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(R) L6377 0.5A HIGH-SIDE DRIVER INTELLIGENT POWER SWITCH 0.5 A OUTPUT CURRENT 8 TO 35 V SUPPLY VOLTAGE RANGE EXTERNALLY PROGRAMMABLE CURRENT LIMIT NON-DISSIPATIVE OVER-CURRENT PROTECTION THERMAL SHUTDOWN UNDER VOLTAGE LOCKOUT WITH HYSTERESYS DIAGNOSTIC OUTPUT FOR UNDER VOLTAGE, OVER TEMPERATURE AND OVER CURRENT EXTERNAL ASYNCHRONOUS RESET INPUT PRESETTABLE DELAY FOR OVERCURRENT DIAGNOSTIC OPEN GROUND PROTECTION PROTECTION AGAINST SURGE TRANSIENT (IEC 801-5) IMMUNITY AGAINST BURST TRANSIENT (IEC 801-4) ESD PROTECTION (HUMAN BODY MODEL 2KV) BLOCK DIAGRAM VS MULTIPOWER BCD TECHNOLOGY MINIDIP SO14 ORDERING NUMBERS: L6377 (MINIDIP) L6377D (SO) DESCRIPTION This device is a monolithic Intelligent Power Switch in Multipower BCD Technology for driving inductive, capacitive or resistive loads. Diagnostic for CPU feedback and extensive use of electrical protections make this device inherently indistructible and suitable for general purpose industrial applications. CHARGE PUMP VS RS GND IN+ + 1.3V CURRENT LIMIT DRIVER OVC OUT UV R 1.3V + - SHORT CIRCUIT CONTROL RSC DIAG OVT UV DELAY ON DELAY C DON D94IN075D August 2001 1/11 L6377 ABSOLUTE MAXIMUM RATINGS Symbol Vs Vs - Vout Vod Iod IRESET VRESET Iout Vout Eil Ptot Vdiag Idiag Ii Vi Top Tj Tstg 7 6 2 4 Pin 3 3 vs 2 5 Parameter Supply Voltage (tw < 10ms) Supply Voltage (DC) Supply to Output Differential voltage Externally Forced Voltage Externally Forced Current Reset Input Current (forced) Reset Input Voltage Output Current (see also Isc) Output Voltage Total Energy Inductive Load (Tj = 125C) Power Dissipation External voltage Externally forced current Input Current Input Voltage Ambient temperature, operating range Junction temperature, operating range (see Overtemperature Protection) Storage temperature Value 50 40 internally limited -0.3 to 7 1 2 -0.3 to 40 internally limited internally limited 50 internally limited -0.3 to 40 -10 to 10 20 -10 to Vs +0.3 -25 to 85 -25 to 125 -55 to 150 V mA mA V C C C mJ V mA mA V Unit V V PIN CONNECTION (Top view) N.C. 1 2 3 4 5 6 7 D96IN368 14 13 12 11 10 9 8 N.C. RESET IN+ DIAG ON DELAY N.C. N.C. GND OUT VS RSC 1 2 3 4 D94IN054D 8 7 6 5 RESET IN+ DIAG ON DELAY GND OUT VS RSC N.C. N.C. 2/11 L6377 PIN DESCRIPTION No 1 2 3 4 5 6 7 8 Pins GND OUT VS Rsc ON DELAY DIAG IN+ RESET Ground pin. High side output. Controlled output with current limitation. Supply voltage. Range with under voltage monitoring Current limiting setting. Delay setting for overcurrent diagnostic Diagnostic open drain output for over temperature, under voltage and overcurrent Comparator non inverting input Asynchronous reset input Description THERMAL DATA Symbol Rth j-amb Parameter Thermal Resistance, Junction Ambient Max. MINIDIP 100 SO14 150 Unit C/W 3/11 L6377 ELECTRICAL CHARACTERISTICS (Vs = 24V; Tj = -25 to 125C; unless otherwise specified.) DC OPERATION Symbol Vsmin Vs Vsth Vshys Iq Iqo Vith Viths Vil Vih 7 3 Pin Parameter Supply Voltage for Valid Diagnostic Operative Supply Voltage Under Voltage Lower Threshold Under Voltage Hysteresis Quiescent Current Quiescent Current Input Threshold Voltage Input Threshold Hysteresis Input Low Level Voltage Input High Level Voltage Vs< 18V Vs> 18V Iib Vrth Vrl Vrh Irb Idch Vrsc Irsc Idlkg Vdiag Vdon 6 5 4 8 Input Bias Current Reset Threshold Voltage Reset Low Level Voltage Reset High Level Voltage Reset Pull Down Current Delay Capacitor Charging Current Output Voltage on Rsc pin Output Current on Rsc