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DATA SHEET
MOS INTEGRATED CIRCUIT
PD16876
SINGLE Pch HIGH-SIDE SWITCH FOR USB
DESCRIPTION
The PD16876 is a power switch IC with an overcurrent limiter that is used for the power bus of a Universal Serial Bus (USB). This product has one Pch power MOSFET circuits, which has a low-on resistance (100 m TYP.), in its switching block. This product boasts an operating current consumption of as low as 100 A (MAX.). In addition, the IC is also equipped with an overcurrent detector that is essential for a host/hub controller conforming to the USB Standard, so that the IC can report an overcurrent to the controller. Moreover, a thermal shutdown circuit and an undervoltage lockout circuit are also provided as the protection circuits of the IC. This product has one channel of power switch, control input pin, and flag output pin to simultaneously control one USB port with a single IC.
FEATURES
* * * * * * * One P-ch power MOSFET circuit Overcurrent detector that outputs active-low control signal from detection report pin Overcurrent limiter to prevent system voltage drop Thermal shutdown circuit Undervoltage lockout circuit This control circuit can be turned on and off independently of the others by a control pin. 8-pin SOP package
ORDERING INFORMATION
Part Number Package 8-pin SOP (5.72 mm (225))
PD16876G
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S14288EJ1V0DS00 (1st edition) Date Published April 2001 N CP(K) Printed in Japan
(c)
2001
PD16876
BLOCK DIAGRAM
IN (Input)
5
7 OUT (Output)
IN (Input)
6
8 OUT (Output)
LATCH (Input) 1
Reference voltage Gate control Overcurrent detection block
FLG (Flag output) 3
Overvoltage lockout circuit
Thermal shutdown circuit
4 GND
2 CTL (Control Input)
NOTES ON CORRECT USE
* No internal resistor is connected to input pins LATCH (pin 1) and CTL (pin 2). When using the PD16876, therefore, be sure to set the voltage level of these input pins to "H" or "L". * Plural terminal (IN, OUT) is not only 1 terminal and connect all terminals.
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Data Sheet S14288EJ1V0DS
PD16876
PIN CONFIGURATION (Top View)
LATCH CTL FLG GND
1 2 3 4
8 7 6 5
OUT OUT IN IN
8-pin SOP
PIN DESCRIPTION
Pin No. 1 2 3 4 5/6 7/8 Pin Name LATCH CTL FLG GND IN OUT Pin Function Select LATCH function. "H" is effective LATCH function. Control input: Active-low, TTL input Detection flag (output): Active-low, Nch open-drain Ground Power input: Source of MOSFET for output. Power supply to internal circuitry of IC Switch output: Drain of MOSFET for output. Usually, connected to load.
TRUTH TABLE (H: High level, L: Low level, ON: Output on, OFF: Output off, X: H or L)
CTL (In) L H L X X FLG (Out) H H L L L OUT (Out) ON OFF ON OFF OFF Normal operation Switch OFF/Stand by mode Overcurrent detection Thermal shutdown circuit operation Undervoltage lockout circuit operation Operation mode
LATCH H (LATCH mode) L (non LATCH mode)
Operation mode After overcurrent detection circuit operates, output is latched. After overcurrent detection circuit operates, output is operated limited current function.
Data Sheet S14288EJ1V0DS
3
PD16876
ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = 25C)
Parameter Input voltage Flag voltage Flag current Output voltage Output current Symbol VIN VFLG IFLG VOUT IOUT DC Pulse width Single 100 s pulse Control input Total power dissipation Operating temperature range Junction temperature Storage temperature
Note
Conditions
Ratings -0.3 to +6 -0.3 to +6 50 VIN+0.3 +0.5 (VIN = VCTL = 5 V) -0.1 (VIN = 0 V, VOUT = 5 V) +3 -0.3 to +6 300 -40 to +85 +150 -55 to +150
Unit V V mA V A
VCTL PD TA TCH MAX Tstg
V mW C C C
Note This product has an internal thermal shutdown circuit (operating temperature: 150C or higher TYP.)
