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| DISCRETE SEMICONDUCTORS DATA SHEET MCR08BT1 Thyristor logic level Product specification July 2001 Philips Semiconductors Product specification Thyristor logic level GENERAL DESCRIPTION Passivated, sensitive gate thyristor in a plastic envelope, suitable for surface mounting, intended for use in general purpose switching and phase control applications. This device is intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. MCR08BT1 QUICK REFERENCE DATA SYMBOL VDRM, VRRM IT(AV) IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages Average on-state current RMS on-state current Non-repetitive peak on-state current MAX. UNIT 200 0.5 0.8 9 V A A A PINNING - SOT223 PIN 1 2 3 tab DESCRIPTION cathode anode gate anode PIN CONFIGURATION 4 SYMBOL a k 1 2 3 g LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. half sine wave; Tsp 112 C all conduction angles half sine wave; Tj = 25 C prior to surge t = 10 ms t = 8.3 ms t = 10 ms ITM = 2 A; IG = 10 mA; dIG/dt = 100 mA/s -40 MAX. 2001 0.5 0.8 8 9 0.32 50 1 5 5 2 0.1 150 125 UNIT V A A A A A2s A/s A V V W W C C VDRM, VRRM Repetitive peak off-state voltages IT(AV) Average on-state current IT(RMS) ITSM RMS on-state current Non-repetitive peak on-state current I2t dIT/dt IGM VGM VRGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak reverse gate voltage Peak gate power Average gate power over any 20 ms period Storage temperature Operating junction temperature 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may switch to the on-state. The rate of rise of current should not exceed 15 A/s. July 2001 2 Rev 1.000 Philips Semiconductors Product specification Thyristor logic level THERMAL RESISTANCES SYMBOL Rth j-sp Rth j-a PARAMETER Thermal resistance junction to solder point Thermal resistance junction to ambient CONDITIONS MIN. pcb mounted, minimum footprint pcb mounted; pad area as in fig:14 - MCR08BT1 TYP. 156 70 MAX. 15 - UNIT K/W K/W K/W STATIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL IGT IL IH VT VGT ID, IR PARAMETER Gate trigger current Latching current Holding current On-state voltage Gate trigger voltage Off-state leakage current CONDITIONS VD = 12 V; IT = 10 mA; gate open circuit VD = 12 V; IGT = 0.5 mA; RGK = 1 k VD = 12 V; IGT = 0.5 mA; RGK = 1 k IT = 2 A VD = 12 V; IT = 10 mA; gate open circuit VD = VDRM(max); IT = 10 mA; Tj = 125 C; gate open circuit VD = VDRM(max); VR = VRRM(max); Tj = 125 C; RGK = 1 k MIN. 0.2 TYP. 50 2 2 1.35 0.5 0.3 0.05 MAX. 200 6 5 1.5 0.8 0.1 UNIT A mA mA V V V mA DYNAMIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL dVD/dt tgt tq PARAMETER Critical rate of rise of off-state voltage Gate controlled turn-on time Circuit commutated turn-off time CONDITIONS VDM =67% VDRM(max); Tj = 125 C; exponential waveform; RGK = 1k ITM = 2 A; VD = VDRM(max); IG = 10 mA; dIG/dt = 0.1 A/s VD = 67% VDRM(max); Tj = 125 C; ITM = 1.6 A; VR = 35 V; dITM/dt = 30 A/s; dVD/dt = 2 V/s; RGK = 1 k MIN. TYP. 25 2 100 MAX. UNIT V/s s s July 2001 3 Rev 1.000 Philips Semiconductors Product specification Thyristor logic level MCR08BT1 1 Ptot / W conduction form angle factor degrees a 30 4 60 2.8 90 2.2 120 1.9 180 1.57 Tsp(max) / C a = 1.57 1.9 2.2 2.8 4 110 10 ITSM / A IT I TSM 0.8 113 8 time T Tj initial = 25 C max 0.6 116 6 0.4 119 4 0.2 122 2 0 0 0.1 0.2 0.3 0.4 IF(AV) / A 0.5 0.6 125 0.7 0 1 10 100 Number of half cycles at 50Hz 1000 Fig.1. Maximum on-state dissipation, Ptot, versus average on-state current, IT(AV), where a = form factor = IT(RMS)/ IT(AV). ITSM / A Fig.4. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. IT(RMS) / A 1000 2 1.5 100 1 10 IT T I TSM time 0.5 Tj initial = 25 C max 1 10us 100us T/s 1ms 10ms 0 0.01 0.1 1 10 surge duration / s Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 10ms. BT134W Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tsp 112C. VGT(Tj) VGT(25 C) 1.2 1 0.8 0.6 0.4 0.2 IT(RMS) / A 1.6 112 C 1.4 1.2 1 0.8 0.6 0 50 Tsp / C 100 150 0 -50 0.4 -50 0 50 Tj / C 100 150 Fig.3. Maximum permissible rms current IT(RMS) , versus solder point temperature Tsp. Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25C), versus junction temperature Tj. July 2001 4 Rev 1.000 Philips Semiconductors Product specification Thyristor logic level MCR08BT1 3 2.5 2 1.5 IGT(Tj) IGT(25 C) 5 IT / A Tj = 125 C Tj = 25 C 4 Vo = 1.0 V Rs = 0.27 Ohms 3 typ max 2 1 1 0.5 0 -50 0 0 0.5 1 VT / V 1.5 2 2.5 0 50 Tj / C 100 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25C), versus junction temperature Tj. IL(Tj) IL(25 C) Fig.10. Typical and maximum on-state characteristic. 100 Zth j-sp (K/W) BT169W 3 2.5 2 1.5 1 0.5 10 1 P D tp 0.1 t 0 -50 0 50 Tj / C 100 150 0.01 10us 0.1ms 1ms 10ms tp / s 0.1s 1s 10s Fig.8. Normalised latching current IL(Tj)/ IL(25C), versus junction temperature Tj, RGK = 1 k. IH(Tj) IH(25 C) Fig.11. Transient thermal impedance Zth j-sp, versus pulse width tp. dVD/dt (V/us) 1000 3 2.5 100 2 1.5 1 0.5 0 -50 1 10 RGK = 1 kohms 0 50 Tj / C 100 150 0 50 Tj / C 100 150 Fig.9. Normalised holding current IH(Tj)/ IH(25C), versus junction temperature Tj, RGK = 1 k. Fig.12. Typical, critical rate of rise of off-state voltage, dVD/dt versus junction temperature Tj. July 2001 5 Rev 1.000 Philips Semiconductors Product specification Thyristor logic level MOUNTING INSTRUCTIONS MCR08BT1 Dimensions in mm. 3.8 min 1.5 min 2.3 1.5 min (3x) 6.3 1.5 min 4.6 Fig.13. soldering pattern for surface mounting SOT223. MECHANICAL DATA Dimensions in mm Net Mass: 0.11 g 0.32 0.24 6.7 6.3 3.1 2.9 B 0.2 M A 4 A 0.10 0.02 3.7 3.3 13 7.3 6.7 16 max 1 10 max 1.8 max 1.05 0.85 4.6 2.3 2 0.80 0.60 3 0.1 M (4x) B Fig.14. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". July 2001 6 Rev 1.000 Philips Semiconductors Product specification Thyristor logic level DEFINITIONS DATA SHEET STATUS DATA SHEET STATUS2 Objective data PRODUCT STATUS3 Development DEFINITIONS MCR08BT1 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in ordere to improve the design and supply the best possible product This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A Preliminary data Qualification Product data Production Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2 Please consult the most recently issued datasheet before initiating or completing a design. 3 The product status of the device(s) described in this datasheet may have changed since this datasheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. July 2001 7 Rev 1.000 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands XXXXXX/700/02/pp8 Date of release: July 2001 Document order number: 9397 750 08943 |
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