View HFA3-0001-5_834039.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

UCT A1105 PROD 00, HF OLETE nts: HFA11 nter at OBS rt Ce ceme Repla nical Suppo .com/tsc nded rsil me Tech w.inte Recom ontact our or ww or c ERSIL NT 1-888-I
(R)
HFA-0001
September 1998 File Number 2916.3
Ultra High Slew RateOperational Amplifier
The HFA-0001 is an all bipolar op amp featuring high slew rate (1000V/s), and high unity gain bandwidth (350MHz). These features combined with fast settling time (25ns) make this product very useful in high speed data acquisition systems as well as RF, video, and pulse amplifier designs. Other outstanding characteristics include low bias currents (15A), low offset current (18A), and low offset voltage (6mV). The HFA-0001 offers high performance at low cost. It can replace hybrids and RF transistor amplifiers, simplifying designs while providing increased reliability due to monolithic construction. To enhance the ease of design, the HFA-0001 has a 50 20% resistor connected from the output of the op amp to a separate pin. This can be used when driving 50 strip line, microstrip, or coax cable.
Features
* Unity Gain Bandwidth. . . . . . . . . . . . . . . . . . . . . . 350MHz * Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . 53MHz * High Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . 1000V/s * High Output Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA * Monolithic Construction
Applications
* RF/IF Processors * Video Amplifiers * High Speed Cable Drivers * Pulse Amplifiers * High Speed Communications * Fast Data Acquisition Systems
Part Number Information
PART NUMBER HFA1-0001-5 HFA1-0001-9 HFA3-0001-5 HFA3-0001-9 HFA9P0001-5 TEMPERATURE RANGE 0oC to +75oC -40oC to +85oC 0oC to +75oC -40oC to +85oC 0oC to +75oC PACKAGE 14 Lead Ceramic Sidebraze DIP 14 Lead Ceramic Sidebraze DIP 8 Lead Plastic DIP 8 Lead Plastic DIP 16 Lead Widebody SOIC
Pinouts
HFA-0001 (PDIP) TOP VIEW
NC 1 -IN 2 +IN 3 V- 4 + 8 7 6 5 RSENSE V+ OUT NC
HFA-0001 (CDIP) TOP VIEW
NC 1 NC 2 NC 3 -IN 4 +IN 5 10 OUT V- 6 VNC 6 7 9 8 NC NC NC 7 NC 8
HFA-0001 (300 MIL SOIC) TOP VIEW
16 NC 15 NC 14 RSENSE 13 V+ + 12 OUT 11 NC 10 NC 9 NC
NC 1 NC 2 NC 3 -IN +IN 4 5 +
14 NC 13 NC 12 RSENSE 11 V+
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved
HFA-0001
Absolute Maximum Ratings (Note 1)
Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . .12V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60mA Junction Temperature (Note 9) . . . . . . . . . . . . . . . . . . . . . . .+175oC Junction Temperature (Plastic Package) . . . . . . . . . . . . . . . .+150oC Lead Temperature (Soldering 10 Sec.) . . . . . . . . . . . . . . . . .+300oC
Operating Conditions
Operating Temperature Range HFA-0001-9 . . . . . . . . . . . . . . . . . . . . . . . . . .-40oC TA +85oC HFA-0001-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC TA +75oC Storage Temperature Range . . . . . . . . . . . . . .-65oC TA +150oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications V+ = +5V, V- = -5V, Unless Otherwise Specified