RECOMMENDED OPERATING RANGE (Unless otherwise specified, TA = 25C)
Parameter Input voltage Operating temperature range Symbol VIN TA MIN. +3 0 TYP. MAX. +5.5 +70 Unit V C
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Data Sheet S14288EJ1V0DS
PD16876
ELECTRICAL SPECIFICATIONS DC Characteristics (Unless otherwise specified, VIN = +5 V, TA = +25C)
Parameter Current consumption Symbol IDD Conditions VCTL = VIN, OUT: Open VCTL = 0 V, OUT: open Input voltage, low Input voltage, high LATCH input voltage, low LATCH input voltage, high Control input current VIL VIH VIL VIH ICTL CTL pin CTL pin LATCH pin LATCH pin VCTL = 0 V VCTL = VIN Output MOSFET on-resistance RON TA = 0 to +70C, IOUT = 500 mA VIN = 3 to 5 V, TA = 0 to 70C IOUT = 500 mA Output leakage current Overcurrent detector threshold IO LEAK ITH TA = 0 to +70C VIN = 3 to 5 V, TA = 0 to 70C Flag output resistance Flag leakage current Undervoltage lockout circuit operating voltage RON F IO LEAK F VUVLO IL = 10 mA VFLAG = 5 V VIN: When rising VIN: When falling Hysteresis width 2.2 2.0 0.05 0.6 0.5 10 0.01 2.5 2.3 0.9 3.5 0.01 0.01 100 1 1 140 2.0 1.5 MIN. TYP. 1 MAX. 5 80 1.0 Unit
A A
V V V V
A A
m
200
m
10 1.25 1.25 25 1 2.8 2.6 0.25
A
A A
A
V V V
AC Characteristics (Unless otherwise specified, VIN = +5 V, TA = +25C)
Parameter Output transition rise time (ON) Output transition fall time (OFF) Overcurrent detection delay time Overcurrent detection output rise time Minimum CTL high time CTL FLG Delay time Symbol tRISE tFALL tOVER tSRISE RL = 10 per output CTL : LHL Over Current Detect CTL1 FLG4 2.5 Conditions RL = 10 per output RL = 10 per output 20 5 8 MIN. 2.5 TYP. 5 MAX. 8 10 Unit ms
s s
ms
tCTL tC-F Delay
20 10
s s
Data Sheet S14288EJ1V0DS
5
PD16876
POINTS OF MEASUREMENT Output Transition Rise Time (ON)/Output Transition Fall Time (OFF)
CTL pin: HL/LH
5 V/3.3 V CTL 0V tRISE 5V VOUT 0V tFALL 90%
90%
90% 10%
Overcurrent Detection Delay Time/Minimum CTL High Time (LATCH = "L")
ITH
IOUT
VOUT
tOVER tSRISE (Internal time) FLG 90%
tCTL CTL 10% 10%
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Data Sheet S14288EJ1V0DS
PD16876
Overcurrent Detection Delay Time/Minimum CTL High Time (LATCH = "H")
ITH
IOUT
VOUT
tOVER tSRISE (Internal time) FLG 90%
tCTL CTL 10% 10%
FUNCTIONAL DESCRIPTION REFERENCE TABLE
Function Characteristics Reference Value (TYP.) 0.9 A 20 s 5 ms VDD LH VDD HL Output rise time Output fall time Thermal shutdown circuit operating temperature tRISE tFALL 2.5 V 2.3 V 5 ms 1 s p.9 3. Behavior When Power Is Turned ON/OFF p.12 When Thermal Shutdown Circuit Operates Refer to:
Overcurrent detection
Overcurrent detection Threshold Overcurrent detection delay time Slow-start repeat time
p.8 1. Overcurrent detection
p.8 1. Overcurrent detection p.11 On Detection of Overcurrent p.11 On Detection of Overcurrent p.8 2. Under Voltage Lockout Circuit (UVLO)
Under voltage lockout circuit (UVLO) Operation when power is turned on/off Thermal shutdown circuit
UVLO operating voltage
150C or higher
Data Sheet S14288EJ1V0DS
7
PD16876
DESCRIPTION OF FUNCTIONS 1. Overcurrent Detection
