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TM
Peripheral Imaging Corporation
PI324MC-A4 300DPI CIS Module Engineering Data Sheet
Key Features * * * * * * * * * Light source, lens, and sensor are integrated into a single module 11.8 dpm resolution, 216 mm total scanning length(2592 pixels long) Two Independent Analog Outputs(Split into two section of 1248 pixels and 1344 pixels) Up to 270sec/line scanning speed with Red Light Source Wide dynamic range RED LED light source Compact size 14 mm x 19 mm x 232 mm Low power Light weight
General Description
The PI324MC-A4 is a CIS module. It is a dual-analog-output contact image sensor, using MOS image sensor technology for high-speed performance and high sensitivity. The PI324MC-A4 is suitable for scanning A4 size (216 mm) documents with 11.8 dots per millimeter resolution. Applications includes fax machines, game systems, variety of mark readers, and other automation equipment requiring document scanners.
Functional Description
The PI324MC-A4 imaging array consists of 27 sensors, PI3021 produced by Peripheral Imaging Corp. The sensor is a monolithic chip with an array of 96 photo sensing elements, of which 27 are cascaded to provide 2592 photo-detectors. Additionally, these chips gives the users the readout flexibility in selecting their desired data format. These cascaded chips are segregated into two electrically independent sections of 13 chips and 14 chips,
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but they are still contiguously aligned in a single row. See Figure 1, the module's block diagram. This configuration lends to a positional stream of video pixels whether they are read in parallel or sequentially from the two output ports, i.e., at the end of the first section's array, pixel number 1247, the following 1st pixel of the second section continues as position 1248 and sequences up to pixel 2592 or the end, pixel 1344 of the end second section. Each chip contains a set of multiplex switches, and a digital shift register to control the chips sequential readout. Additionally, the chips contain a chip selection switch that is interrogated in a sequence as each predecessor chip completes its scanning process. Since this module has two output ports from two independently controlled section of chips, to operate both sections, the users are required to enter a set of control clocks and power into each section through the two provided connectors located on each end of the module.
VLED
LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED
GLED
ROD LENSE
PHOTO SENSORS 1234 1246 1247 1248 1234 PHOTO SENSORS 1342 1343 1344
SHIFT REGISTER BUFFER VIDEO AMPL
SHIFT REGISTER BUFFER VIDEO AMPL
VN(-V)
GRD
CP
VDD(+5)
VN(-V)
VOUT
Located on the next page is Figure 2 depicting a cross sectional pictorial of the module. Mounted in the module is one-to-one graded indexed micro lens array that focuses the scanned documents' image onto the chip's sensing line. The sensing line is located along the module's sensor axis, known as the read line. These photon images are transformed into proportional video charges and processed by two on-board amplifiers. The video signal from the amplifier transmits a sequential stream of video pixels to video output pin of the PI324MC-A4 module. Also mounted in housing is a LED light source. Figure 2 shows LED bar and its illumination path. The path traces the ray from the LED and reflected from the document and focused through the ROD lens and onto the sensors. All these components are housed in a small plastic housing with a cover glass. The cover glass serves as window with outside surface as the focal point for the image on the document. It also serves to protect the imaging array, the micro lens assembly, and the LED light source from dust.
CP
Figure 1. PI324MC-A4 module block diagram. (See Table 1 for pin-out designation)
SP
GRD
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VDD(+5)
SP
GRD
VOUT
GRD
DOCUMENT SURFACE
GLASS WINDOW
LIGHT PATH MODULE HOUSE
ROD LENS
D LE
R BA
SENSORS
PCB
INSIDE PICTORIAL OF MODULE
Figure 2. PI324MC-A4 Cross Section
I/O Designation
There are two connectors located at the ends of the modules. The outline of the module in Figure 5 of the mechanical section illustrates these connector locations. With the module window facing down on flat surface and with the viewer looking down on backside of the module, the connectors are located on each end of the module with their pins pointing toward the viewer. The connectors for section 1 has 12 pins and is located on the right hand side. The part number is JAE IL-Z-12P-S125L3-E. Its pin numbers and designations are in Table 1A. Pin Configuration For Section 1 Connector. Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 Symbol Vout1 Gnd Vdd (+5V) Vn (-5V ) Gnd SP1 Gnd CP GLED VLED LED(future) LED(future) Names and Functions Analog Video Output Ground; 0V Positive power supply Negative power supply Ground; 0V Shift register start pulse Ground; 0V Sampling clock pulse Ground for the light source; 0V Supply for the light source Supply for future LED source Supply for future LED source
Table 1A. Pin Configuration For Section 1 Connector
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The connector for section two has 8 pins and is located on the left hand side. The part number is JAE IL-Z-8P-S125L3-E. The pin numbers and designations for the connector are listed in Table 1B. Pin Configuration For Section 2 Connector. Pin Number 1 2 3 4 5 6 7 8 Symbol Vout2 Gnd Vdd (+5V) Vn (-5V ) Gnd SP2 Gnd CP Names and Functions Analog Video Output Ground; 0V Positive power supply Negative power supply Ground; 0V Shift register start pulse Ground; 0V Sampling clock pulse
Table 1B. Pin Configuration For Section 2 Connector
Absolute Maximum Rating
Symbols Maximum Rating Units Vdd 7 V Idd 70 mA Vn -15 V In 20 mA VLED 6.0 V ILED 0.65 A Input clock pulse (high level) Vih Vdd +.5 V Input clock pulse (low level) Vil -0.5 V Note, these are the absolute maximums and are not to be used in prolonged operation. Table 2. Absolute Maximum Ratings Parameter Power supply voltage
Operating Environment
Operating temperature Operating humidity Storage temperature Storage humidity Top Hop Tstg Hstg 0 to 50 10 to 85 -25 to+75 5 to 95
0
C % 0 C %
Table 3. Operating Environment
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Electro-optical characteristics at 25C.
Parameter Total Number of photo detectors Number detectors in Section 1 Number of detectors in Section 2 Pixel to pixel spacing Line scanning rate Clock frequency(2) Bright output voltage(3) Bright output nonuniformity(4) Adjacent pixel nonuniformity(5) Dark nonuniformity(6) Dark output voltage(6) Symbol Parameter 2592 Units elements Note The sum of both sections
1248 1344 84.7 270
elements elements m sec MHz Volts % % mV mV
Tint
(1)
@ 5.0 MHz clock frequency
f Vpavg Up Uadj Ud Vd
5.0 1.0 <+/-30 <25 <100 <150
Average dark level from the video reset level.
Typical Modulation transfer function(7)
MTF
50
%
Table 4. Electro-optical characteristics at 25 C. Definition: (1) Tint: Line scanning rate or integration time. Tint is determined by the interval of two SP, start pulses. The line scan time is determined by the longest array with both section 1 and 2 operating in parallel. Longest array is section 2, with 1344 pixels, running at 5MHz pixel rate. (2) f: main clock frequency, (3) Vpavg = Vp(n)/1248 for section 1 and Vpavg = Vp(n)/1344 for section 2, where: Vp(n) is the peak value of any nth pixel in a give scan. This level is factory adjusted with an internal potentiometer after setting the scan times to a the minimum allowable for a fixed clock frequency. In this case, 275sec at 5MHz clock frequency. This value is then used as reference to adjust the dark level and to call out the dark uniformity, see note 6 on dark uniformity. (4) Up is defined as follows: Upmax = [(Vpmax - Vpavg) / Vpavg] x 100% or Upmin = [(Vpavg - Vpmin) / Vpavg] x 100%
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where: Vpmax=the maximum value of the peak nth video pixel, Vp(n), and: Vpmin = the minimum value of the peak video nth video pixel, Vp(n). Up = +/-30% is selected from the greater absolute value of Upmax of Upmin. If |Upmax| > |Upmin| then Up = +|Upmax| is selected, if |Upmin| > |Upmax| then Up = -|Upmin| is selected. In either case, |Upmax| + |Upmin| 60%. (5) Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100% Upadj is the nonuniformity percentage pixel to pixel (6) See the discussion on dark uniformity, Ud. (7) See the section on MTF Discussion and Graph.
Dark Uniformity, Ud
Figure 3, Definition of the Video Pixel in the Light and in the Dark, exemplifies the definitions of the terminology which are used to explain the video signal characteristics. Dark uniformity is defined as Ud = Vdmax - Vdmin; Where Vdmax and Vdmin are the maximum and minimum voltage of Vd, the average dark level of total pixels in scan line when the LED light is turned off. Vd is measured from Reset Level and this amplitude between the dark level and this reset level is call PEDESTAL. The pedestal level is caused by resetting operation of pixel. Although the pedestal remains constant for a constant clock frequency, the Reset Level will very from ground, because the dark level, Vd, is factory adjusted to ground (zero volts).
