IC DS


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