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MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MCM67Q709A/D 128K x 9 Bit Separate I/O Synchronous Fast Static RAM The MCM67Q709A is a 1,179,648-bit static random access memory, organized as 131,072 words of 9 bits. It features separate TTL input and output buffers, which drive 3.3 V output levels and incorporates input and output registers on-board with high speed SRAM. It also features transparent-write and data pass-through capabilities. The synchronous design allows for precise cycle control with the use of an external single clock (K). The addresses (A0 - A16), data input (D0 - D8), data output (Q0 - Q8), write enable (W), chip enable (E), and output enable (G), are registered in on the rising edge of clock (K). The control pins (E, W, G) function differently in comparison to most synchronous SRAMs. This device will not deselect with E high. The RAM remains active at all times. If E is registered high, the output pins (Q0 - Q8) will be driven if G is registered low. The transparent write feature allows the output data to track the input data. E, G, and W must be asserted to perform a transparent write (write and pass-through). The input data is available at the ouputs on the next rising edge of clock (K). The pass-through function is always enabled. E high disables the write to the array while allowing a pass-through cycle to occur on the next rising edge of clock (K). Only a registered G high will three-state the outputs. The MCM67Q709A is available in an 86-bump surface mount PBGA (Plastic Ball Grid Array) package. * * * * * * * * * * * * Single 5 V 5% Power Supply Fast Cycle Time: 10 ns Max Single Clock Operation TTL Input and Output Levels (Outputs LVTTL Compatible) Address, Data Input, E, W, G Registers On-Chip 100 MHz Maximum Clock Cycle Time Self-Timed Write Separate Data Input and Output Pins Transparent-Write and Pass-Through High Output Drive Capability: 50 pF/Output at Rated Access Time Boundary Scan Implementation 86-Bump PBGA Package for High Speed Operation MCM67Q709A ZP PACKAGE PBGA CASE 896A-02 PIN NAMES A0 - A16 . . . . . . . . . . . . . . . . . Address Input E . . . . . . . . . . . . . . . . . . . . . . . . . Chip Enable W . . . . . . . . . . . . . . . . . . . . . . . . Write Enable G . . . . . . . . . . . . . . . . . . . . . . Output Enable D0 - D8 . . . . . . . . . . . . . . . . . . . . Data Inputs Q0 - Q8 . . . . . . . . . . . . . . . . . . Data Outputs K . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Input SCK . . . . . . . . . . . . . . . . . . Scan Clock Input SE . . . . . . . . . . . . . . . . . . . . . . . Scan Enable SDI . . . . . . . . . . . . . . . . . . . . Scan Data Input SDO . . . . . . . . . . . . . . . . . Scan Data Output VCC . . . . . . . . . . . . . . . . + 5 V Power Supply VSS . . . . . . . . . . . . . . . . . . . . . . . . . . Ground NC . . . . . . . . . . . . . . . . . . . . . No Connection PIN ASSIGNMENT 1 A B C D E F G H J K A16 D7 VSS D5 VCC D3 VSS Q1 2 E A14 A15 Q7 3 W G NC VSS 4 5 6 7 A4 A2 8 A0 VSS D8 Q8 VSS Q6 D6 9 VCC SDI SDO K VSS A6 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS A9 A8 A5 A7 VSS VSS Q5 Q3 D1 VSS VSS VCC D4 D2 Q4 Q2 VSS VSS NC VSS D0 VSS A1 A3 Q0 A12 A10 VSS A13 A11 SCK VCC SE TOP VIEW Not to Scale REV 3 8/13/99 (c) Motorola, Inc. 1999 MOTOROLA FAST SRAM MCM67Q709A 1 BLOCK DIAGRAM A0 - A16 SH BSR D0 - D8 SH BSR E SH BSR G SH BSR W SH BSR K SH BSR REG DECODERS MEMORY ARRAY 128K x 9 ARRAY SH BSR REG SENSE AMPS AND WRITE DRIVERS MUX 2:1 OUTPUT REGISTER Q0 - Q8 REG WRITE PULSE GENERATOR REG REG SE 1 L LM LS BYPASS SDO O * * * * I I SDI SE 0 SCK SCK I SCK SCK * Four added test pins. NOTES: 1. Bypass mode is entered with SE low and SCK cycled. 