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| TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency Rev. 03 -- 15 August 2005 Preliminary data sheet 1. General description The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs) with complementary outputs. They convert the digital input signals into analog current outputs at a maximum conversion rate of 330 MHz. The DACs are based on current source architecture. A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by the video DAC to be synchronized. The TDA8777 has a Power-down mode to reduce power consumption during inactive periods. The TDA8777 is fabricated in a CMOS process that ensures high functionality with low power dissipation. 2. Features s s s s s s s s s s s Triple 10-bit DAC Sampling frequency up to 330 MHz Internal voltage reference (1.21 V) Complementary outputs Direct drive of double terminated 75 load into standard level TTL compatible input Sync and blank control inputs Analog output current source Power-down mode 3.3 V power supply LQFP48 package 3. Applications s s s s PC video cards High resolution image processing Digital video systems General purpose high-speed digital-to-analog conversion Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 4. Quick reference data Table 1: Symbol VDDA IDDA INL DNL fCLK Quick reference data Parameter analog supply voltage analog supply current integral non-linearity differential non-linearity clock frequency TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 Ptot Ipd total power dissipation current in Power-down mode 297 20 140 240 330 MHz MHz MHz mW mA Conditions Min 3.0 -2 -1 Typ 3.3 90 Max 3.6 +2 +1 Unit V mA LSB LSB 5. Ordering information Table 2: Ordering information Package Name TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 LQFP48 Description plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm Version Sampling frequency Type number SOT313-2 140 MHz 240 MHz 330 MHz TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 2 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 6. Block diagram VSSA2 VSSA1 PSAVE RSET COMP VDDA3 VDDA2 VDDA1 48-39 30 29 13 POR 26 25 38 37 35 36 TDA8777 10 CURRENT/VOLTAGE REFERENCE Vref + Iref Iref 34 10-BIT DAC Vref + Iref 33 VREF red digital inputs (bits R9 to R0) 10 10 OUTR OUTR green digital inputs (bits G9 to G0) 10-1 10 TRIPLE MULTIPLEXER 10 BLANKING 10 INSERT 32 10-BIT DAC SYNC INSERT 31 OUTG OUTG Vref + Iref 23-14 blue digital inputs (bits B9 to B0) 10 10 10 10-BIT DAC sync DAC CONTROL MODULE 24 CLK 11 BLANK 12 SYNC 28 27 OUTB OUTB mle290 Fig 1. Block diagram TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 3 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 7. Pinning information 7.1 Pinning 38 PSAVE G0 G1 G2 G3 G4 G5 G6 G7 G8 1 2 3 4 5 6 7 8 9 37 RSET 36 VREF 35 COMP 34 OUTR 33 OUTR 32 OUTG 31 OUTG 30 VDDA3 29 VDDA2 28 OUTB 27 OUTB 26 VSSA2 25 VSSA1 CLK 24 001aad432 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. 48 R9 47 R8 46 R7 45 R6 44 R5 43 R4 42 R3 41 R2 B6 20 40 R1 B7 21 TDA8777HL G9 10 BLANK 11 SYNC 12 VDDA1 13 B0 14 B1 15 B2 16 B3 17 B4 18 B5 19 B8 22 B9 23 Fig 2. Pin configuration 7.2 Pin description Table 3: Symbol G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 BLANK SYNC VDDA1 B0 B1 B2 TDA8777_3 Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description green digital input data; bit 0 (LSB) green digital input data; bit 1 green digital input data; bit 2 green digital input data; bit 3 green digital input data; bit 4 green digital input data; bit 5 green digital input data; bit 6 green digital input data; bit 7 green digital input data; bit 8 green digital input data; bit 9 (MSB) composite blank control input (active LOW) composite sync control input; for green channel only (active LOW) analog supply voltage 1 blue digital input data; bit 0 (LSB) blue digital input data; bit 1 blue digital input data; bit 2 Preliminary data sheet Rev. 03 -- 15 August 2005 39 R0 4 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency Pin description ...continued Pin 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Description blue digital input data; bit 3 blue digital input data; bit 4 blue digital input data; bit 5 blue digital input data; bit 6 blue digital input data; bit 7 blue digital input data; bit 8 blue digital input data; bit 9 (MSB) clock input analog supply ground 1 analog supply ground 2 complementary blue current analog output blue current analog output analog supply voltage 2 analog supply voltage 3 complementary green current analog output green current analog output complementary red current analog output red current analog output compliance voltage output voltage reference input full-scale current control resistor pin power-save control input (active LOW) red digital input data; bit 0 (LSB) red digital input data; bit 1 red digital input data; bit 2 red digital input data; bit 3 red digital input data; bit 4 red digital input data; bit 5 red digital input data; bit 6 red digital input data; bit 7 red digital input data; bit 8 red digital input data; bit 9 (MSB) Table 3: Symbol B3 B4 B5 B6 B7 B8 B9 CLK VSSA1 VSSA2 OUTB OUTB VDDA2 VDDA3 OUTG OUTG OUTR OUTR COMP VREF RSET PSAVE R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 8. Functional description This triple 10-bit video DAC is designed to convert digital input signals into analog output currents. All inputs (clock, data, blank and sync) must be TLL levels. 