pin Diagnostic Output Leakage Curr. Diagnostic Output Voltage Drop Output Voltage Drop ON DELAY pin shorted to Ground Rsc pin floating Rsc pin shorted to GND Diagnostic Off Idiag =5mA; Iout =625mA; Tj =25C Iout =625mA; Tj =125C Iolk Vol Vcl 2 Output Leakage Current Output Low State Voltage Internal Voltage Clamp (Vs-Vout) Vi = LOW; Vout=0 Vi = HIGH; pin floating Io=200mA single pulsed =300s Vs=8 to 35V; Rl =2; Rsc =5 to 30K Vs=8 to 35V; Rl =2; Rsc <5 K Tmax Thys Over Temperature Upper Threshold Over Temperature Hysteresis 0.75 48 0.8 53 5/Rsc = K 1.1 150 20 1.5 250 400 Vi = -7 to 15V Output Open Output On 0.8 50 -7 2 2 -250 0.8 0 2 5 2.5 1.25 300 25 1.5 350 550 100 1.5 58 1.3 Test Condition Idiag = >0.5mA; Vdiag = 1.5V; Min. 4 8 7 300 500 800 1.6 1.3 2 400 0.8 Vs -3 15 250 2 0.8 40 24 Typ. Max. 35 35 8 700 Unit V V V mV A mA V mV V V V A V V V A A V A A V mV mV A V V A A C C Isc Short Circuit Output Current 4/11 L6377 AC OPERATION Symbol tr -tf td dV/dt tON tOFF fmax 5 2 Pin Parameter Rise or Fall Time Delay Time Slew Rate (Rise and Fall Edge) On time during Short Circuit Condition Off time during Short Circuit Condition Maximum Operating Frequency Test Condition Vs = 24V; Rl = 70 Rl to ground Vs = 24V; Rl = 70 Rl to ground 50pF < CDON < 2nF 0.7 Min. Typ. 20 5 1 1.28 64 25 1.5 Max. Unit s s V/s s/pF tON kHz SOURCE DRAIN NDMOS DIODE Symbol Vfsd Ifp trr tfr Parameter Forward On Voltage Forward Peak Current Reverse Recovery Time Forward Recovery Time Test Condition Ifsd = 625mA tp = 10ms; duty cycle = 20% Ifsd = 500mA; dIfsd/dt = 25A/s 200 50 Min. Typ. 1 Max. 1.5 1.5 Unit V A ns ns Figure 1: Undervoltage Comparator Hysteresis Vshys Vsth D94IN126A Vs Figure 2: Switching Waveforms Vin 50% 50% td Vout 90% 50% 10% tr td t 90% 50% 10% tf D94IN127A t 5/11 L6377 INPUT SECTION An Input and Asynchronous RESET, both TTL/CMOS compatible with wide voltage range and high noise immunity (thanks to a built in hysteresis) are available. OVER TEMPERATURE PROTECTION (OVT) An on-chip Over Temperature Protection providse an excellent protection of the device in extreme conditions. Whenever the temperature - measured on a central portion of the chip- exceeds Tmax=150 C (typical value) the device is shut off, and the DIAG output goes LOW. Normal operation is resumed as the chip temperature (normally after few seconds) falls below Tmax-Thys= 130 C (typical value). The hysteresis avoid thats an intermittent behaviour take place. UNDER VOLTAGE PROTECTION (UV) The supply voltage is expected to range from 8 to 35 V. In this range the device operates correctly. Below 8 V the overall system has to be considered not reliable. To avoid any misfunctioning the supply voltage is continuously monitored to provide an under voltage protection. As Vs falls below Vsth-Vshys (typically 7.5 V, see fig.1) the output power MOS is switched off and DIAG output goes LOW. Normal operation is resumed as soon as Vs exceeds Vsth. The hysteretic behaviour prevents intermittent operation at low supply voltage. OVER CURRENT OPERATION In order to implement a short circuit protection the output power MOS is driven in linear mode to limit the output current to the Isc value. This Isc limit is externally settable by means of an external 1/4 W resistor connected from Rsc pin and GND. The value of the resistor must be chosen according to the following formula: Isc (A) = 5/Rsc (kohm) with 5 < Rsc < 30 (kohm) For Rsc < 5 (kohm) Isc is limited to Isc=1.1 A (typical value). This condition (current limited