This IC detects an overcurrent in a range of 0.6 to 1.25 A (0.9 A TYP.) (the USB Standard defines that an overcurrent is 0.5 A MAX.). When the IC detects an overcurrent, the FLG pin goes low (active) and reports the result of detection to the control IC. At this time, the switch is kept ON and the current limiter is activated. In this way, an overcurrent status that lasts for a long time can be prevented. By deasserted the CTL pin inactive by the control IC, the switch is turned OFF and the FLG pin goes back high. Therefore, the CTL signal must be deasserted inactive as soon as the controller IC has detected that the FLG pin has gone low, to avoid overheating this IC. Once the switch has been turned OFF, it turns back ON again only when the CTL signal is asserted active while the FLG pin is high. To prevent an inrush current being detected by mistake, a deadband time (overcurrent detection delay time) is set to elapse before the overcurrent detector is activated. The duration of this deadband time is 20 s TYP. While the overcurrent limiter is activated, the power consumption of the device may abruptly increase. As a result, the junction temperature may also rise. Make sure that the CTL signal is deasserted inactive and that the switch is turned OFF before the absolute maximum rating is exceeded.
2. Undervoltage Lockout Circuit (UVLO)
This circuit prevents malfunctioning of the switch due to fluctuation in supply voltage. When power is turned on (2.5 V or less TYP.) or off (2.3 V or less TYP.), the OUT and FLG pins have the following status: OUT: OFF FLG: "L" (= 0 V)
5V
Output voltage
2.3 V
2.5 V
5V
Input voltage
The above figure does not show the actual waveform. For the related characteristic waveform, refer to Major Characteristic Curves.
8
Data Sheet S14288EJ1V0DS
PD16876
3. Behavior When Power Is Turned ON/OFF
This IC performs a soft-start operation on power application. This is to prevent an overcurrent from flowing through the IC on power application while the high-capacity capacitor connected to the output pin is charged. Power ON: Power OFF: Soft start (2.5 to 8 ms) No control (10 s MAX.)
5V Vin 0V 2.5 ms MIN. 8 ms MAX. 5V Vout 0V 10 s MAX.
The above figure does not show the actual waveform. For the related characteristic waveform, refer to Major Characteristic Curves.
4. Output Latch Functional Change
LATCH = "H": This IC has the control terminal (LATCH terminal) which latches the output current limitation after over current detection. An output latch function is explained below. The output switch is turned off irrespective of the state of a CTL terminal after over current detection. Again, in order to make a switch into an ON state, it is necessary that a CTL terminal is setting to Low level. This function can be used, when you want to make a CTL terminal "L" fixation and to always consider as an ON state, or when a USB controller to switch-ON/OFF control is unnecessary. LATCH = "L": A current limitation circuit operates after over current detection. A limitation function is continued until the over current is eliminated. After current detection, when abnormal condition is eliminated, output returns to an ON state. This function serves as specification which suited USB specification.
Data Sheet S14288EJ1V0DS
9
PD16876
OPERATION SEQUENCE Power ON/OFF
5V IN (Input) GND 5V OUT (Output) GND 5V Flg (Output) GND 5V 5V CTL (Input) GND
Overcurrent detection threshold Iout
If the CTL signal is asserted active after power has been turned ON, OUT executes the soft-start operation (output transition time: 8 ms MAX.). In addition, FLG output is fixed to "L" if the supply voltage is lower than the operating voltage of the undervoltage lockout circuit (UVLO) on power application. If all the CTL pins are inactive when power is supplied, the IC enters the standby status (IDD = 5 A MAX.).
