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| U2793B 300-MHz Quadrature Modulator Description The IC U2793B is a 300-MHz quadrature modulator that uses Atmel Wireless & Microcontrollers' advanced UHF process. It features low current consumption, singleended RF ports and adjustment-free application, which makes the device suitable for all digital radio systems, e.g., GSM, PCN, JDC and WLAN. As an option, output level and spurious products are adjustable at Pins 19 and 20. In conjunction with Atmel Wireless & Microcontrollers' U2795B mixer, an up converter up to 2 GHz can be realized. Electrostatic sensitive device. Observe precautions for handling. Features D Supply voltage: 5 V (typical) D Low power consumption: 15 mA / 5 V (typical at 0 dBm output level D Output level and spurious products adjustable (optional) D Excellent sideband suppression by means of duty cycle regeneration of the LO input signal D Phase-control loop for precise 90 phase shifting D Power-down mode D Low LO input level: -15 dBm (typical) D 50-W single-ended LO and RF port D LO frequency range of 30 MHz to 300 MHz Benefits D Extended talk time due to increased battery life D Few external components results in cost and board space saving D Adjustment free hence saves time D Modular system for different applications by adding U2795B reduces the costs Block Diagram SPD BBAi BBAi LO i LO i 10 9 8 PD 1 V Power 6,7 S down V 13 Ref 19 LP2 LP1 20 RFo 4 ACGND ACGND 14 Duty cycle 15 regenerator Frequency doubler 0 90 90 control loop S BBBi BBBi 11 12 93 7672 e 2 3,16,17,18 GND Figure 1. Block diagram 5 Ordering Information Extended Type Number U2793B-MFS U2793B-MFSG3 Package SSO20 SSO20 Tube Taped and reeled Remarks Rev. A4, 09-Oct-00 1 (9) U2793B Pin Description Pin PD ACGND GND RFo ACGND VS VS SPD BBAi BBAi 1 2 3 4 5 U2793B 6 7 8 9 10 94 7862 e Symbol PD GND RFo VS VS SPD BBAi BBAi BBBi BBBi VRef LOi LOi GND GND GND LP2 LP1 ACGND AC ground Ground RF output Function Power down port 20 19 18 17 16 15 14 13 12 11 LP1 LP2 GND GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ACGND AC ground Supply voltage Supply voltage Settling time power down Baseband input A Baseband input A inverse Baseband input B Baseband input B inverse Reference voltage (2.5 V) Input LO Input LO inverse, typically grounded Ground Ground Ground Output low pass and power control Output low pass and power control GND LOi LOi VRef BBBi BBBi Figure 2. Pinning SSO20 Absolute Maximum Ratings Parameters Supply voltage Input voltage Junction temperature Storage temperature range Pins 6 and 7 Pins 9, 10, 11, 12, 14 and 15 Symbol VS Vi Tj Tstg Value 6 0 to VS 125 -40 to +125 Unit V V C C Operating Range Parameters Supply voltage Ambient temperature range Pins 6 and 7 Symbol VS Tamb Value 4.5 to 5.5 -40 to +85 Unit V C Thermal Resistance Parameters Junction ambient SSO20 Symbol Rthja Value 140 Unit K/W 2 (9) Rev. A4, 09-Oct-00 U2793B Electrical Characteristics Test conditions (unless otherwise specified); VS = 5 V, Tamb = 25C, referred to test circuit. System impedance Zo = 50 W, fLO = 150 MHz, PLO = -15 dBm, VBBi = 1.0 Vpp, differential Parameters Supply-voltage range Supply current Baseband inputs Input-voltage range (diff.) Input impedance Input-frequency range LO input Frequency range Input level 1 Test conditions / Pin Pins 6 and 7 Pins 6 and 7 Pin 9-10, 11-12 Symbol VS IS VBBi ZBBi fBBi Min. 4.5 Typ. 5 15 1000 30 Max. 5.5 Unit V mA 1500 50 300 mVpp kW MHz MHz dBm W 0 30 -15 2) Pins 14 and 15 fLOi PLOi ZiLO VSWRLO DCRLO Pin 4 fLO = 150 MHz, VBBi = 1 Vpp, differential fLO = 50 MHz, VBBi = 0.3 Vpp, differential PLO = -20 dBm 3 -5 Input impedance Voltage standing wave ratio Duty-cycle range RF output Output level 3.5 0.4 -3 -1 0 0.6 dBm PRFo LO suppression Voltage standing wave ratio Sideband suppression Phase error Noise floor Power-down mode Supply current Settling time Switching voltage Power on Power down Reference voltage Voltage range Output impedance Note: 1 Note: 2 Note: 3 4 LORFo VSWRRF SBSRFo Pe Ae 32 35 45 1.4 45 <1 <"0.25 -137 -143 1 10 10 2 dB dB deg dB dBm/Hz Amplitude error VBBi = 2 V, VBBi = 3 V VBBi = VBBi = 2.5 V VPD v 0.5 V, Pins 6, 7, VPD = 1 V Pins 1 to 4 CSPD = 100 pF CLO = 100 pF, CRFo = 1 nF Pin 1 NFL IPD tSPD mA ms VPDon VPDdown Pin 13 VRef ZoRef 4 1 2.5 "5% 30 V V V W Required LO level is a function of the LO frequency. The LO input impedance is consisting of a 50 W resistor in series with a 15 pF capacitor With the Pins 19 and 20 spurious performance especially for low frequency application can be improved by adding a chip capacitor between LP1 and LP2. In conjunction with a parallel resistor the output level can be adjusted to the following mixer stage without degration of LO suppression and noise performance Rev. A4, 09-Oct-00 3 (9) U2793B Note: 4 2.57 2.56 2.55 V (V) ref 2.54 2.53 2.52 2.51 2.5 -40 95 9655 which would decrease if the I/Q input level is reduced. For Tamb = -40 to +85C and VS = 4.5 to 5.5 V 20 Supply current ( mA ) 16 12 8 4 0 -40 0 40 Temperature ( C ) 80 120 95 9657 0 40 Temperature ( C ) 80 120 Figure 3. Reference voltage versus Tamb Figure 5. Supply current versus Tamb 8 0 4 PLO ( dBm ) 120 IP3 ( dBm ) 6 -10 -20 2 -30 0 -40 95 9656 -40 0 40 Temperature ( C ) 80 0 95 9658 50 100 150 200 250 300 fLO ( MHz ) Figure 4. OIP3 versus Tamb, LO = 150 MHz, level -10 dBm Figure 6. Recommended LO power range versus LO frequency at Tamb = 25C 4 (9) Rev. A4, 09-Oct-00 U2793B 0 1200 1000 PO=0dBm VBBi ( mVpp ) 800 600 400 200 0 0 40 Temperature ( C ) 80 120 95 9661 PO=-1dBm Output power ( dBm ) -0.4 -0.8 -1.2 -1.6 -2 -40 PO=-3dBm 0 50 100 150 200 250 300 95 9659 fLO ( MHz ) Figure 7. Output power versus Tamb Figure 9. Typical required VBBi input signal (differential) versus LO frequency for PO = 1 dBm and PO = -3 dBm 0 -4 PO ( dBm ) -8 -12 -16 0 95 9660 50 100 150 200 250 300 fLO ( MHz ) Figure 8. Typical output power vs. LO frequency at Tamb = 25C, VBBi = 250 mV (differential) Rev. A4, 09-Oct-00 5 (9) U2793B Evaluation Board Circuitry L1 PD C2 2 19 18 C1 1 20 C9 R1 3 C3 OUT C4 5 U2793B VS L2 C5 6 7 4 17 16 C7 15 14 C8 13 12 LO 8 C6 9 10 11 A Ainv GND B VRef Binv 94 7868 e Figure 10. Evaluation board circuitry Part list C1, C2, C3, C4, C6 C7, C8 C5 C9, R1 L1, L2 1 nF 100 pF 100 nF 1 to 10 pF PCB Inductor 50-W Microstrip optional The above listed components result in a PD settling time of < 20 ms. Use of other component values will require consideration for time requirements in burst-mode applications. 6 (9) Rev. A4, 09-Oct-00 U2793B PCB Layout Evaluation Board 947893e Figure 11. PCB layout Application Circuit Bias network for AC-coupled baseband inputs (VBA, VBB). R1 = 2.5 kW, R2 x 10 kW for w 35 dB LO suppression which is in reference to < 2 mV input offset. R1 R2 10 BBAi BBAi LOi 14 LO i 15 Duty cycle regenerator Frequency doubler 0 90 90 control loop 9 V Ref 13 1 Power down PD 6,7 V S 8 S PD 19 LP2 LP1 20 S 4 RFo ACGND BB Bi BBBi 11 12 93 7673 e 2 3,16,17,18 GND 5 ACGND Figure 12. Application circuit with AC-coupled baseband inputs Rev. A4, 09-Oct-00 7 (9) U2793B V Ref 100n 10 10k BBAi 9 10k BBAi LO Baseband processing LOi 14 Duty cycle regenerator Frequency doubler 0 90 90 control loop 13 1n PD 1 Power down Power down S 6,7 V 100n 8 S PD 1n OUT 1n 19 LP2 LP1 20 100p LO i 15 S 4 RFo 10k 10k 100n BB Bi 11 BBBi 12 3,16,17,18 GND 2 ACGND 1n 1n 5 ACGND 14188 Figure 13. Application circuit with DC-coupled baseband inputs Package Information Package SSO20 Dimensions in mm 6.75 6.50 5.7 5.3 4.5 4.3 1.30 0.25 0.65 5.85 20 11 0.15 0.05 0.15 6.6 6.3 technical drawings according to DIN specifications 13007 1 10 8 (9) Rev. A4, 09-Oct-00 U2793B Ozone Depleting Substances Policy Statement It is the policy of Atmel Germany GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Atmel Germany GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Atmel Germany GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. 2. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Atmel Wireless & Microcontrollers products for any unintended or unauthorized application, the buyer shall indemnify Atmel Wireless & Microcontrollers against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Data sheets can also be retrieved from the Internet: http://www.atmel-wm.com Atmel Germany GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2594, Fax number: 49 (0)7131 67 2423 Rev. A4, 09-Oct-00 9 (9) |
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