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| HB56TW132D Series 1,048,576-word x 32-bit High Density Dynamic RAM Module Description The HB56TW132D is a 1 M x 32 dynamic RAM Small Outline DIMM (S. O. DIMM), mounted 8 pieces of 4-Mbit DRAM (HM51W4400BTT/ BLTT) sealed in TSOP package. An outline of the HB56TW132D is 72pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the HB56TW132D makes high density mounting possible without surface mount technology. The HB56TW132D provides common data inputs and outputs. Decoupling capacitors are mounted beside the each TSOP of its module board. Features * 72-pin Lead pitch: 1.27 mm * Single 3.3 V ( 0.3 V) supply * High speed Access time: 60 ns/70 ns/80 ns (max) * Low power dissipation Active mode: 2.30 W/2.02 W/1.73 W (max) Standby mode: 57.6 mW (max) 2.88 mW (max) (L-version) * Fast page mode capability * 1024 refresh cycle : 16 ms : 128 ms (L-version) * 3 variations of refresh RAS-only refresh CAS-before-RAS refresh Self refresh (L-version) * TTL compatible HB56TW132D Series Ordering Information Type No. HB56TW132D-6B HB56TW132D-7B HB56TW132D-8B HB56TW132D-6BL HB56TW132D-7BL HB56TW132D-8BL Access time 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns Package 72-pin Small outline DIMM Contact Pad Gold Note: The specification of this device is subject to change without notice. Please contact your nearest Hitachi's Sales Dept. regarding specification. 2 |
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