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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9031 Issued Date : 1998.07.01 Revised Date : 2001.09.14 Page No. : 1/4 HI117 PNP EPITAXIAL PLANAR TRANSISTOR Description The HI117 is designed for use in general purpose amplifier and low-speed switching applications. Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature .......................................................................................................... -55 ~ +150 C Junction Temperature .................................................................................................. +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ................................................................................................... 25 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage .................................................................................................. -100 V BVCEO Collector to Emitter Voltage............................................................................................... -100 V BVEBO Emitter to Base Voltage ......................................................................................................... -5 V IC Collector Current (Continue) .......................................................................................................... -4 A IC Collector Current (Peak) ................................................................................................................ -6 A Characteristics (Ta=25C) Symbol BVCBO BVCEO ICBO ICEO IEBO *VCE(sat) *VBE(on) *hFE1 *hFE2 Cob Min. -100 -100 1 500 Typ. Max. -1 -2 -2 -2.5 -2.8 200 Unit V V mA mA mA V V K pF Test Conditions IC=-1mA IC=-30mA VCB=-100V VCE=-50V VEB=-5V IC=-2A, IB=-8mA IC=-2A, VCE=-4V IC=-1A, VCE=-4V IC=-2A, VCE=-4V VCB=-10V, f=0.1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% Darlington Schematic C B R1 R2 E HI117 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 100000 Spec. No. : HE9031 Issued Date : 1998.07.01 Revised Date : 2001.09.14 Page No. : 2/4 Saturation Voltage & Collector Current hFE @ VCE=3V Saturation Voltage (mV) 1000 hFE @ VCE=4V 10000 hFE 100 VCE(sat) @ IC=100IB 1000 VCE(sat) @ IC=250IB 10 1 1 10 100 1000 10000 100 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 10000 On Voltage & Collector Current Saturation Voltage (mV) On Voltage (mV) VBE(sat) @ IC=250IB VBE(on) @ VCE=3V 1000 VBE(on) @ VCE=4V 1000 VBE(sat) @ IC=100IB 100 100 100 1000 10000 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Switching Time & Collector Current 10 VCC=30V, IC=250IB1=-250IB2 Capacitance & Reverse-Biased Voltage 1000 Switching Time (us) Tstg 1 Tf Capacitance (pF) 100 Cob Ton 0.1 1 10 10 0.1 1 10 100 Collector Current (A) Reverse-Biased Voltage (V) HI117 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9031 Issued Date : 1998.07.01 Revised Date : 2001.09.14 Page No. : 3/4 Safe Operating Area 10000 PT=1ms PT=100ms Collector Current-IC (mA) 1000 PT=1s 100 10 1 1 10 100 Forward Voltage-VCE (V) HI117 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking: Spec. No. : HE9031 Issued Date : 1998.07.01 Revised Date : 2001.09.14 Page No. : 4/4 A B C D H 127 Date Code I Ink Mark Control Code F 3 I E K 2 1 G Style : Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code : I *:Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HI117 HSMC Product Specification |
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