CP
VIDEO OUTPUT
Dark Level
Vp(n) in the light
PEDESTAL
Reset Level
PEDESTAL
VIDEO IN LIGHT AND IN DARK Figure 3. Definition of the Video Pixel in the Light and in the Dark
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MTF Graph and Its Discussion
See Figure 4 MTF versus Distance. This graph essentially shows the working depth of focus. Since this module is a 300DPI module, a pixel density of 300 pixel per inch, the MTF was measured with a 150 DPI or a 75 line-pair per inch optical bar pattern. The test were conducted a pixel rate of 2.5MHz.
TYPICAL MTF VERSUS DEPTH OF FOCUS
60 50 MTF in % 40 30 20 10 0 0 0.1 0.2 0.3 0.4 0.5 0.6 DEPTH FROM THE WINDOW SURFACE(mm)
Figure 4. MTF versus Distance The effective algorithm used in the measurements is as described by the following equation: MTF={[Vp(n)+Vp(n+1)]/2-[Vp(n+2)+Vp(n+3)]/2}/{[Vp(n)+Vp(n+1)]/2+[Vp(n+2)+Vp(n+3)]/2} Where n is 1, 2, .....2592th, Vp(n) is the signal amplitude of the nth pixel.
Recommended Operating Conditions (25 C)
Item Power Supply Symbol Vdd Vn. VLED Idd(1&2) Ivn (1&2) ILED Vih Vil f Min 4.5 -4.5 Mean 5.0 -5 5.0 35 6.0 460 Vdd-.5 Max 5.5 -12 5.5 55 10.0 600 Vdd 0.8 5.5 Units V V V ma ma ma V V MHz %
Input voltage at digital high Input voltage at digital low Clock frequency Clock pulse high duty cycle
Vdd-1.0 0 25
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Clock pulse high duration Integration time Operating temperature
Tint(1) Top
50 0.270 25
5.0 50
ns ms 0 C
Note: Minimum Tint is measured with the longest array. Table 5. Recommended Operating Conditions (25 C)
Switching Characteristics (25 C)
The timing diagram for both arrays, section 1 and section 2 are shown in Figure 5. Timing Diagram for both Section 1 and Section 2.
to CP tprh tdh SP tds Vout tsh tdl tw
MODULE TIMING DIAGRAM
Figure 5. Timing Diagram for both Section 1 and Section 2. The switching characteristics for the I/O clocks are labeled symbolic acronyms for each corresponding clock's switching edges. The corresponding times for these symbols are given in the following Table 6. Item Clock cycle time Clock pulse width Clock duty cycle Prohibit crossing time of Start Pulse Data setup time Data hold time Signal delay time Signal settling time Symbol to tw tprh tds tdh tdl tsh Min. 0.20 50 25 15 20 20 50 120 Typical Max. 4.0 75 Units s ns % ns ns ns ns ns
Table 6. Symbol Definitions for the Timing Diagram
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PI324MC-A4 Module and Its Mechanical Dimensions
Figure 6 is an overview drawing of the module. If a detailed drawing is desired, especially for a design in application, a full size drawing is available upon request.
12 8 23 2 2.5
PIN
S SC
AN DI RE CT
IO
N
82
.5 JA EI L-Z -1
2P
S1
25
L3
-E
8P
IN
S
END VIEW
O1.65+/- HOLE 1X1 - M2 TAPSIZE USE (DP6) 19.5 SIDE TAPE
13.7
6.0 8P 1 -S 25 L3 -E
11.5 +/- 0.2
6.8 +/- 0.2 THE SURFACE OF THE GLASS
A RE
D
LI
NE
JA
E
ZIL-
O2.2 +/-0.05 HOLE 2X2 -M2.6 TAPSIZE USE (DP6)
15.5 +/- 0.2
ALL DIMENSIONS IN mm
Figure 6. Mechanical Overview of the Module
(c)2000 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of Peripheral Imaging Corporation. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral Imaging Corporation for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation.
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