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 SN5430, SN54LS30, SN54S30 SN7430, SN74LS30, SN74S30 8-INPUT POSITIVE-NAND GATES
SDLS099 - DECEMBER 1983 - REVISED MARCH 1988
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright (c) 1988, Texas Instruments Incorporated
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
1
SN5430, SN54LS30, SN54S30 SN7430, SN74LS30, SN74S30 8-INPUT POSITIVE-NAND GATES
SDLS099 - DECEMBER 1983 - REVISED MARCH 1988
2
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
SN5430, SN54LS30, SN54S30 SN7430, SN74LS30, SN74S30 8-INPUT POSITIVE-NAND GATES
SDLS099 - DECEMBER 1983 - REVISED MARCH 1988
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
3
SN5430, SN54LS30, SN54S30 SN7430, SN74LS30, SN74S30 8-INPUT POSITIVE-NAND GATES
SDLS099 - DECEMBER 1983 - REVISED MARCH 1988
4
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
SN5430, SN54LS30, SN54S30 SN7430, SN74LS30, SN74S30 8-INPUT POSITIVE-NAND GATES
SDLS099 - DECEMBER 1983 - REVISED MARCH 1988
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device 5962-9679201Q2A 5962-9679201QCA 5962-9679201QCA 5962-9679201QDA 5962-9679201QDA JM38510/30009B2A JM38510/30009B2A JM38510/30009BCA JM38510/30009BCA JM38510/30009BDA JM38510/30009BDA JM38510/30009SCA JM38510/30009SCA JM38510/30009SDA JM38510/30009SDA SN5430J SN5430J SN54LS30J SN54LS30J SN54S30J SN54S30J SN7430N SN7430N SN74LS30D SN74LS30D SN74LS30DE4 SN74LS30DE4 SN74LS30DR SN74LS30DR SN74LS30DRE4 SN74LS30DRE4 SN74LS30J SN74LS30J SN74LS30N SN74LS30N Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE Package Type LCCC CDIP CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP CDIP CDIP CFP CFP CDIP CDIP CDIP CDIP CDIP CDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC CDIP CDIP PDIP PDIP Package Drawing FK J J W W FK FK J J W W J J W W J J J J J J N N D D D D D D D D J J N N Pins Package Eco Plan (2) Qty 20 14 14 14 14 20 20 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 25 25 50 50 50 50 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Call TI Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Call TI Level-NC-NC-NC Level-NC-NC-NC
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) TBD TBD Pb-Free (RoHS) Pb-Free (RoHS)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Orderable Device SN74LS30N3 SN74LS30N3 SN74LS30NE4 SN74LS30NE4 SN74LS30NSR SN74LS30NSR SN74LS30NSRE4 SN74LS30NSRE4 SN74S30D SN74S30D SN74S30DR SN74S30DR SN74S30J SN74S30J SN74S30N SN74S30N SNJ5430J SNJ5430J SNJ5430W SNJ5430W SNJ54LS30FK SNJ54LS30FK SNJ54LS30J SNJ54LS30J SNJ54LS30W SNJ54LS30W SNJ54S30FK SNJ54S30FK SNJ54S30J SNJ54S30J SNJ54S30W SNJ54S30W
(1)
Status (1) OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type PDIP PDIP PDIP PDIP SO SO SO SO SOIC SOIC SOIC SOIC CDIP CDIP PDIP PDIP CDIP CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP LCCC LCCC CDIP CDIP CFP CFP
Package Drawing N N N N NS NS NS NS D D D D J J N N J J W W FK FK J J W W FK FK J J W W
Pins Package Eco Plan (2) Qty 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 20 20 14 14 14 14 20 20 14 14 14 14 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 25 25 TBD TBD Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI
MSL Peak Temp (3) Call TI Call TI Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Call TI Call TI Call TI Call TI Call TI Call TI Call TI Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC
2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MLCC006B - OCTOBER 1996
FK (S-CQCC-N**)
28 TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
18
17
16
15
14
13
12
NO. OF TERMINALS ** 11 10 28 9 8 7 6 68 5 84 44 52 20
A MIN 0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) MAX 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) MIN 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
B MAX 0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
19 20 21 B SQ 22 A SQ 23 24 25
26
27
28
1
2
3
4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless
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