 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Bulletin I0405J rev. A 05/01 SC021.....5. Series SCHOTTKY DIE 21 x 45 mils a c 0.35 0.01 (14 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C A D b d O 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 0.53 + 0, - 0.01 (21 + 0, - 0.4) b = 1.14 + 0, - 0.01 (45 + 0, - 0.4) c = 0.38 + 0, - 0.01 (15 + 0, - 0.4) d = 0.99 + 0, - 0.01 (39 + 0, - 0.4) O = 0.4 0.1 (15 4) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) (Sample Probe) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, -0.005 (2 + 0, -0.2) Wafer flat alligned with side b of the die O 125 (492) NOT TO SCALE NOTE: 10 mils die thickness is available on specific request only. Contact factory for information. www.irf.com 1 SC021.....5. Series Bulletin I0405J rev. A 05/01 Electrical Characteristics Device # SC021R015x5x SC021S020x5x SC021S030x5x SC021S045x5x SC021S060x5x SC021H045x5x SC021H100x5x SC021H150x5x TJ Max. (C) 125 150 150 150 150 175 175 175 VR (V) 15 20 30 45 60 45 100 150 Typ. IR @ 25C (A) Typ. IR @ 125C (mA) Max. VF @ IF (V) Package Style n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory Mechanical Data Device # SC021xxxxA5x SC021xxxxS5x Bondable Solderable -Ti 2 kA Metal Thickness Front Metal Al/Si 30 kA Ni 1 kA -Ag 35 kA Cr 1 kA Cr 1 kA Metal Thickness Back Metal Ni 2 kA Ni 2 kA Ag 3 kA Ag 3 kA Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # SC021xxxxx5B SC021xxxxx5R SC021xxxxx5P SC021xxxxx5F Description Minimum Order Quantity Die in Sale Package 17500 n.a. n.a. 17500 Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film 2 www.irf.com SC021.....5. Series Bulletin I0405J rev. A 05/01 Ordering Information Table Device Code SC 021 1 1 2 3 4 5 6 7 Schottky Die Chip Dimension in Mils 2 S 3 030 4 S 5 5 6 B 7 H = 830 Process R = OR'ing Process S = Standard Process Process (see Electrical Characteristics Table) Voltage code: Code = VRRM Chip surface metallization (see Mechanical Data Table) Wafer Diameter in inches Packaging (see Packaging Table) Wafer on Film STEEL FRAME www.irf.com 3 SC021.....5. Series Bulletin I0405J rev. A 05/01 Wafer in Box ROUND CONTAINER TYVEK DISK FOAM DISK IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7309 Visit us at www.irf.com for sales contact information. 03/01 4 www.irf.com |
Price & Availability of 2597
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |