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| Datasheet File OCR Text: |
| PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 D E A X c y exposed die pad side HE vMA Z Dh 20 11 pin 1 index Eh A2 A1 (A 3) A Lp L 1 e bp 10 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.20 0.09 D(1) 6.6 6.4 Dh 4.3 4.1 E(2) 4.5 4.3 Eh 3.1 2.9 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 v 0.2 w 0.13 y 0.1 Z(1) 0.5 0.2 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT527-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-02-18 03-04-07 |
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