8.1 Voltage reference The voltage reference input to pin VREF should be 1.21 V. For correct operation, a 100 nF capacitor should be connected between pin VREF and pin VDDA. TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 5 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency An external reference resistor must be connected between pin RSET and analog ground. This resistor sets the reference current which determines the analog output level, and is specified to be 560 . This value allows a 1 V (p-p) output (video plus sync) into a 37.5 load, such as a double-terminated 75 coaxial cable. 8.2 Blanking and sync pulse insertion The video signal (see Figure 3) is comprised of the following three parts: * The video information: defined by the 10 bits used to drive the DAC; nominal signal amplitude = 700 mV (p-p) * The sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a video line and the start of the next video line; sync nominal amplitude = 300 mV; sync is added to the video signal output via the SYNC input (active LOW) * The blanking period: allows interface-free detection of both sync and video, blanking is allocated either side of the sync pulse; the blank level is equal to the video black level; blanking is added to the video signal output via the BLANK input (active LOW). The values of SYNC and BLANK are latched on the rising edge of the clock signal. When no sync and no blank are applied, the DAC can be used continuously. This is the so-called generic mode. Because the signal delay in the DAC is 1.5 times the clock period, the sync and blank are also delayed by 1.5 times the clock period. blanking period 0.7 V sync pulse video information 0.3 V mle291 Fig 3. Video signal sync pulse and blanking period 9. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDA Vn Tstg Tamb Tj Parameter analog supply voltage voltage on digital input pins storage temperature ambient temperature junction temperature Conditions referred to VSSA1 referred to VSSA2 Min -0.5 -0.5 -55 0 -40 Max +6.5 +5.5 +150 70 +125 Unit V V C C C TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 6 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 10. Thermal characteristics Table 5: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air for SOT313-2 Typ 88 Unit K/W 11. Characteristics Table 6: Characteristics Typical values measured at VDDA = 3.3 V; RRSET = 560 ; Tamb = 25 C; unless otherwise specified. Symbol Supplies VDDA IDDA Ptot Ipd Inputs VIL VIH IIL IIH CIN VDDA IDDA VVREF RRSET RESDAC Io(DAC) INL DNL DACCT THD LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current input capacitance analog supply voltage analog supply current reference voltage input resistor for reference current DAC resolution DAC to DAC output current matching integral non-linearity differential non-linearity DAC to DAC crosstalk total harmonic distortion fCLK = 140 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz 60 60 60 59 58 57 dB dB dB dB dB dB 2.0 3.0 -2 -1 Band gap reference Digital-to-analog converter TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 7 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency Table 6: Characteristics ...continued Typical values measured at VDDA = 3.3 V; RRSET = 560 ; Tamb = 25 C; unless otherwise specified. Symbol THD Parameter total harmonic distortion Conditions fCLK = 240 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz fCLK = 330 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz SFDR spurious-free dynamic range to Nyquist limit fCLK = 140 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz fCLK = 240 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz fCLK = 330 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz Outputs VO(compl) ZOUT COUT output voltage compliance output impedance output capacitance 0 TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 8 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency Table 6: Characteristics ...continued Typical values measured at VDDA = 3.3 V; RRSET = 560 ; Tamb = 25 C; unless otherwise specified. Symbol Timing fCLK clock frequency TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 td(p) tsu(i) th(i) td(o) pipeline delay input setup time input hold time output delay time in clock cycles see Figure 4 see Figure 4 see Figure 4 2.5 0.15 0 2.5 3.75 140 240 330 2.5 ns ns ns MHz MHz MHz Parameter Conditions Min Typ Max Unit CLK th(i) Digital inputs (R9 to R0, G9 to G0, B9 to B0, SYNC, BLANK) DATA tsu(i) td(o) Analog outputs (OUTB, OUTB, OUTG, OUTG OUTR, OUTR) 001aaa892 Output delay (td(o)) is measured from the 50 % point of the rising edge of CLK to the 50 % point of full-scale transition. Fig 4. Timing diagram digital inputs and analog outputs TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 9 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 12. Application information 001aad345 001aad347 0 THD (dB) -20 0 THD (dB) -20 -40 -40 -60 -60 -80 1 10 fOUT (MHz) 102 -80 1 10 fOUT (MHz) 102 Sampling frequency = 140 MHz. Sampling frequency = 240 MHz. Fig 5. THD as a function of fOUT, typical values 0 THD (dB) -20 001aad348 Fig 6. THD as a function of fOUT, typical values 0 SFDR (dB) -20 001aad427 -40 -40 -60 -60 -80 1 10 fOUT (MHz) 102 -80 1 10 fOUT (MHz) 102 Sampling frequency = 330 MHz. Sampling frequency = 140 MHz. Fig 7. THD as a function of fOUT, typical values Fig 8. SFDR as a function of fOUT, typical values TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 10 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 0 SFDR (dB) -20 001aad428 0 SFDR (dB) -20 001aad429 -40 -40 -60 -60 -80 1 10 fOUT (MHz) 102 -80 1 10 fOUT (MHz) 102 Sampling frequency = 240 MHz Sampling frequency = 330 MHz. Fig 9. SFDR as a function of fOUT, typical values. Fig 10. SFDR as a function of fOUT, typical values 560 PSAVE RSET R9 R8 R7 R6 R5 R4 R3 R2 R1 R0 VDDA VREF COMP OUTR OUTR OUTG OUTG VDDA3 VDDA2 OUTB OUTB VSSA2 VSSA1 0.1 F 48 G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 BLANK SYNC 1 2 3 4 5 6 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 TDA8777 7 8 9 10 11 12 13 VDDA1 14 B0 15 B1 16 B2 17 B3 18 B4 19 B5 20 B6 21 B7 22 B8 23 B9 24 CLK 30 29 28 27 26 25 001aaa890 VDDA Fig 11. Application diagram TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 11 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 13. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 37 25 24 ZE A e E HE A A2 A1 (A 3) Lp L detail X wM pin 1 index 48 1 12 ZD bp D HD wM B vM B vM A 13 bp e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.5 HD 9.15 8.85 HE 9.15 8.85 L 1 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT313-2 REFERENCES IEC 136E05 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 12. Package outline SOT313-2 (LQFP48) TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 12 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 13 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C. 14.5 Package related soldering information Table 7: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8] [1] [2] Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable suitable not not recommended [5] [6] recommended [7] suitable suitable suitable not suitable not suitable For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [3] TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 14 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages. [5] [6] [7] [8] [9] TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 15 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 15. Revision history Table 8: Revision history Release date 20050815 Data sheet status Preliminary data sheet Change notice Doc. number Supersedes TDA8777_2 Document ID TDA8777_3 Modifications: * * * * * The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Status changed to Preliminary data sheet. Characteristics table revised, SPDR and THD data added, see Table 6. Figure 4 corrected. Figure 5 through to Figure 10 added. Objective specification Objective specification TDA8777_1 - TDA8777_2 TDA8777_1 20040517 20040108 TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 16 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 16. Data sheet status Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 19. Trademarks Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Disclaimers Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com TDA8777_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Preliminary data sheet Rev. 03 -- 15 August 2005 17 of 18 Philips Semiconductors TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5 Blanking and sync pulse insertion . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information . . . . . . . . . . . . . . . . . . . . 17 (c) Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 15 August 2005 Document number: TDA8777_3 Published in The Netherlands |
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