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| Tantalum capacitors Chip tantalum capacitors with built-in open-function TCFG series Semiconductor manufacturing technology has been used to include a temperature fuse in TCFG series capacitors. These capacitors feature low impedance and are ideal for digital circuits and low-voltage circuits in portable electronic equipment. FFeatures 1) Open-function built into every package. 2) High capacitance in a small package. 3) Low impedance. 4) Use of semiconductor manufacturing technology provides high reliability. 5) Superb solderability. FExternal dimensions (mm) 1 Tantalum capacitors FProduct designation * When ordering, please specify the part No. * Please check to be sure of what combination of features you wish to order. * Fill in the blanks from left to right. TCFG series FCapacitance range 2 Tantalum capacitors FCharacteristics TCFG series 3 Tantalum capacitors TCFG series 4 Tantalum capacitors TCFG series 5 Tantalum capacitors FTable 1 Standard parts list, TCFG series TCFG series 6 Tantalum capacitors TCFG series FPackaging specifications FPackaging style 7 Tantalum capacitors FElectrical characteristics and operation notes (1) Soldering conditions (soldering temperature and soldering time) TCFG series (2) Leakage current-to-voltage ratio 8 Tantalum capacitors (3) Derating voltage as function of temperature TCFG series (4) Reliability The malfunction rate of tantalum solid state electrolytic capacitors varies considerably depending on the conditions of usage (ambient temperature, applied voltage, circuit resistance). Formula for calculating malfunction rate p = b p b E SR Q CV ( E SR Q C V) : Malfunction rate stemming from operation : Basic malfunction rate : Environmental factors : Series resistance : Level of malfunction rate : Capacitance For details on how to calculate the malfunction rate stemming from operation, see the tantalum solid state electrolytic capacitors column in MIL-HDBK-217. Malfunction rate as function of operating temperature and rated voltage Malfunction rate as function of circuit resistance (/V) 9 Tantalum capacitors (5) External temperature vs. fuse blowout TCFG series (6) Power vs. fuse blowout characteristics / Product surface temperature Note: Solder the chip at 300_C or less. If it is soldered using a temperature higher than 300_C, the built-in temperature fuse may blow out. (7) Maximum power dissipation Warming of the capacitor due to ripple voltage balances with warming caused by Joule heating and by radiated heat. Maximum allowable warming of the capacitor is to 5_C above ambient temperature. When warming exceeds 5_C, it can damage the dielectric and cause a short circuit. Power dissipation (P) =I2 G R Ripple current P: As shown in table at right R: Equivalent series resistance Notes: 1. Please be aware that when case size is changed, maximum allowable power dissipation is reduced. 2. Maximum power dissipation varies depending on the package. Be sure to use a case which will keep warming within the limits shown in the table below. (8) Impedance frequency characteristics (9) ESR frequency characteristics 10 Tantalum capacitors (10) Temperature characteristics TCFG series 11 Tantalum capacitors TCFG series (11) Ultrasonic cleaning Carry out cleaning under the mildest conditions possible. The internal element of a tantalum capacitor are larger than those of a transistor or diode, so it is not as resistant to ultrasonic waves. Design G dimension : Example: water Propagation speed Solvent density 1500 m/s 1g/cm3 150m or less Precautions 1) Do not allow solvent to come to a boil (kinetic energy increases). Ultrasonic output 0.5W/cm2 or less Use a solvent with a high boiling point. Lower solvent temperature. 2) Ultrasonic cleaning frequency 28 kHz or less 3) Keep cleaning time as short as possible. 4) Move item being cleaned. Standing waves caused by the ultrasonic waves can cause stress to build up in part of the item being cleaned. Reference Kinetic energy = 2 x x frequency x 2 x ultrasonic output propagation speed x solvent density 12 |
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