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| 55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-PLCC-O2 Features ! SINGLE COLOR. ! SUITABLE FOR ALL SMT ASSEMBLY AND Description The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. SOLDER PROCESS. ! IDEAL FOR BACKLIGHTING. ! AVAILABLE ! PACKAGE 3.5x2.8 mm SMD CHIP LED LAMP ON TAPE AND REEL. : 1500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE: DEC/13/2002 PAGE: 1 OF 4 Selection Guide P ar t No.. Pa No art No. D i ce ic Lens Typ L ens Ty pe ens Ty s Iv (mcd) Iv (m c d ) (mcd d @ 20 mA Miin. in . n GHB-PLCC-O2 Viewing Viewin g View in i Angle Ty p.. Typ Ty p yp 350 120 S UPER BRIGHTORANGE (InGaAlP) WATER CLE AR 180 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR Par am et er Pa aramete P eak Wavelength D ominate Wavelength D ev i c e evic e S uper Bright Orange S uper Bright Orange Ty p.. Ty p yp 610 601 29 30 2.0 2.5 10 Max .. ax x U n its nit nm nm nm pF V uA Tes t Co n d it io ns Test Conditio s est s IF =20mA IF =20mA IF =20mA VF=0V;f=1MHz IF =20mA VR = 5V S pectral Line Half-width S uper Bright Orange C apacitance Forward Voltage Reverse Current S uper Bright Orange S uper Bright Orange S uper Bright Orange Absolute Maximum Ratings at TA=25 C P a r a m e t er Paramet Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Sup er Briigh t Orang e Su p er B r g h Or an g u uper Br Bright Orang B 75 30 1 95 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.2 DATE: DEC/13/2002 PAGE: 2 OF 4 REV NO: V.2 DATE: DEC/13/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: DEC/13/2002 PAGE: 4 OF 4 |
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