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MII 300-12 A4 MID 300-12 A4 MDI 300-12 A4 IGBT Modules Short Circuit SOA Capability Square RBSOA MII 3 IC25 = 330 A VCES = 1200 V VCE(sat) typ. = 2.2 V MID 3 MDI 3 1 2 3 11 10 9 8 8 9 1 1 8 9 1 11 10 2 11 10 2 2 E 72873 Symbol VCES VCGR VGES VGEM IC25 IC80 ICM tSC (SCSOA) RBSOA Ptot TJ Tstg VISOL 50/60 Hz, RMS t = 1 min IISOL 1 mA t=1s Insulating material: Al2O3 Mounting torque (module) (teminals) dS dA a Weight Creepage distance on surface Strike distance through air Max. allowable acceleration Typical Conditions TJ = 25C to 150C TJ = 25C to 150C; RGE = 20 kW Continuous Transient TC = 25C TC = 80C TC = 80C, tp = 1 ms VGE = 15 V, VCE = VCES, TJ = 125C RG = 3.3 W, non repetitive VGE = 15 V, TJ = 125C, RG = 3.3 W Clamped inductive load, L = 100 mH TC = 25C Maximum Ratings 1200 1200 20 30 330 220 440 10 ICM = 400 VCEK < VCES 1380 150 -40 ... +150 4000 4800 2.25-2.75 20-25 2.5-3.7 22-33 10 9.6 50 250 8.8 V V V V A A A ms A Advantages W q Features NPT IGBT technology low saturation voltage low switching losses switching frequency up to 30 kHz square RBSOA, no latch up high short circuit capability positive temperature coefficient for easy parallelling MOS input, voltage controlled ultra fast free wheeling diodes package with DCB ceramic base plate isolation voltage 4800 V UL registered E72873 q q q q q q q q q q q q C C V~ V~ Nm lb.in. Nm lb.in. mm mm m/s2 g oz. q space and weight savings reduced protection circuits Typical Applications q q Md q q AC and DC motor control AC servo and robot drives power supplies welding inverters Data according to a single IGBT/FRED unless otherwise stated. (c) 2000 IXYS All rights reserved 1-4 030 MII 300-12 A4 MID 300-12 A4 MDI 300-12 A4 Symbol Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 1200 4.5 TJ = 25C TJ = 125C 20 6.5 V V Dimensions in mm (1 mm = 0.0394") V(BR)CES VGE(th) ICES IGES VCE(sat) Cies Coes Cres td(on) tr td(off) tf Eon Eoff RthJC RthJS VGE = 0 V IC = 8 mA, VCE = VGE VCE = VCES VCE = 0 V, VGE = 20 V IC = 200 A, VGE = 15 V VCE = 25 V, VGE = 0 V, f = 1 MHz 13 mA mA 800 nA 2.2 13 2 1 100 60 600 90 32 29 0.18 2.7 V nF nF nF ns ns ns ns mJ mJ Inductive load, TJ = 125C IC = 200 A, VGE = 15 V VCE = 600 V, RG = 3.3 W with heatsink compound 0.09 K/W K/W Equivalent Circuits for Simulation Reverse Diode (FRED) Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 2.2 1.7 2.5 2.3 450 280 180 200 0.3 V V A A A ns 0.15 K/W K/W Conduction VF IF IRM trr RthJC RthJS IF = 200 A, VGE = 0 V, IF = 200 A, VGE = 0 V, TJ = 125C TC = 25C TC = 80C IF = 200 A, VGE = 0 V, -diF/dt = 1800 A/ms TJ = 125C, VR = 600 V with heatsink compound IGBT (typ. at VGE = 15 V; TJ = 125C) V0 = 1.3 V; R0 = 6.2 mW Free Wheeling Diode (typ. at TJ = 125C) V0 = 1.3 V; R0 = 2.4 mW Thermal Response IGBT (typ.) Cth1 = 0.50 J/K; Rth1 = 0.088 K/W Cth2 = 1.16 J/K; Rth2 = 0.002 K/W Free Wheeling Diode (typ.) Cth1 = 0.44 J/K; Rth1 = 0.146 K/W Cth2 = 0.80 J/K; Rth2 = 0.003 K/W (c) 2000 IXYS All rights reserved 2-4 MII 300-12 A4 MID 300-12 A4 MDI 300-12 A4 500 A 500 TJ = 25C VGE=17V 15V 13V 400 IC A 400 IC 300 200 TJ = 125C VGE=17V 15V 13V 11V 300 200 100 0 0.0 11V 9V 9V 100 0 0.0 0.5 1.0 1.5 2.0 2.5 VCE 3.0 V 0.5 1.0 1.5 2.0 2.5 3.0 VCE 3.5 V Fig. 1 Typ. output characteristics Fig. 2 Typ. output characteristics 500 VCE = 20V A 400 IC TJ = 25C 900 A 800 700 IF 600 500 400 300 TJ = 125C TJ = 25C 300 200 100 0 5 6 7 8 9 10 VGE 200 100 0 11 V 0 1 2 VF 3 V 4 Fig. 3 Typ. transfer characteristics Fig. 4 Typ. forward characteristics of free wheeling diode 20 V VGE 120 VCE = 600V IC = 200A 300 ns trr A IRM 15 trr 80 10 40 5 IRM TJ = 125C VR = 600V IF = 200A 200 100 300-12 0 0 200 400 600 800 1000 nC QG 0 0 200 400 600 A/ms 800 -di/dt 0 1000 Fig. 5 Typ. turn on gate charge Fig. 6 Typ. turn off characteristics of free wheeling diode (c) 2000 IXYS All rights reserved 3-4 MII 300-12 A4 MID 300-12 A4 MDI 300-12 A4 80 mJ Eon Eon 160 ns 120 td(on) t 80 tr VCE = 600V VGE = 15V 80 mJ td(off) Eoff 60 800 ns 600 t Eoff VCE = 600V VGE = 15V 60 40 40 400 20 RG = 3.3W TJ = 125C 40 20 RG = 3.3W TJ = 125C 200 tf 0 0 100 200 300 IC 0 400 A 500 0 0 100 200 300 IC 400 0 A 500 Fig. 7 Typ. turn on energy and switching times versus collector current 100 mJ Eon 400 ns 320 td(on) tr t 240 160 80 0 28 Eoff Fig. 8 Typ. turn off energy and switching times versus collector current 50 mJ 2000 VCE = 600V VGE = 15V IC = 200A TJ = 125C 80 Eon VCE = 600V VGE = 15V IC = 200A TJ = 125C ns Eoff td(off) 1600 t 1200 800 400 tf 0 40 30 20 10 0 0 60 40 20 0 0 4 8 12 16 RG 20 24 W 4 8 12 16 RG 20 24 W 28 Fig. 9 Typ. turn on energy and switching times versus gate resistor 500 A 1 K/W 0.1 ZthJC 0.01 RG = 3.3W TJ = 125C VCEK < VCES Fig.10 Typ. turn off energy and switching times versus gate resistor 400 ICM 300 200 100 0 0 200 400 600 800 1000 1200 V VCE diode IGBT 0.001 0.0001 single pulse 300-12 0.00001 0.00001 0.0001 0.001 0.01 t 0.1 s 1 Fig. 11 Reverse biased safe operating area RBSOA Fig. 12 Typ. transient thermal impedance (c) 2000 IXYS All rights reserved 4-4 |
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