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MAC08BT1, MAC08MT1
Preferred Device
Sensitive Gate Triacs
Silicon Bidirectional Thyristors
Designed for use in solid state relays, MPU interface, TTL logic and other light industrial or consumer applications. Supplied in surface mount package for use in automated manufacturing. * Sensitive Gate Trigger Current in Four Trigger Modes * Blocking Voltage to 600 Volts * Glass Passivated Surface for Reliability and Uniformity * Surface Mount Package * Device Marking: Logo, MAC08BT1: AC08B; MAC08MT1: A08M, and Date Code
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TRIAC 0.8 AMPERE RMS 200 thru 600 VOLTS
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Peak Repetitive Off-State Voltage(1) (Sine Wave, 50 to 60 Hz, Gate Open, TJ = 25 to 110C) MAC08BT1 MAC08MT1 On-State Current RMS (TC = 80C) (Full Sine Wave 50 to 60 Hz) Peak Non-repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, TC = 25C) Circuit Fusing Considerations (Pulse Width = 8.3 ms) Peak Gate Power (TC = 80C, Pulse Width Average Gate Power (TC = 80C, t = 8.3 ms) Operating Junction Temperature Range Storage Temperature Range Symbol VDRM, VRRM 200 600 IT(RMS) ITSM 0.8 8.0 Amps Amps Value Unit Volts
MT2 G
MT1
4 1 23
SOT-223 CASE 318E STYLE 11
I2t PGM PG(AV) TJ Tstg
0.4 5.0 0.1 - 40 to +110 - 40 to +150
A2s 1 Watts Watt C 2 3 4
PIN ASSIGNMENT
Main Terminal 1 Main Terminal 2 Gate Main Terminal 2
v 1.0 s)
ORDERING INFORMATION
C Device MAC08BT1 Package SOT223 Shipping 16mm Tape and Reel (1K/Reel) 16mm Tape and Reel (1K/Reel)
(1) VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
MAC08MT1
SOT223
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 1999
1
February, 2000 - Rev. 2
Publication Order Number: MAC08BT1/D
MAC08BT1, MAC08MT1
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Ambient PCB Mounted per Figure 1 Thermal Resistance, Junction to Tab Measured on MT2 Tab Adjacent to Epoxy Maximum Device Temperature for Soldering Purposes (for 10 Seconds Maximum) Symbol RJA RJT TL Max 156 25 260 Unit C/W C/W C
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted; Electricals apply in both directions)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) TJ = 25C TJ = 110C IDRM, IRRM -- -- -- -- 10 200 A A
ON CHARACTERISTICS
Peak On-State Voltage(1) (IT = A Peak)
"1.1
VTM IGT IH VGT
-- -- -- --
-- -- -- --
1.9 10 5.0 2.0
Volts mA mA Volts
Gate Trigger Current (Continuous dc) All Quadrants (VD = 12 Vdc, RL = 100 ) Holding Current (Continuous dc) (VD = 12 Vdc, Gate Open, Initiating Current =
"20 mA)
Gate Trigger Voltage (Continuous dc) All Quadrants (VD = 12 Vdc, RL = 100 )
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Commutation Voltage (f = 250 Hz, ITM = 1.0 A, Commutating di/dt = 1.5 A/mS On-State Current Duration = 2.0 mS, VDRM = 200 V, Gate Unenergized, TC = 110C, Gate Source Resistance = 150 , See Figure 10) Critical Rate-of-Rise of Off State Voltage (Vpk = Rated VDRM, TC= 110C, Gate Open, Exponential Method) (1) Pulse Test: Pulse Width 300 sec, Duty Cycle 2%. (dv/dt)c 1.5 -- -- V/s
dv/dt
10
--
--
V/s
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MAC08BT1, MAC08MT1
Voltage Current Characteristic of Triacs (Bidirectional Device)
+ Current Quadrant 1 MainTerminal 2 +
Symbol
VDRM IDRM VRRM IRRM VTM IH
Parameter
Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage Holding Current IH Quadrant 3 VTM MainTerminal 2 - IRRM at VRRM on state
VTM IH
off state
+ Voltage IDRM at VDRM
Quadrant Definitions for a Triac
MT2 POSITIVE (Positive Half Cycle) +
(+) MT2
(+) MT2
Quadrant II
(-) IGT GATE MT1 REF
(+) IGT GATE MT1 REF
Quadrant I
IGT - (-) MT2 (-) MT2
+ IGT
Quadrant III
(-) IGT GATE MT1 REF
(+) IGT GATE MT1 REF
Quadrant IV
- MT2 NEGATIVE (Negative Half Cycle) All polarities are referenced to MT1. With in-phase signals (using standard AC lines) quadrants I and III are used.
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MAC08BT1, MAC08MT1
0.15 3.8 0.079 2.0 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5 inches mm 0.091 2.3 0.244 6.2
0.984 25.0
BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR. BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL. MATERIAL: G10 FIBERGLASS BASE EPOXY
0.096 2.44 0.059 1.5
0.096 2.44 0.059 1.5
0.096 2.44
0.472 12.0
Figure 1. PCB for Thermal Impedance and Power Testing of SOT-223
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MAC08BT1, MAC08MT1
IT, INSTANTANEOUS ON-STATE CURRENT (AMPS) 10 R JA , JUNCTION TO AMBIENT THERMAL RESISTANCE, C/W 160 150 140 130 120 110 100 90 80 70 60 50 40 30 TYPICAL MAXIMUM DEVICE MOUNTED ON FIGURE 1 AREA = L2 PCB WITH TAB AREA AS SHOWN L
1.0
L 4 123
0.1 TYPICAL AT TJ = 110C MAX AT TJ = 110C MAX AT TJ = 25C 0 1.0 2.0 3.0 4.0 vT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) 5.0
MINIMUM FOOTPRINT = 0.076 cm2 0 2.0 4.0 6.0 FOIL AREA (cm2) 8.0 10
0.01
Figure 2. On-State Characteristics
T A , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (C)
Figure 3. Junction to Ambient Thermal Resistance versus Copper Tab Area
110
110 T A , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (C) 30
100 90 80 70 60 50 40 30 20 0 MINIMUM FOOTPRINT 50 OR 60 Hz dc = 180 120
100 90 80 70 60 50 40 30 1.0 cm2 FOIL AREA 50 OR 60 Hz dc = 180 120
60 90
30
= CONDUCTION
ANGLE
60 90
= CONDUCTION
ANGLE
0.4 0.1 0.2 0.3 IT(RMS), RMS ON-STATE CURRENT (AMPS)
0.5
20
0
0.1
0.3 0.4 0.5 0.6 IT(RMS), RMS ON-STATE CURRENT (AMPS)
0.2
0.7
T A , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (C)
Figure 4. Current Derating, Minimum Pad Size Reference: Ambient Temperature
110
Figure 5. Current Derating, 1.0 cm Square Pad Reference: Ambient Temperature
110 30 T(tab) , MAXIMUM ALLOWABLE TAB TEMPERATURE ( C) 105 dc 100 = 180 95 120 90 85 80 REFERENCE: FIGURE 1
= CONDUCTION
100 90 80 70 4.0 cm2 FOIL AREA 60 50
30 60 dc = 180 120 90
= CONDUCTION
ANGLE
60
90
ANGLE
0
0.1
0.6 0.3 0.4 0.5 IT(RMS), RMS ON-STATE CURRENT (AMPS) 0.2
0.7
0.8
0
0.1
0.3 0.4 0.5 0.6 IT(RMS), ON-STATE CURRENT (AMPS)
0.2
0.7
0.8
Figure 6. Current Derating, 2.0 cm Square Pad Reference: Ambient Temperature
Figure 7. Current Derating Reference: MT2 Tab
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MAC08BT1, MAC08MT1
1.0 0.9 P(AV) , MAXIMUM AVERAGE POWER DISSIPATION (WATTS) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.1 0.3 0.4 0.5 0.6 IT(RMS), RMS ON-STATE CURRENT (AMPS) 0.2 0.7 0.8 0.01 0.0001 0.001 1.0 0.01 0.1 t, TIME (SECONDS) 10 100 = 180 dc 90 60
= CONDUCTION
ANGLE
1.0

120 30
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.1
Figure 8. Power Dissipation
Figure 9. Thermal Response, Device Mounted on Figure 1 Printed Circuit Board
LL 200 VRMS ADJUST FOR ITM, 60 Hz VAC TRIGGER CHARGE CONTROL TRIGGER CONTROL MEASURE I RS
1N4007
- CS 1N914 51 W MT2 MT1 G ADJUST FOR + dv/dt(c)
CHARGE
200 V
NON-POLAR CL
Note: Component values are for verification of rated (dv/dt)c. See AN1048 for additional information.
Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dv/dt)c
10 80 60
10
60 Hz 180 Hz 400 Hz
COMMUTATING dv/dt dv/dt c , (V/ S)
COMMUTATING dv/dt dv/dt c , (V/ S)
300 Hz
ITM
110 100 tw f= 1 2 tw
VDRM = 200 V
1.0 1.0
VDRM
(di dt) c
+
6f I
TM 1000 10
1.0 60
70
di/dtc, RATE OF CHANGE OF COMMUTATING CURRENT (A/mS)
80 90 100 TJ, JUNCTION TEMPERATURE (C)
110
Figure 11. Typical Commutating dv/dt versus Current Crossing Rate and Junction Temperature
Figure 12. Typical Commutating dv/dt versus Junction Temperature at 0.8 Amps RMS
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MAC08BT1, MAC08MT1
60 I GT , GATE TRIGGER CURRENT (mA) 600 Vpk TJ = 110C 50 STATIC dv/dt (V/ s) MAIN TERMINAL #2 POSITIVE 10 IGT3 IGT2 IGT4 IGT1 1.0
40
30 MAIN TERMINAL #1 POSITIVE 20 10 100 1000 RG, GATE - MAIN TERMINAL 1 RESISTANCE (OHMS) 10,000
0.1 - 40
- 20
40 60 80 0 20 TJ, JUNCTION TEMPERATURE (C)
100
Figure 13. Exponential Static dv/dt versus Gate - Main Terminal 1 Resistance
Figure 14. Typical Gate Trigger Current Variation
6.0 5.0 4.0 3.0 2.0 1.0 0 - 40 MAIN TERMINAL #1 POSITIVE
1.1 VGT , GATE TRIGGER VOLTAGE (VOLTS)
IH , HOLDING CURRENT (mA)
MAIN TERMINAL #2 POSITIVE
VGT3 VGT2 VGT1
VGT4
- 20
0
20
40
60
80
100
0.3 - 40
- 20
0
20
40
60
80
100
TJ, JUNCTION TEMPERATURE (C)
TJ, JUNCTION TEMPERATURE (C)
Figure 15. Typical Holding Current Variation
Figure 16. Gate Trigger Voltage Variation
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MAC08BT1, MAC08MT1 INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.15 3.8 0.079 2.0
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5
0.091 2.3
0.248 6.3
0.059 1.5
inches mm
SOT-223
SOT-223 POWER DISSIPATION The power dissipation of the SOT-223 is a function of the MT2 pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT-223 package, PD can be calculated as follows:
PD = TJ(max) - TA RJA
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 550 milliwatts.
PD = 110C - 25C = 550 milliwatts 156C/W
The 156C/W for the SOT-223 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 550 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-223 package. One is to increase the area of the MT2 pad. By increasing the area of the MT2 pad, the power dissipation can be increased. Although one can almost double the power dissipation with this method, one will be giving up area on the printed circuit board which can defeat the purpose of using surface mount technology. A graph of RJA versus MT2 pad area is shown in Figure 3. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SOT-223 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
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MAC08BT1, MAC08MT1
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 17 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 1 PREHEAT ZONE 1 "RAMP" 200C
STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C
STEP 5 STEP 6 STEP 7 STEP 4 HEATING VENT COOLING HEATING ZONES 3 & 6 ZONES 4 & 7 205 TO "SPIKE" "SOAK" 219C 170C PEAK AT SOLDER 160C JOINT SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
150C 100C 100C DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C 140C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 17. Typical Solder Heating Profile
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MAC08BT1, MAC08MT1
PACKAGE DIMENSIONS
SOT-223 CASE 318E-04 ISSUE J
A F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
4
S
1 2 3
B
D L G J C 0.08 (0003) H M K
INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 STYLE 11: PIN 1. MT 1 2. MT 2 3. GATE 4. MT 2
MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
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MAC08BT1, MAC08MT1
Notes
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MAC08BT1, MAC08MT1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local Sales Representative.
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MAC08BT1/D

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