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Data sheet acquired from Harris Semiconductor SCHS138 CD74HC93, CD74HCT93 High Speed CMOS Logic 4-Bit Binary Ripple Counter Description The Harris CD74HC93 and CD74HCT93 are high speed silicon-gate CMOS devices and are pin-compatible with low power Schottky TTL (LSTTL). These 4-bit binary ripple counters consist of four master-slave flip-flops internally connected to provide a divide-by-two-section and a divid- byeight-section. Each section has a separate clock input (CP0 and CP1) to innate state changes of the counter on the HIGH to LOW clock transition. Sate changes of the Qn outputs do not occur simultaneously because of internal ripple delays. Therefore, decoded output signals are subject to decoding spikes and should not be used for clocks or strobes. A gated AND asynchronous master reset (MR1 and MR2 is provided which overrides both clocks and resets (clears) all flip-flops. Because the output from the divide by two section is not internally connected to the succeeding stages, the device may be operated in various counting modes. In a 4-bit ripple counter the output Q0 must be connected externally to input CP1. The input count pulses are applied to clock input CP0. Simultaneous frequency divisions of 2, 4, 8, and 16 are performed at the Q0, Q1, Q2, and Q3 outputs as shown in the function table. As a 3-bit ripple counter the input count pulses are applied to input CP1. Simultaneous frequency divisions of 2, 4, and 8 are available at the Q1, Q2, Q3 outputs. Independent use of the first flipflop is available if the reset function coincides with the reset of the 3-bit ripple-through counter. August 1997 Features * Can Be Configured to Divide By 2, 8, and 16 [ /Title (CD74 HC93, CD74 HCT93 ) /Subject High peed MOS ogic -Bit inary ipple ounte ) * Asynchronous Master Reset * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times * Significant Power Reduction Compared to LSTTL Logic ICs * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH Pinout CD74HC93, CD74HCT93 (PDIP, SOIC) TOP VIEW CP1 1 MR1 2 MR2 3 NC 4 VCC 5 NC 6 NC 7 14 CPO 13 NC 12 Q0 11 Q3 10 GND 9 Q1 8 Q2 Ordering Information PART NUMBER CD74HC93E CD74HCT93E CD74HC93M CD74HCT93M NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 14 Ld PDIP 14 Ld PDIP 14 Ld SOIC 14 Ld SOIC PKG. NO. E14.3 E14.3 M14.15 M14.15 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) Harris Corporation 1997 File Number 1849.1 1 CD74HC93, CD74HCT93 TRUTH TABLE OUTPUTS COUNT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Q0 L H L H L H L H L H L H L H L H Q1 L L H H L L H H L L H H L L H H Q2 L L L L H H H H L L L L H H H H Q3 L L L L L L L L H H H H H H H H NOTE: H = High Voltage Level, L = Low Voltage Level MODE SELECTION RESET OUTPUTS MR1 H L H L MR2 H H L L Q0 L Count Q1 L Count OUTPUTS Q2 L Count Q3 L Count NOTE: H = High Voltage Level, L = Low Voltage Level 2 CD74HC93, CD74HCT93 Absolute Maximum Ratings DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .50mA Thermal Information Thermal Resistance (Typical, Note 3) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER HC TYPES High Level Input Voltage VIH 2 4.5 6 Low Level Input Voltage VIL 2 4.5 6 High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current II ICC VCC or GND VCC or GND VOL VIH or VIL VOH VIH or VIL -0.02 -0.02 -0.02 -4 -5.2 0.02 0.02 0.02 4 5.2 0 2 4.5 6 4.5 6 2 4.5 6 4.5 6 6 6 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 0.1 8 1.5 3.15 4.2 1.9 4.4 5.9 3.84 5.34 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 1 80 1.5 3.15 4.2 1.9 4.4 5.9 3.7 5.2 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 1 160 V V V V V V V V V V V V V V V V A A SYMBOL VI (V) IO (mA) VCC (V) MIN 25oC TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS 3 CD74HC93, CD74HCT93 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER HCT TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 4) NOTE: 4. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. II ICC ICC VCC to GND VCC or GND VCC -2.1 VOL VIH or VIL VIH VIL VOH VIH or VIL -0.02 4.5 to 5.5 4.5 to 5.5 4.5 2 4.4 0.8 2 4.4 0.8 2 4.4 0.8 V V V SYMBOL VI (V) IO (mA) VCC (V) MIN 25oC TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 0 0 - 5.5 5.5 4.5 to 5.5 - 100 0.1 8 360 - 1 80 450 - 1 160 490 A A A HCT Input Loading Table INPUT CP0, CP1 MR1, MR2 UNIT LOADS 0.6 0.4 NOTE: Unit Load is ICC limit specified in DC Electrical Specifications table, e.g. 360A max at 25oC. Prerequisite For Switching Specifications PARAMETER HC TYPES Maximum Clock Frequency fMAX 2 4.5 6 Clock Pulse Width CP0, CP1 tw 2 4.5 6 6 30 35 80 16 14 5 24 28 100 20 17 4 20 24 120 24 20 MHz MHz MHz ns ns ns SYMBOL TEST CONDITIONS VCC (V) 25oC MIN MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS 4 CD74HC93, CD74HCT93 Prerequisite For Switching Specifications PARAMETER Reset Pulse Width SYMBOL tW (Continued) 25oC MIN 80 16 14 50 10 9 MAX -40oC TO 85oC MIN 100 20 17 65 13 11 MAX -55oC TO 125oC MIN 120 24 20 75 15 13 MAX UNITS ns ns ns ns ns ns TEST CONDITIONS VCC (V) 2 4.5 6 Reset Removal Time tREM 2 4.5 6 HCT TYPES Maximum Clock Frequency Clock Pulse Width CP0, CP1 Reset Pulse Width Reset Removal Time fMAX tW tW tREM Input tr, tf = 6ns 25oC MIN TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS 4.5 4.5 4.5 4.5 30 16 16 10 24 20 20 13 20 24 24 15 mHz ns ns ns Switching Specifications PARAMETER HC TYPES Propagation Delay Time CP0 to Q0 SYMBOL TEST CONDITIONS VCC (V) tPLH, tPHL CL = 50pF CL = 50pF CL = 15pF CL = 50pF 2 4.5 5 6 2 4.5 6 2 4.5 6 2 4.5 5 6 2 4.5 5 6 2 4.5 6 - 10 - 125 25 - 155 31 26 170 34 29 230 46 39 305 61 52 195 39 - 190 38 32 205 41 35 280 56 48 370 74 63 235 47 40 110 22 19 10 19 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF pF 21 135 27 23 185 37 31 245 49 - CP1 to Q1 tPLH, tPHL CL = 50pF CL = 50pF CL = 50pF CP1 to Q2 tPLH, tPHL CL = 50pF CL = 50pF CL = 50pF CP1 to Q3 tPLH, tPHL CL = 50pF CL = 50pF CL = 15pF CL = 50pF 21 - 42 155 31 MR1, MR2 to Qn tPLH, tPHL CL = 50pF CL = 50pF CL = 15pF CL = 50pF 13 26 25 75 15 13 10 - - 33 95 19 16 10 10 - Output Transition Time tTLH, tTHL CL = 50pF Input Capacitance Power Dissipation Capacitance CIN CPD CL = 50pF - - 5 CD74HC93, CD74HCT93 Switching Specifications Input tr, tf = 6ns (Continued) 25oC MIN TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS PARAMETER HCT TYPES Propagation Delay Time CP0 to Q0 CP1 to Q1 SYMBOL TEST CONDITIONS VCC (V) tPLH, tPHL CL = 50pF CL = 15pF 4.5 5 4.5 5 4.5 5 4.5 5 4.5 5 4.5 - - 14 24 13 25 34 34 46 58 33 15 10 - - 43 43 58 73 41 19 10 - - 51 51 69 87 50 22 10 - ns ns ns ns ns ns ns ns ns ns ns pF pF tPLH, tPHL CL = 50pF CL = 15pF CP1 to Q2 tPLH, tPHL CL = 50pF CL = 15pF CP1 to Q3 tPLH, tPHL CL = 50pF CL = 15pF MR1, MR2 to Qn tPLH, tPHL CL = 50pF CL = 15pF Output Transition Time Input Capacitance Power Dissipation Capacitance tTLH, tTHL CIN CPD CL = 50pF CL = 50pF - Test Circuits and Waveforms trCL CLOCK INPUT 90% 10% tH(H) 50% GND tH(L) VCC DATA INPUT tSU(H) tTLH 90% OUTPUT tPLH tREM VCC SET, RESET OR PRESET tSU(L) tTHL 90% 50% 10% tPHL tREM 3V SET, RESET OR PRESET 50% GND tSU(H) tTLH OUTPUT 90% 1.3V tPLH 90% 1.3V 10% tPHL tSU(L) tTHL DATA INPUT tfCL VCC CLOCK INPUT trCL 2.7V 0.3V tH(H) 1.3V GND tH(L) 3V 1.3V 1.3V 1.3V GND tfCL 3V 50% GND 1.3V GND IC CL 50pF IC CL 50pF FIGURE 1. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS FIGURE 2. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 6 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof. Copyright (c) 1998, Texas Instruments Incorporated |
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