When Control Signals Are Input
5V IN (Input) GND 5V OUT (Output) GND 5V GND 5V GND
FLG (Output) CTL (Input)
10
Data Sheet S14288EJ1V0DS
PD16876
On Detection of Overcurrent
5V IN (input) 5V FLG (output) GND 5V CTL (input) GND GND 5V GND
OUT (output) LATCH = "L"
Iout
Overcurrent detection threshold
Inrush current 5V OUT (output) LATCH = "H" Overcurrent detection threshold GND
Slow start period
Output is short-circuited
Iout
Inrush current
Slow start period
Output is short-circuited
If an overcurrent is detected after the overcurrent detection delay time of 20 s, the IC executes a slow-start operation (output rise time: 5 ms TYP.) again. If an overcurrent is detected while the IC is executing the slow-start operation again, it is assumed that the output is short-circuited and the FLG pin goes low. When the CTL signal is deasserted inactive, OUT is turned OFF and FLG goes high. If the CTL signal is asserted active, OUT is turned back ON unless the undervoltage lockout circuit or thermal shutdown circuit is activated. When LATCH = "H", output is turned off at the timing of FLG = "L".
Data Sheet S14288EJ1V0DS
11
PD16876
When Thermal Shutdown Circuit Operates
5V IN (Input) GND 5V OUT (Output) GND 5V GND 5V CTL (Input) GND Standby status Non-standby status
FLG (Output)
Tch
Thermal shutdown circuit operating temperature (rising)
Thermal shutdown circuit operating temperature (falling)
While the thermal shutdown circuit is activated, the output pins are in the OFF status. However, the IC does not enter the standby status even if all the CLT pins are deasserted inactive at the same time. The thermal shutdown circuit is not activated even if the junction temperature exceeds 150C TYP. while the IC is in the standby mode (when CTL1 and CTL2 pins are inactive).
TEST CIRCUIT
5V 10 k 10 LATCH CTL FLG GND OUT OUT IN IN 1 F
PD16876
12
Data Sheet S14288EJ1V0DS
PD16876
MAJOR CHARACTERISTIC CURVES (Unless otherwise specified, TA = 25C, VIN = 5 V)
Total Power Dissipation PT vs. Ambient Temperature TA 400 Total consumption PT (mW) 300 200 100 0 -40
0
40
80
120
160
200
Ambient temperature TA (C) Output On-Resistance RON vs. Ambient Temperature TA Output on-resistance RON (m) Output on-resistance RON (m) 140 120 100 80 60 40 20 0 -20 0 20 40 60 80 250 TA = 25C 200 150 100 50 0 2.0 3.0 4.0 5.0 6.0 7.0 Output On-Resistance RON vs. Supply Voltage VIN
Ambient temperature TA (C) Current Consumption IDD vs. Ambient Temperature TA Current consumption ( A) 120 100 80 60 40 20 0 -20 0 20 40 60 80 Current consumption ( A) 140 100 80 60 40 20 0 3.5 4.0
Supply voltage (V)
Current Consumption IDD vs. Supply Voltage VIN
4.5
5.0
5.5
6.0
6.5
Ambient temperature TA (C) Current consumption in standby mode ( A) Current Consumption (Standby) IDD vs. Ambient Temperature TA 0.10 0.08 0.06 0.04 0.02 0.00 -20 0 20 40 60 80 Current consumption in standby mode ( A)
Supply voltage (V) Current Consumption (Standby) IDD vs. Supply Voltage VIN 0.10 0.08 0.06 0.04 0.02 0.00 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Ambient temperature TA (C)
Supply voltage (V)
Data Sheet S14288EJ1V0DS
13
PD16876
MAJOR CHARACTERISTIC CURVES (Unless otherwise specified, TA = 25C, VIN = 5 V)
Input Voltage VI vs. Ambient Temperature TA 1.80
Input voltage, low VIL (V) Input voltage, high VIH (V)
Input Voltage VI vs. Supply Voltage VIN 1.70
Input voltage, low VIL (V) Input voltage, high VIH (V)
1.70 1.60 1.50 1.40 1.30 -20 0 20 VIL
VIH
1.65 1.60 1.55 1.50 3.5
VIH
VIL 4.0 4.5 5.0 5.5 6.0 6.5
40
60
80
Ambient temperature TA (C) Overcurrent Threshold ITH vs. Ambient Temperature TA
Overcurrent detection value (A)
Supply voltage (V)
Overcurrent Threshold ITH vs. Supply Voltage VIN