2. SH BSR = Shadow Bypass Scan Register. 3. There are 39 bumps used in Boundary Scan. VSS, VCC, NC, SDI, SDO, SE, and SCK not used in Scan Path. 4. SDO output sequence: A6, A4, A2, A0, D8, Q8, D6, Q6, D4, Q4, D2, Q2, D0, Q0, A1, A3, A5, A7, A8, A9, A10, A11, A12, A13, Q1, D1, Q3, D3, Q5, D5, Q7, D7, A15, A16, A14, E, G, W, K. MCM67Q709A 2 MOTOROLA FAST SRAM TRUTH TABLE E (tn) L W (tn) L H L H L H L X H H Read Don't Care Pass-Through Read Don't Care Don't Care G (tn + 1) L Mode Write and Pass-Through Write Pass-Through D0 - D8 (tn) Valid Valid Valid Q0 - Q8 (tn + 1) D0 - D8 (tn) High-Z D0 - D8 (tn) High-Z Qout (tn) High-Z VCC Current ICC ICC ICC ICC ICC ICC ABSOLUTE MAXIMUM RATINGS (See Note) Rating Power Supply Voltage Voltage Relative to VSS for Any Pin Except VCC Output Current Power Dissipation Temperature Under Bias Operating Temperature Storage Temperature -- Plastic Symbol VCC Vin, Vout Iout PD Tbias TA Tstg Value - 0.5 to 7.0 - 0.5 to VCC + 0.5 30 1.5 - 10 to 85 0 to 70 - 55 to 125 Unit V V mA W C C C This is a synchronous device. All synchronous inputs must meet specified setup and hold times with stable logic levels for ALL rising edges of clock (K) while the device is selected. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to these high-impedance circuits. NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. PACKAGE THERMAL CHARACTERISTICS (See Note 1) Rating Junction to Ambient Thermal Resistance Junction to Case Thermal Resistance Symbol RJA or JA RJC or JC Max 44.3 13.4 Unit C/W C/W Notes 2 3 Thermal Characterization Parameter JT 5 C/W 4 NOTES: 1. All values are determined using a single-layer thermal test board. 2. Junction to ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per SEMI G38-87 and EIA/JESD 51-6 with a 400 ft/min air flow. 3. Junction to case thermal resistance is based on measurements using a cold plate per MIL-STD 883D, Method 1012.1 and SEMI G30-88 with the exception that the cold plate temperature is used for the case temperature. 4. Thermal characterization parameter, JT, is defined in EIA/JESD 51-2. It is a measure of the difference in temperature between the junction and a thermocouple on top of the package, normalized by the power dissipation with a 400 ft/min air flow. MOTOROLA FAST SRAM MCM67Q709A 3 DC OPERATING CONDITIONS AND CHARACTERISTICS (VCC = 5.0 V 5%, TA = 0 to 70C, Unless Otherwise Noted) RECOMMENDED OPERATING CONDITIONS AND SUPPLY CURRENTS Parameter Supply Voltage (Operating Voltage Range) Input High Voltage Input Low Voltage Input Leakage Current (All Inputs, Vin = 0 to VCC) Output Leakage Current (E = VIH, Vout = 0 to VCC) AC Supply Current (Iout = 0 mA) (VCC = max, f = fmax) Output Low Voltage (IOL = + 8.0 mA) Output High Voltage (IOH = - 4.0 mA) Symbol VCC VIH VIL Ilkg(I) Ilkg(O) ICCA VOL VOH Min 4.75 2.2 - 0.5* -- -- -- -- 2.4 Max 5.25 VCC + 0.3** 0.8 1.0 1.0 230 0.4 3.3 Unit V V V A A mA V V * VIL (min) = - 0.5 V dc; VIL (min) = - 2.0 V ac (pulse width 20 ns) for I 20.0 mA. ** VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2.0 V ac (pulse width 20 ns) for I 20.0 mA. CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, TA = 25C, Periodically Sampled Rather Than 100% Tested) Parameter Address and Data Input Capacitance Control Pin Input Capacitance Output Capacitance Symbol Cin Cin Cout Max 6 6 8 Unit pF pF pF MCM67Q709A 4 MOTOROLA FAST SRAM AC OPERATING CONDITIONS AND CHARACTERISTICS (VCC = 5.0 V 5%, TA = 0 to 70C, Unless Otherwise Noted) Input Timing Measurement Reference Level . . . . . . . . . . . . . . . 1.5 V Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 3.0 V Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 ns Output Timing Reference Level . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 V Output Load . . . . . . . . . . . . . . . . . Figure 1a Unless Otherwise Noted READ/WRITE CYCLE TIMING (See Notes 1, 2, and 3) MCM67Q709A-10 Parameter P Cycle Time Clock Access Time Clock Low Pulse Width Clock High Pulse Width Clock High to Data Output Invalid Clock High to Data Output High-Z Setup Times: A W E G D0 - D8 A W E G D0 - D8 Symbol S bl tKHKH tKHQV tKLKH tKHKL tKHQX tKHQZ tAVKH tWVKH tEVKH tGVKH tDVKH tKHAX tKHWX tKHEX tKHGX tKHDX Min 10 -- 4 4 2 -- 2 Max -- 5 -- -- -- 5 -- Unit Ui ns ns ns ns ns ns ns 3 4 Notes N 1 2 Hold Times: 1 -- ns 4 NOTES: 1. All read and write cycles are referenced from K. 2. Valid data from clock high will be the data stored at the address or the last valid read cycle. 3. Measured at 200 mV from steady state. Tested per High-Z test load (See Figure 1b). 4. This is a synchronous device. All synchronous inputs must meet the specified setup and hold times with stable logic levels for ALL rising edges of clock (K) while the device is selected. +5V RL = 50 OUTPUT Z0 = 50 VL = 1.5 V 480 OUTPUT 255 5 pF (a) Figure 1. Test Loads (b) MOTOROLA FAST SRAM MCM67Q709A 5 MCM67Q709A 6 READ CYCLE TIMING tKHKH tKLKH tKHKL A (n) tKHWX tWVKH A (n + 1) A (n + 2) A (n + 3) A (n + 4) tKHGX tGVKH tKHQX Q (n - 2) Q (n - 1) tKHQV tKHQZ Q (n) tKHQX tKHQZ Q (n + 2) K tKHAX tAVKH A W tKHEX tEVKH E G MOTOROLA FAST SRAM Q COMBINATION READ/WRITE CYCLE TIMING WRITE D (n + 1) tKHKH tKLKH tKHKL INITIATE READ INITIATE READ WRITE D (n + 5) WRITE D (n + 3) INITIATE READ INITIATE READ MOTOROLA FAST SRAM A (n) tKHWX tWVKH A (n + 1) A (n + 2) A (n + 3) A (n + 4) A (n + 5) A (n + 6) tKHEX t EVKH tKHGX tGVKH tKHQZ Q (n) tKHQV tKHQX tDVKH D (n + 1) D (n + 3) tKHDX D (n + 5) Q (n + 2) Q (n + 4) K tKHAX tAVKH A W E G tKHQX Q MCM67Q709A 7 D MCM67Q709A 8 TRANSPARENT-WRITE AND PASS-THROUGH CYCLE TIMING WRITE WITH PASS-THROUGH tKHKH tKLKH tKHKL WRITE WITH PASS-THROUGH WRITE (TRANSPARENT-WRITE OUTPUTS HIGH-Z) PASS-THROUGH (NO WRITE) tKHAX A (n) tKHWX tWVKH A (n + 1) A (n + 2) A (n + 3) A (n + 4) NO WRITE NO WRITE tKHGX tGVKH tKHQX Q (n - 2) Q (n - 1) tKHQV tKHQZ D (n) tKHQX tKHQZ D (n + 2) D (n) D (n + 1) D (n + 2) D (n + 3) D (n + 4) K tAVKH A W tKHEX tEVKH E G Q tKHDX tDVKH MOTOROLA FAST SRAM D BOUNDARY SCAN CYCLE TIMING MCM67Q709A-10 Parameter P Cycle Time Clock High Pulse Width Clock Low Pulse Width Scan Mode Setup Time Bypass Mode Setup Time Scan Mode Recovery Time SCK Low to SE Hold High SE High to SCK High Setup SCK High to SE Low Hold Time SDI Valid to SCK High Setup SCK High to SDI Don't Care SCK Low to SDO Valid Symbol tCHCH2 tCHCL2 tCLCH2 tSS tBS tSR tCLMH tMHCH tCHML tIVCH tCHIX tCLOV Min 100 40 40 10 10 100 10 10 10 10 10 -- Max -- -- -- -- -- -- -- -- -- -- -- 20 Unit Ui ns ns ns ns ns ns ns ns ns ns ns ns 1 2 3 4 5 6 Notes N NOTES: 1. The minimum delay required between ending normal operation and beginning scan operations. 2. The minimum delay required between ending shift mode and beginning bypass mode. 3. The minimum delay required before restarting normal RAM operation. 4. The minimum delay required before executing a parallel load operation. 5. The minimum delay required between a parallel load operation and a shift. 