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| Fairchild Semiconductor Product Package Material Disclosure Package Type Weight of Package (grams) Component Lead Frame TSSOP-56 Maximum Minimum Material 2.21E-01 2.08E-01 Weight in grams 7.37E-02 Copper Nickel Silicon Magnesium Silver (DP) Substance in material Wt% in finished product min 33.34 32.08 1.00 0.22 0.05 0.00 58.07 35.92 0.00 8.98 0.30 0.90 Wt% in finished product max 35.41 33.66 1.06 0.23 0.05 0.40 61.66 47.89 0.90 20.65 1.80 2.39 CAS # Copper alloy 7440-50-8 7439-89-6 7440-66-6 7439-95-4 7440-22-4 Encapsulation Epoxy 1.28E-01 Silica Carbon Black Resin Antimony Compound Brominated Compound 1309-64-4 68541-56-0 Plating Solder 8.84E-03 Tin Lead or Lead-free Solder 8.84E-03 Tin 1.90E-03 Silicon and trace metals 2.22E-04 Silver Resin 1.37 1.17 0.21 1.37 1.37 0.84 0.84 6.87 5.84 1.03 6.87 6.87 0.93 0.93 7440-31-5 7439-92-1 7440-31-5 Chip Silicon and inorganic compounds Adhesive 7440-21-3 Die Attach 0.10 0.07 0.02 0.62 0.11 0.08 0.03 0.68 0.68 7440-22-4 Wire Bond Gold Wire 1.39E-03 Gold 0.62 7440-57-5 Materials Disclosure Disclaimer The information provided in this Materials Disclosure is, to our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. Also, there may not be information included in this statement regarding the minute amounts of dopant and metal materials contained within the electrically active or passive devices contained within the finished product. |
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