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CYStech Electronics Corp.
Low Vcesat NPN Epitaxial Planar Transistor
Spec. No. : C848A3 Issued Date : 2005.02.04 Revised Date :2005.06.03 Page No. : 1/5
BTD2150A3
Features
* Low VCE(sat), typically 0.25V at IC / IB = 2A / 100mA 0.1V at IC / IB = 1A / 50mA * Excellent current gain characteristics * Complementary to BTB1424A3 * Pb-free package
Symbol
BTD2150A3
Outline
TO-92
BBase CCollector EEmitter
ECB
Absolute Maximum Ratings (Ta=25C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature
Note : *1. Single Pulse Pw350s,Duty2%.
Symbol VCBO VCEO VEBO IC(DC) IC(Pulse) Pd Tj Tstg
Limit 80 50 6 3 7 (Note) 750 150 -55~+150
Unit V V V A A mW C C
BTD2150A3
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. 80 50 6 180 180 150 Typ. 0.1 0.25 90 45 Max. 100 100 0.25 0.5 1.5 820 Unit V V V nA nA V V V MHz pF
Spec. No. : C848A3 Issued Date : 2005.02.04 Revised Date :2005.06.03 Page No. : 2/5
Test Conditions IC=50A, IE=0 IC=1mA, IB=0 IE=50A, IC=0 VCB=60V, IE=0 VEB=5V, IC=0 IC=1A, IB=50mA IC=2A, IB=100mA IC=2A, IB=200mA VCE=2V, IC=100mA VCE=2V, IC=500mA VCE=2V, IC=1A VCE=5V, IC=100mA, f=100MHz VCB=10V, f=1MHz
*Pulse Test : Pulse Width 380s, Duty Cycle2%
Classification Of hFE2
Rank Range R 180~290 S 270~560 T 390~820
Characteristic Curves
Grounded Emitter Output Characteristics
140 Collector Current---IC(mA)
Grounded Emitter Output Characteristics
700
2.5mA 2mA 1.5mA 1mA 500uA IB=0uA
100 80 60 40 20 0 0 1 2 3 4
400uA 300uA 200uA 100uA IB=0uA
Collector Current---IC(mA)
120
500uA
600 500 400 300 200 100 0
5
6
0
1
2
3
4
5
6
Collector To Emitter Voltage---VCE(V)
Collector To Emitter Voltage---VCE(V)
BTD2150A3
CYStek Product Specification
CYStech Electronics Corp.
Grounded Emitter Output Characteristics
2500
Collector Current---IC(mA)
Spec. No. : C848A3 Issued Date : 2005.02.04 Revised Date :2005.06.03 Page No. : 3/5
Grounded Emitter Output Characteristics
3500
10mA 8mA 25mA 20mA 15mA 10mA
2000 1500 1000 500 0 0 1 2 3 4 5 Collector To Emitter Voltage---VCE(V)
Collector Current---IC(mA)
3000 2500 2000 1500 1000 500 0
6mA 4mA 2mA IB=0mA
5mA IB=0mA
6
0
1
2
3
4
5
6
Collector To Emitter Voltage---VCE(V)
Current gain vs Collector current
1000
VCE=5V
Saturation voltage vs Collector current
1000
VCE(sat)
Saturation voltage---(mV)
Current gain---HFE
100
IC=40IB
100
VCE=2V VCE=1V
10
IC=10IB IC=20IB
10 1 10 100 1000 Collector current---IC(mA) 10000
1 1 10 100 1000 Collector current---IC(mA) 10000
Saturation votlage vs Collector current
10000
Power Derating Curve 800 Power Dissipation---PD(mW)
VBE(sat)@IC=10IB
700 600 500 400 300 200 100 0 0 50 100 150 200
Saturation voltage---(mV)
1000
100 1 10 100 1000 10000 Collector current---IC(mA)
Ambient Temperature --- Ta( )
BTD2150A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Taping Outline
H2 H2 H2A H2A A D2
Spec. No. : C848A3 Issued Date : 2005.02.04 Revised Date :2005.06.03 Page No. : 4/5
H3
L
H4 H L1 H1 F1F2 D1
D
W1 W
T2 T T1
P1
P
P2
DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 -
Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch
Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255
BTD2150A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Dimension
2
Spec. No. : C848A3 Issued Date : 2005.02.04 Revised Date :2005.06.03 Page No. : 5/5
A B
1 2 3
Marking:
D2150
3
C
D
H I E F
G
1
Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2150A3
CYStek Product Specification

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