Overcurrent detection value (A)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -20 0 20 40 60 80
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Ambient temperature TA (C) Output Rise Delay Time Characteristics 6
Voltage (V)
Supply voltage (V) Output Fall Delay Time Characteristics 6
Voltage (V)
5 4 3 2 1 0 0
Input voltage
5 4 3 2 1 0 Output voltage
Output voltage
1
2
3
4
0
0.4 Time ( s)
0.8
1.2
Undervoltage lockout circuit operating voltage VUVLO (V)
Time ( s) Undervoltage Lockout Circuit Operating Voltage Characteristics 50 40 UVLO (L H) 30 20 10 00 -20 0 UVLO (H L)
20
40
60
80
Ambient temperature TA (C)
14
Data Sheet S14288EJ1V0DS
PD16876
APPLICATION CIRCUIT
5V VBUS D+ D- 10 k LATCH OUT CTL Over Current Enable FLG GND OUT IN IN 1F 150 F D+ D- GND
PD16876
USB Controller
The application circuits and their parameters are for references only and are not intended for use in actual designin's.
Data Sheet S14288EJ1V0DS
15
PD16876
PACKAGE DRAWING 8-Pin Plastic SOP (5.72 mm (225)) (Unit: mm)
8 5
1.8 MAX
1
5.37 MAX.
4
6.00.3
1.44
0.15 +0.10 -0.05
4.4
0.8
0.05 MIN.
0.78 MAX 1.27 0.40 +0.10 -0.05 0.12 M
0.50.2
0.10
16
Data Sheet S14288EJ1V0DS
PD16876
RECOMMENDED SOLDERING CONDITIONS
The PD16876 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended, contact your NEC sales representative. Surface Mount Type For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E).
PD16876G
Soldering Method Soldering Conditions Recommended Condition Symbol IR35-00-2
Infrared reflow
Package peak temperature: 235C, Time: 30 sec. Max. (at 210C or higher), Count: two times, Exposure limit: Not limitedNote Package peak temperature: 215C, Time: 40 sec. Max. (at 200C or higher), Count: two times, Exposure limit: Not limitedNote Solder bath temperature: 260C Max., Time: 10 sec. Max., Count: once, Exposure limit: not limitedNote Pin temperature: 300C Max., Time: 3 sec. Max., Exposure limit: not limitedNote
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating
Note After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period. Cautions Do not use different soldering methods together (except for partial heating).
REFERENCE
Quality Grades on NEC semiconductor Devices Semiconductor Device Mounting Technology Manual NEC Semiconductor Device Reliability/Quality Control System Semiconductor Selection Guide C11531E C10535E C10983E X13769E
Data Sheet S14288EJ1V0DS
17
PD16876
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
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Data Sheet S14288EJ1V0DS
PD16876
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
* * * * *
Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements
*
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
NEC Electronics (Germany) GmbH
Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd. NEC Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-3067-5800 Fax: 01-3067-5899 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
NEC Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490
NEC Electronics (France) S.A. NEC Electronics (UK) Ltd.
Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 Madrid Office Madrid, Spain Tel: 091-504-2787 Fax: 091-504-2860
NEC Electronics Singapore Pte. Ltd.
Novena Square, Singapore Tel: 253-8311 Fax: 250-3583
NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99
NEC Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division Guarulhos-SP, Brasil Tel: 11-6462-6810 Fax: 11-6462-6829
J01.2
Data Sheet S14288EJ1V0DS
19
PD16876
* The information in this document is current as of March, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
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