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| STP130NS04ZB - STB130NS04ZB-1 STB130NS04ZB - STW130NS04ZB N-channel clamped - 7 m - 80A TO-220/I2/D2PAK/TO-247 Fully protected mesh overlayTM MOSFET General features Type STP130NS04ZB STB130NS04ZB STW130NS04ZB STB130NS04ZB VDSS clamped clamped clamped clamped RDS(on) <9 m <9 m <9 m <9 m ID 80A 80A 80A 80A 3 1 2 TO-220 TO-247 100% avalanche tested Low capacitance and gate charge 175C maximum junction temperature 3 1 3 12 DPAK IPAK Description This fully clamped MOSFET is produced by using the latest advanced Company's Mesh Overlay process which is based on a novel strip layout. The inherent benefits of the new technology coupled with the extra clamping capabilities make this product particularly suitable for the harshest operation conditions such as those encountered in the automotive environment .Any other application requiring extra ruggedness is also recommended. Internal schematic diagram Applications High switching current Linear applications Order codes Part number STP130NS04ZB STB130NS04ZBT4 STW130NS04ZB STB130NS04ZB-1 Marking P130NS04ZB B130NS04ZB W130NS04ZB B130NS04ZB Package TO-220 DPAK TO-247 IPAK Packaging Tube Tape & reel Tube Tube October 2006 Rev 3 1/16 www.st.com 16 Contents STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 6 Test circuit ................................................ 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Electrical ratings 1 Electrical ratings Table 1. Symbol VDS VGS ID ID IDG IGS IDM(1) PTOT Absolute maximum ratings Parameter Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC = 100C Drain gate current (continuous) Gate source current (continuous) Drain current (pulsed) Total dissipation at TC = 25C Derating factor Value clamped clamped 80 60 50 50 320 300 2.0 4 -55 to 175 Unit V V A A mA mA A W W/C KV C VESD(G-S) TJ Tstg Gate-source ESD(HBM-C=100 pF, R=1.5 K) Operating junction temperature Storage temperature 1. Pulse width limited by safe operating area Table 2. Thermal data TO-220 DPAK/IPA K 0.50 35 62.5 300 50 C TO-247 Unit C/W C/W Rthj-case Rthj-pcb(1) Rthj-a Tl(2) Thermal resistance junction-case Max Thermal resistance junction-pcb Max Thermal resistance junction-ambient Max Maximum lead temperature for soldering purpose 1. When mounted on 1 inch FR4 2oZ Cu 2. (1.6 mm from case, for 10 sec) Table 3. Symbol IAS EAS Avalanche characteristics Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) Single pulse avalanche energy (starting Tj=25C, Id=Iar, Vdd=30V) Value 80 500 Unit A mJ 3/16 Electrical characteristics STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol V(BR)DSS IDSS IGSS VGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate-source breakdown voltage Gate threshold voltage Static drain-source on resistance Test conditions ID = 1 mA, VGS = 0 -40 < Tj < 175 C VDS = 16 V,Tj = 25 C VDS = 16 V,Tj = 125 C VGS = 10 V, Tj = 25 C IGS= 100A VDS = VGS = ID = 1 mA VGS = 10 V ,ID = 40 A 18 2 7 4 9 Min. 33 10 100 10 Typ. Max. Unit V A A nA V V m Table 5. Symbol gfs (1) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Test conditions VDS =15V, ID = 40A Min. Typ. 50 2700 1275 285 40 10 220 100 80 20 27 Max. Unit S pF pF pF ns ns ns ns nC nC nC VDS =25V, f=1 MHz, VGS=0 VDD = 17.5 V, ID = 40 A, RG = 4.7 , VGS = 10 V (see Figure 13) VDD = 17.5 V, ID = 40 A, RG = 4.7 , VGS = 10 V (see Figure 13) VDD=20V, ID = 80A VGS =10V (see Figure 14) 105 1. Pulsed: pulse duration=300s, duty cycle 1.5% 4/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Electrical characteristics Table 6. Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD=80A, VGS=0 ISD=80A, di/dt = 100A/s, VDD=25V, Tj=150C (see Figure 15) 90 0.18 4 Test conditions Min Typ. Max 80 320 1.5 Unit A A V ns C A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% 5/16 Electrical characteristics STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 2.1 Figure 1. Electrical characteristics (curves) Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 6/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Figure 7. Gate charge vs gate-source voltage Figure 8. Electrical characteristics Normalized on resistance vs temperature Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Source-drain diode forward characteristics Figure 11. Capacitance variations Figure 12. Normalized BVDSS vs temperature 7/16 Test circuit STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 3 Test circuit Figure 14. Gate charge test circuit Figure 13. Switching times test circuit for resistive load Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform 8/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/16 Package mechanical data STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 TO-220 MECHANICAL DATA DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154 oP Q 10/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0 4.88 15 1.27 1.4 2.4 0.4 4 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch 3 1 11/16 Package mechanical data STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 TO-247 MECHANICAL DATA mm. MIN. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 0.140 0.177 0.216 14.80 4.30 0.560 0.14 0.728 0.143 0.216 TYP MAX. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 MIN. 0.19 0.086 0.039 0.079 0.118 0.015 0.781 0.608 0.214 0.582 0.17 inch TYP. MAX. 0.20 0.102 0.055 0.094 0.134 0.03 0.793 0.620 DIM. A A1 b b1 b2 c D E e L L1 L2 oP oR S 12/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Package mechanical data TO-262 (I2PAK) MECHANICAL DATA mm. DIM. MIN. A A1 b b1 c c2 D e e1 E L L1 L2 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 TYP MAX. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 MIN. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.194 0.393 0.511 0.137 0.050 TYP. MAX. 0.181 0.107 0.034 0.066 0.027 0.052 0.368 0.106 0.202 0.410 0.551 0.154 0.055 inch 13/16 Packaging mechanical data STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 5 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956 BASE QTY 1000 * on sales type 14/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Revision history 6 Revision history Table 7. Date 10-Feb-2005 14-Jan-2006 03-Oct-2006 Revision history Revision 1 2 3 First release. Inserted DPAK, complete version. Inserted IPAK. Changes 15/16 STP130NS04ZB-STB130NS04ZB-STW130NS04ZB-STB130NS04ZB-1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 16/16 |
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