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55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1104R-Y Features ! 3.0mmx1.0mm SMT ! LOW ! WIDE ! IDEAL Description LED, 2.0mm THICKNESS. The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACK LIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. 2000PCS / REEL. 3.0x1.0 mm SMD CHIP LED LAMP ! VARIOUS ! PACKAGE : Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE:DEC/12/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No art No. Dice ic Lens Typ L ens Ty p e ens Typ s Ty d Iv (mcd) Iv (m c d ) (mcd @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 60 120 Viewing Viewin g View in i Angle GHB-1104R-Y S UPER BRIGHT YELLOW (InGaAlP) WATER CLEAR 36 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength D ominate Wavelength Spectral Line Half-width C apacitance Forward Voltage Reverse Current D ev i c e evic e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p.. Ty p yp 590 588 28 25 2.0 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s IF=20mA IF=20mA IF=20mA V F =0V;f=1MHz IF=20mA VR = 5V Absolute Maximum Ratings at TA=25 C P ar a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w Su uper Br ht Ye Brig Yellow Brigh Yello B Y 125 30 150 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.2 DATE:DEC/12/2002 PAGE: 2 OF 4 REV NO: V.2 DATE:DEC/12/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE:DEC/12/2002 PAGE: 4 OF 4 |
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