to the Isc value) lasts for a Ton time interval, that can be set by means of a capacitor (Cdon) connected to the ON DELAY pin according to the following formula: Ton = 1.28 msec/pF for 50pF OUTPUT CURRENT Isc Iout t tOFF tON tOFF Time Short Circuit D94IN105 Time 6/11 L6377 When also the Toff interval has expired, the output power MOS is switched ON. Now two conditions may occur - the overload is still present. In this case the output power MOS is again driven in linear mode (limiting the output current to Isc) for another Ton, starting a new cycle, or - the overload condition is removed, and the output power MOS is no longer driven in linear mode. All these occurrences are presented on the DIAG pin (see fig 2). We call this unique feature Non Dissipative Short Circuit Protection and it ensures a very safe operation even in permanent overload conditions. Note that, of course, choosing the most appropriate value for the Ton interval (i.e. the value of the Cdon capacitor) a delay (the Ton itself) will prevent that a misleading Short Circuit information is presented on the DIAG output, when driving capacitive loads (that acts like short circuit in the very beginning) or Incandescent Lamp (a cold filament has a very low resistive value). The Non Dissipative Short Circuit Protection can be disabled (keeping Ton = 0 but with the output current still limited to Isc, and Diagnostic disabled) simply shorting to ground the the ON DELAY pin. DEMAGNETISATION OF INDUCTIVE LOADS The L6377 has an internal clamping zener diode able to demagnetise inductive loads. Note that the limitation comes from the peak power that the package can handle. Attention must be paid to a proper thermal design of the board. If, for whatever reason (load current or inductive value too big) the peak power dissipation is too high, an external Zener plus Diode arrangement, can perform a demagnetisation versus Ground or versus Vs (see fig 5 and 6). The breakdown voltage of the external Zener Diode must be chosen considering the internal clamping voltage (Vcl) and the supply voltage (Vs) according to: Vz< Vcl(min)-Vs(max) for demagnetisation versus Ground or Vs(max) 100mV 100mV Vs Vi- D94IN079 Vi+ 7/11 L6377 Figure 5: External Demagnetisation Circuit (versus ground) VS RS CURRENT LIMIT DRIVER OUT UV SHORT CIRCUIT CONTROL OVC VZ VZ < Vcl (min) - VS (max) D94IN112 Figure 6: External Demagnetisation Circuit (versus VS) VS RS CURRENT LIMIT DRIVER OUT UV SHORT CIRCUIT CONTROL OVC VS VZ VS (max) < VZ < Vcl (min) D94IN111A 8/11 L6377 mm DIM. MIN. A a1 B b b1 D E e e3 e4 F I L Z 3.18 7.95 2.54 7.62 7.62 6.6 5.08 3.81 1.52 0.125 0.51 1.15 0.356 0.204 1.65 0.55 0.304 10.92 9.75 0.313 0.100 0.300 0.300 0.260 0.200 0.150 0.060 TYP. 3.32 0.020 0.045 0.014 0.008 0.065 0.022 0.012 0.430 0.384 MAX. MIN. TYP. 0.131 MAX. inch OUTLINE AND MECHANICAL DATA Minidip 9/11 L6377 DIM. MIN.. A a1 a2 b b1 C c1 D (1) E e e3 F (1) G L M S 3.8 4.6 0.4 8.55 5.8 1.27 7.62 4 5.3 1.27 0.68 8 (max.) 0.150 0.181 0.016 0.35 0.19 0.5 45 (typ.) 8.75 6.2 0.336 0.228 0.050 0.300 0.157 0.209 0.050 0.027 0.344 0.244 0.1 mm TYP. MAX.. 1.75 0.25 1.6 0.46 0.25 0.014 0.007 0.020 0.004 MIN.. inch TYP.. MAX.. 0.069 0.009 0.063 0.018 0.010 OUTLINE AND MECHANICAL DATA SO14 (1) D and F do not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch). 10/11 L6377 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2001 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 11/11 |
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