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SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
Features
* Ultra Low Parasitic Capitance and Inductance * Surface Mountable in Microwave Circuits , No Wirebonds Required * Rugged HMIC Construction with Polyimide Scratch Protection * Reliable, Multilayer Metalization with a Diffusion * Barrier, 100% Stabilization Bake (300 C, 16 hours) * Lower Susceptibility to ESD Damage
MADS-002545-1307M V1
Topview
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Description and Applications
The MADS-002545-1307M Series SurMountTM Medium Barrier, Silicon Schottky Cross-Over Quad Diodes are fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of Silicon pedestals which form diodes or via conductors embedded in a glass dielectric, which acts as the low dispersion, low loss, microstrip transmission medium. The combination of silicon and glass allows HMIC devices to have excellent loss and power dissipation characteristics in a low profile, reliable device. The Surmount Schottky devices are excellent choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. The SurMount structure employs very low resistance silicon vias to connect the Schottky contacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. They have lower susceptibility to electrostatic discharge than conventional beam lead Schottky diodes. The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum diffusion barrier, which permits all devices to be subjected to a 16-hour non-operating stabilization bake at 300C. The " 0202 " outline allows for Surface Mount placement and multi- functional polarity orientations. The MADS-002545-1307M Series SurMounta Medium Barrier Silicon Schottky Cross-Over Quad Diodes are recommended for use in microwave circuits through Ku band frequencies for lower power applications such as mixers, sub-harmonic mixers, detectors and limiters. The HMIC construction facilitates the direct replacement of more fragile beam lead diodes with the corresponding Surmount diode, which can be connected to a hard or soft substrate circuit with solder.
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M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
C D E D
Sideview Case Style 1307
MADS-002545-1307M Equivalent Circuit
Dim A B C D Sq. E Sq.
Inches Min. Max. 0.023 0.025 0.023 0.004 0.007 0.007 0.025 0.008 0.009 0.009
Millimeters Min. Max. 0.575 0.625 0.575 0.102 0.175 0.175 0.625 0.203 0.225 0.225
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
Electrical Specifications @ + 25 C (Measured as Single Diodes)
Model Number Type Recommended Frequency Range Vf @ 1 mA ( mV ) Vf @ 1mA ( mV )
MADS-002545-1307M V1
Ct @ 0V ( pF )
Rt Slope Resistance ( Vf1-Vf2 ) / ( 10.5mA - 9.5mA ) ()
MADS-002545-1307M Medium Barrier
DC - 18 GHz
470 Max 390 Typ
10 Max
0.22 Max 0.11 Typ
10 Typical 18 Max
Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance.
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of standard handling and die attach techniques. It is important to note that industry standard electrostatic discharge (ESD) control is required at all times, due to the sensitive nature of Schottky junctions. Bulk handling should insure that abrasion and mechanical shock are minimized.
Absolute Maximum Ratings @ 25 C 1
Parameter
Operating Temperature Storage Temperature Junction Temperature Die Bonding Temperature Forward Current Reverse Voltage l - 10 A l RF C.W. Incident Power RF & DC Dissipated Power
Absolute Maximum
-40 C to +125 C -40 C to +150 C +175 C +320 C for 10 sec. 20 mA I -5 V I +20 dBm C.W. 50 mW
1. Operation of this device above any one of these parameters may cause permanent damage.
Die Bonding
Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the bottom surface of these devices, and are opposite the active junction. The devices are well suited for high temperature solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb36/Ag2 solders are acceptable for usage. Maximum solder re-flow temperature is 320 C for 10 seconds.
Die Bonding
For Hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Reflow the solder paste by applying Equal heat to the circuit at both die-mounting pads. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after die attach is completed.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
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M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
Circuit Mounting Dimensions ( Inches )
MADS-002545-1307M V1
0.012
0.012
0.012
0.012
0.009 0.009
0.012
0.012
Ordering Information
Part Number MADS-002545-1307MR MADS-002545-1307MG MADS-002545-1307MT Package Wafer on Ring Die in Carrie Tape/Reel
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M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.

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