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AlGaAs Flip-Chip PIN Diode
Features
* * * * * * * Low Series Resistance, 3 Ultra Low Capacitance, 25 fF High Switching Cutoff Frequency, 40 GHz 2 Nanosecond Switching Speed Can be Driven by Buffered TTL Silicon Nitride Passivation Polyamide Scratch Protection
MA4AGP907 V1
Package Outline
(Top View Shown Is With Diode Junction Up)
Cathode
Description and Applications
M/A-COM's MA4AGP907 is an Aluminum Gallium Arsenide Flip-Chip PIN diode. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. The diodes exhibit an extremely low RC Product, ( 0.1 ps ) and 2 nS switching characteristics. The useable frequency range is 100 MHz to 40 GHz. They are fully passivated with silicon nitride and have an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction and the anode airbridge during handling. The 25 fF capacitance of the MA4AGP907 is useable for mmwave switch and switched phase shifter applications. This diode is designed for use in pulsed or CW applications, where single digit nS switching speed is required. For surface mount assembly, the low capacitance of the MA4AGP907 makes it ideal for use in microwave multithrow switch assemblies, where the series capacitance of each "off" port adversely loads the input and affects VSWR.
Absolute Maximum Ratings @ 25 C1
Parameter Operating Temperature Storage Temperature JunctionTemperature Dissipated RF & DC Power RF C.W. Incident Power Mounting Temperature Maximum Rating -65 C to +125 C -65 C to +150 C +175 C 50 mW + 23 dBm C. W. +300 C for 10 sec.
1. Operation of this device above any one of these parameters may cause permanent damage.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
AlGaAs Flip-Chip PIN Diode
MA4AGP907 V1
Electrical Specifications and RF Data @ T A = 25 C
Parameters and Test Conditions Symbol Units 1 MHz & DC Specifications Min. Total Capacitance at -10 V Forward Resistance at +10 mA Forward Voltage at +10 mA Reverse Leak Current @ -45 V Switching Speed ( 10 to 90% RF Voltage )3 & (90 to 10% RF Voltage)3 Ct Rs Vf Ir Trise Tfall pF Volts uA nS Typ. 0.027 1.35 2 Max. 0.035 1.45 l -10 l 1 GHz Reference Data1,2 Min. Typ. 3.1 Max. -
NOTES: 1. Forward Series Resistance is determined by measuring Single Series Diode with a HP4291 Impedance Analyzer at 1 GHz. 2. Reverse current will not exceed 10 microamperes at the Maximum Voltage Rating. 3. Switching speed is measured between 10% and 90% or 90% to 10 % RFVoltage for a Single Series Mounted Diode. Driver Delay is Not included.
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
AlGaAs Flip-Chip PIN Diode
MA4AGP907 V1
Assembly Requirements Using Electrically Conductive Ag Epoxy and Solder
These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silk-screened circuits using Electrically Conductive Ag Epoxy, approximately 1-2 mils in thickness and cured at approximately 90C to 150 C per manufacturer's schedule . For extended cure times > 30 minutes, temperatures must be below 200 C. Sn Rich Solders ( > 30 % Sn by weight ) are not recommended due to the Tungsten Metallization scheme beneath the gold contacts. Indalloy type or 80 Au/20 Sn Solders are acceptable. Maximum soldering temperature must be < 300 C for < 10 sec.
Device Installation Procedures
The following guidelines should be observed to avoid damaging GaAs Flip-Chips.
Cleanliness
These chips should be handled in a clean environment. Do not attempt to clean die after installation.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. These devices are rated Class 0, ( 0-199V ) per HBM MIL-STD-883, method 3015.7 [C = 100pF 10%, R = 1.5kW 1%]. Even though tested die pass 50V ESD, they must be handled in a static-free environment.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pencil.
Ordering Information
Part Number MA4AGP907 MA4AGP907-T MA4AGP907-W Package Die in Carrier Tape in Reel Wafer on Frame
Circuit Mounting Dimensions (Inches)
0.013
0.012 (2) PL
0.008 (2) PL
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
AlGaAs Flip-Chip PIN Diode
MA4AGP907 V1
Single Series Diode Insertion Loss vs Frequency
I. Loss @5mA
0.0
I. Loss @15mA
I. Loss @50mA
Insertion Loss (dB)
-0.2
-0.4
-0.6
-0.8
-1.0 2 3 4 5 6 7 8 9 11 13 15 10 12 14
Frequency (GHz)
Single Series Diode Return Loss vs Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
-20.0 -22.0 -24.0
Return Loss (dB)
-26.0 -28.0 -30.0 -32.0 -34.0 -36.0 -38.0 -40.0 2 3 4 5 6 7 8 9 10 12 13 14 15
Frequency (GHz)
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
11
AlGaAs Flip-Chip PIN Diode
MA4AGP907 V1
Single Series Diode Isolation vs Frequency
Isolation @ -10V
-5.0
Isolation @ 0V
Isolation @ -1V
-10.0
Isolation (dB)
-15.0
-20.0
-25.0
-30.0
-35.0 10 11 12 13 14 15 2 3 4 5 6 7 8 9
Frequency (GHz)
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.

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