6. Minimum shift command hold time. BOUNDARY SCAN OVERVIEW Boundary scan is a simple, non-intrusive scheme that allows verification of electrical continuity for each of a clocked RAMs logically active inputs and I/Os without adversely affecting RAM performance. Boundary scan allows the user to monitor the logic levels applied to each signal I/O on the RAM, and to shift them out in a serial bit stream. OPERATION Boundary scan requires four signal pins for implementation: Scan Data In (SDI), Scan Data Out (SDO), Scan Clock (SCK, active high), and Scan Enable (SE, active high). Boundary scan provides three modes of operation: (1) normal RAM operation, (2) scan, and (3) bypass. For normal RAM operation, SCK and SE must be held low. The RAM will always return to normal operation immediately after the RAM receives a rising edge of the RAM input clock (K) with SCK and SE held low. To enter scan mode, SCK is activated. The first rising edge of SCK is used to latch in the data on the scan registers. SE is then driven high to disable additional input data from entering the scan registers. Every falling edge of SCK serially shifts data through the scan registers and onto the SDO pin. To enter bypass mode simply exercise SCK with SE held low. In this mode, SDI is sampled on the rising edge of SCK. The level found on SDI is then driven out on SDO on the next falling edge of SCK. MOTOROLA FAST SRAM MCM67Q709A 9 MCM67Q709A 10 BOUNDARY SCAN TIMING DIAGRAM BYPASS SHIFT 1 SHIFT 3 SHIFT 36 SHIFT 37 SHIFT 38 SHIFT 39 SHIFT n SHIFT 2 PARALLEL LOAD t CHCL2 t CLCH2 t SR t CLMH t CHCH2 t MHCH t BS t IVCH B1 t CHIX S1 S2 S3 S36 S37 S38 S39 Sn t CHML B2 B1 A6 A4 A14 E G W K S1 NORMAL OPERATION NORMAL BYPASS OPERATION K t SS SCK SE SDI SDO B2 MOTOROLA FAST SRAM t CLOV NOTES: B1 and B2 = Bypass Serial Data from outside source. S1 - Sn + 1 = Serial Scan Data from outside source. S1 - Sn = RAMs Input Register contents. Scan Order is "A6, A4, A2, A0, D8, Q8, D6, Q6, D4, Q4, D2, Q2, D0, Q0, A1, A3, A5, A7, A8, A9, A10, A11, A12, A13, Q1, D1, Q3, D3, Q5, D5, Q7, D7, A15, A16, A14, E, G, W, K". ORDERING INFORMATION (Order by Full Part Number) MCM Motorola Memory Prefix Part Number 67Q709A XX XX X Shipping Method (R = Tape and Reel, Blank = Trays) Speed (10 = 10 ns) Package (ZP = PBGA) Full Part Numbers -- MCM67Q709AZP10 MCM67Q709AZP10R PACKAGE DIMENSIONS ZP PACKAGE PBGA CASE 896A-02 0.25 (0.010) T B -W- G 0.15 (0.006) T C L 987654321 A B C D E F G H J K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. DIM A B C D E G N P R MILLIMETERS MIN MAX 17.78 BSC 16.26 BSC 1.84 2.44 0.69 0.81 1.33 1.73 1.524 BSC 13.80 14.20 0.762 BSC 15.29 15.69 INCHES MIN MAX 0.700 BSC 0.640 BSC 0.073 0.096 0.028 0.031 0.053 0.068 0.060 BSC 0.544 0.559 0.030 BSC 0.602 0.617 R A -L- P C L N E C 0.35 (0.014) T 86X G D 0.30 (0.012) -T- 0.10 (0.004) S S 4X 0.20 (0.008) TL S W S Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado, 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPD, Strategic Planning Office, 141, 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan. 81-3-5487-8488 MfaxTM : RMFAX0@email.sps.mot.com - TOUCHTONE 1-602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, Motorola Fax Back System - US & Canada ONLY 1-800-774-1848 2 Dai King Street, Tai Po Industrial Estate, Tao Po, N.T., Hong Kong. - http://sps.motorola.com /mfax / 852-26668334 HOME PAGE : http://motorola.com/sps / CUSTOMER FOCUS CENTER: 1-800-521-6274 MOTOROLA FAST SRAM MCM67Q709A/D MCM67Q709A 11 DOCUMENT EDITS Edit # 1 2 3 4 5 6 1 1 Rev # R2 R2 R2 R2 R2 R2 R3 R3 Date 12/10/97 12/10/97 12/10/97 12/10/97 12/10/97 12/10/97 7/19/99 8/13/99 Page # 1 1 3 4 8 10 3 - Description Revised existing MCM67Q709A datasheet from Rev 1 to Rev 2. Second bullet -- deleted reference to 12 ns max. Recommended Operating Conditions and Supply Currents table -- deleted reference to -12 part. Read/Write Cycle Timing table -- deleted -12 part min and max column. Boundary Scan Cycle Timing table -- deleted -12 part min and max column. Ordering Information -- deleted 12 ns speed and reference to -12 part numbers. Add thermal characterization data. Document Complete. MCM67Q709A 12 MOTOROLA FAST SRAM |
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