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 AP4563GH
Pb Free Plating Product
Advanced Power Electronics Corp.
Simple Drive Requirement
D1/D2
N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET
N-CH
BVDSS RDS(ON) ID BVDSS RDS(ON) ID
D1
40V 30m 30A -40V 36m -27A
Good Thermal Performance Fast Switching Performance RoHS Compliant
S1
G1
S2
P-CH
G2
Description S1
TO-252-4L
The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and costeffectiveness.
G1
D2
G2 S1 S2
Absolute Maximum Ratings
Symbol VDS VGS ID@TC=25 ID@TC=100 IDM PD@TC=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3 3
Rating N-channel 40 20 30 19 100 39 0.31 -55 to 150 -55 to 150 P-channel -40 20 -27 -17 -100 -41.7 -0.34
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-c (N-CH) Rthj-c (P-CH) Rthj-a Parameter Thermal Resistance Junction-case Thermal Resistance Junction-case
3 3 3
Value Max. Max. Max. 3.2 3 110
Units /W /W /W
Thermal Resistance Junction-ambient
Data and specifications subject to change without notice
200617051-1/7
AP4563GH
N-CH Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
o
Parameter Drain-Source Breakdown Voltage
Test Conditions VGS=0V, ID=250uA
Min. 40 1 -
Typ. 0.04 22 10 4 5 10 5 23 7 170 95 1.8
Max. Units 30 40 3 1 25 100 16 2.7 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA
RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg
Static Drain-Source On-Resistance 2
VGS=10V, ID=20A VGS=4.5V, ID=15A VDS=VGS, ID=250uA VDS=10V, ID=20A
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=150 C)
o o
VDS=40V, VGS=0V VDS=32V, VGS=0V VGS=20V ID=20A VDS=30V VGS=4.5V VDS=20V ID=1A RG=3.3,VGS=10V RD=20 VGS=0V VDS=25V f=1.0MHz f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
2
1100 1760
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2
Test Conditions IS=20A, VGS=0V IS=20A, VGS=0V dI/dt=100A/s
Min. -
Typ. 26 17
Max. Units 1.3 V ns nC
Reverse Recovery Time Reverse Recovery Charge
2/7
AP4563GH
P-CH Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (T j=25 C) Drain-Source Leakage Current (T j=150 C)
o o
Test Conditions VGS=0V, ID=-250uA
2
Min. -40 -1 -
Typ. -0.03 19 18 4 11 12 6 68 36 250 200 8.5
Max. Units 36 48 -3 -1 -25 100 30 13 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25,ID=-1mA
RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg
VGS=-10V, ID=-18A VGS=-4.5V, ID=-13A VDS=VGS, ID=-250uA VDS=-10V, ID=-18A VDS=-40V, VGS=0V VDS=-32V, VGS=0V VGS=20V ID=-18A VDS=-30V VGS=-4.5V VDS=-20V ID=-1A RG=3.3,VGS=-10V RD=20 VGS=0V VDS=-25V f=1.0MHz f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
2
1570 2500
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2
Test Conditions IS=-18A, VGS=0V IS=-18A, VGS=0V dI/dt=-100A/s
Min. -
Typ. 33 26
Max. Units -1.3 V ns nC
Reverse Recovery Time Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.N-CH , P-CH are same .
3/7
AP4563GH
N-Channel
80
80
T C = 25 C
o
10V 7.0V
60
T C =150 o C ID , Drain Current (A)
10V 7.0V
60
ID , Drain Current (A)
5.0V
40
40
5.0V 4.5V
4.5V
20
20
V G =3.0V
0 0 2 4 6 8 10
0 0 2 4 6
V G =3.0V
8
10
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
80
1.8
I D = 15 A T C =25 o C
60
I D =20A V G =10V Normalized RDS(ON)
1.4
RDS(ON) (m )
40
1.0
-6.3 -5
20
0.6 2 4 6 8 10 -50 0 50 100 150
V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
1.5
10
Normalized VGS(th) (V)
8
1.1
6
IS(A)
T j =150 o C
4
T j =25 o C
0.7
2
0 0 0.2 0.4 0.6 0.8 1 1.2
0.3 -50 0 50 100 150
V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( C)
o
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
4/7
AP4563GH
N-Channel
f=1.0MHz
12
10000
VGS , Gate to Source Voltage (V)
9
I D = 20 A V DS = 30 V
1000
C iss
6
C (pF)
C oss
100
C rss
3
0 0 5 10 15 20
10
1
5
9
13
17
21
25
29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthjc)
Duty factor=0.5
0.2
ID (A)
0.1
10
0.1
0.05
1ms T C =25 C Single Pulse
1 0.1 1 10 100 1000
PDM
0.02
t T
o
10ms 100ms 1s DC
0.01 Single Pulse
Duty factor = t/T Peak Tj = PDM x Rthjc + TC
0.01 0.00001 0.0001 0.001 0.01 0.1 1
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
50
V DS =5V
40
VG QG
ID , Drain Current (A)
30
T j =25 o C
T j =150 o C
4.5V QGS QGD
20
10
Charge
0 0 2 4 6 8
Q
V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
5/7
AP4563GH
P-Channel
80 80
T C = 25 o C -ID , Drain Current (A)
60
-10V -7.0V -ID , Drain Current (A)
60
T C =150 C
o
-10V -7.0V
-5.0V -4.5V
40
-5.0V
40
-4.5V
20
V G = - 3.0V
20
V G = - 3.0V
0 0 2 4 6 8 10
0 0 2 4 6 8 10
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
1.8
I D = -13 A
80
T C =25 C
1.4
o
I D = -18 A V G = - 10V Normalized RDS(ON)
RDS(ON) (m)
60
1.0
40
20
0.6 2 4 6 8 10 -50 0 50 100 150
-V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
1.5
6
Normalized -VGS(th) (V)
1.2
4
1.1
-IS(A)
T j =150 o C
2
T j =25 o C
0.7
0 0 0.2 0.4 0.6 0.8 1
0.3
-50
0
50
100
150
-V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
6/7
AP4563GH
P-Channel
f=1.0MHz
12 10000
-VGS , Gate to Source Voltage (V)
I D =-18A V DS =-30V
9
6
C (pF)
C iss
1000
3
C oss C rss
0 0 10 20 30 40
100 1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
-V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthjc)
Duty factor=0.5
0.2
-ID (A)
0.1
10
0.1
0.05
PDM
0.02
T C =25 C Single Pulse
o
1ms 10ms 100ms 1s DC
10 100 1000
t T
0.01
Single Pulse
Duty factor = t/T Peak Tj = PDM x Rthjc + T C
1 0.1 1
0.01 0.00001 0.0001 0.001 0.01 0.1 1
-V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
50
V DS =-5V
40
VG QG -4.5V QGS QGD
-ID , Drain Current (A)
T j =25 o C
30
T j =150 o C
20
10
Charge
0 0 2 4 6 8
Q
-V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
7/7


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