HFA-0001-9 PARAMETER INPUT CHARACTERISTICS Offset Voltage +25oC High Low Average Offset Voltage Drift High Low Bias Current +25oC Full Offset Current +25oC Full Common Mode Range Differential Input Resistance Input Capacitance Input Noise Voltage 0.1Hz to 10Hz 10Hz to 1MHz Input Noise Voltage fO = 10Hz fO = 100Hz fO = 100kHz Input Noise Current fO = 10Hz fO = 100Hz fO = 1000Hz TRANSFER CHARACTERISTICS Large Signal Voltage Gain (Note 2) +25oC High Low Common Mode Rejection Ratio (Note 3) +25oC High Low Unity Gain Bandwidth Minimum Stable Gain OUTPUT CHARACTERISTICS Output Voltage Swing RL = 100 +25oC 3.5 3.5 V +25oC Full 150 150 150 45 40 45 1 200 170 220 47 45 48 350 150 100 150 42 40 42 1 200 170 220 47 45 48 350 V/V V/V V/V dB dB dB MHz V/V +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC 3 6 4.5 12.5 50 100 15 20 18 22 10 2 3.5 6.7 640 170 6 2.35 0.57 0.16 15 20 45 50 50 25 50 3 6 4.5 12.5 50 100 15 20 18 22 10 2 3.5 6.7 640 170 6 2.35 0.57 0.16 30 30 35 100 100 50 50 mV mV mV V/oC V/oC A A A A V k pF Vrms Vrms nV/Hz nV/Hz nV/Hz nA/Hz nA/Hz nA/Hz TEMP MIN TYP MAX MIN HFA-0001-5 TYP MAX UNITS
2
HFA-0001
Electrical Specifications V+ = +5V, V- = -5V, Unless Otherwise Specified (Continued)
HFA-0001-9 PARAMETER RL = 1k TEMP +25oC High Low Full Power Bandwidth (Note 5) Output Resistance, Open Loop Output Current TRANSIENT RESPONSE Rise Time (Note 4, 6) Slew Rate (Note 4, 7) RL = 1k RL = 100 Settling Time (3V Step) Overshoot (Note 4, 6) POWER SUPPLY CHARACTERISTICS Supply Current Power Supply Rejection Ratio (Note 8) Full +25oC High Low 40 35 40 65 42 41 42 75 37 35 37 65 42 41 42 75 mA dB dB dB 0.1% +25oC +25oC +25oC +25oC +25oC 480 1000 875 25 36 480 1000 875 25 36 ps V/s V/s ns % +25oC +25oC Full MIN 3.5 3.0 3.5 30 TYP 3.7 3.6 3.7 53 3 50 MAX MIN 3.5 3.0 3.5 30 HFA-0001-5 TYP 3.7 3.6 3.7 53 3 50 MAX UNITS V V V MHz mA
NOTES: 1. Absolute Maximum Ratings are limiting values applied individually beyond which the serviceability of the circuit may be impaired. Functional operation under any of these conditions is not necessarily implied. 2. VOUT = 0 to 2V, R L = 1k. 3. VCM = 2V. 4. RL = 100. SlewRate 5. Full Power Bandwidth is calculated by equation: FPBW = ---------------------------- , V = 3.0V . PEAK 2V PEAK 6. VOUT = 200mV, AV = +1. 7. VOUT = 3V, AV = +1. 8. VS = 4V to 6V. 9. See Thermal Constants in `Applications Information' text. Maximum power dissipation, including output load, must be designed to maintain the junction temperature below +175oC for hermetic packages, and below +150oC for plastic packages.
Schematic Diagram
V+
Die Characteristics
Thermal Constants (oC/W) HFA1-0001-5/-9 HFA3-0001-5 HFA9P-0001-5/-9 JA 75 98 96 JC 13 36 27
RSENSE
+IN
-IN
VOUT
V-
3
HFA-0001 Test Circuits
VIN 50 50 + 1k 20pF VOUT VIN 50 50 + 100 VOUT
FIGURE 1. LARGE SIGNAL RESPONSE TEST CIRCUIT
FIGURE 2. SMALL SIGNAL RESPONSE TEST CIRCUIT
LARGE SIGNAL RESPONSE VOUT = 0V to 3V Vertical Scale: 1V/Div. Horizontal Scale: 2ns/Div.
SMALL SIGNAL RESPONSE VOUT = 0mV to 200mV Vertical Scale: 100mV/Div. Horizontal Scale: 2ns/Div.
VIN VIN
VOUT
VOUT
NOTE: Initial Step In Output Is Due To Fixture Feedthrough
PROPAGATION DELAY Vertical Scale: 500mV/Div. Horizontal Scale: 2ns/Div. AV = +1, R L = 100, VOUT = 0V to 3V
VSETTLE
1k
1k 100
VIN
100 +
VOUT
FIGURE 3. SETTLING TIME SCHEMATIC
NOTE: Test Fixture Delay of 450ps is Included
4
HFA-0001 Typical Performance Curves
50 40 GAIN (dB) 30 20 10 0 180 135 PHASE 90 RL = 100 100K 1M 10M FREQUENCY (Hz) 100M 45 0 1G PHASE MARGIN (DEGREES) GAIN GAIN (dB) 20 10 0 -10 -20 PHASE 180 135 90 45 AV = +1, RL = 100, R F = 50 1M 10M 100M FREQUENCY (Hz) 0 1G GAIN PHASE MARGIN (DEGREES) PHASE MARGIN (DEGREES) VIN 50 50 VOUT 100
VS = 5V, TA = +25oC, Unless Otherwise Specified
FIGURE 4. OPEN LOOP GAIN AND PHASE vs FREQUENCY
FIGURE 5. CLOSED LOOP GAIN vs FREQUENCY
20 GAIN (dB) 10 0 -10 -20
VIN 50 100
VOUT 100 GAIN (dB)
30 20 10 0 -10 VIN 50 900 100 180 135 90 AV = +10 RL = 100 100K 1M 10M FREQUENCY (Hz) 100M 45 0 1G VOUT 100
180 135 90 45 1M 10M 100M 0 1G
FREQUENCY (Hz)
FIGURE 6. CLOSED LOOP GAIN vs FREQUENCY
PHASE MARGIN (DEGREES)
FIGURE 7. CLOSED LOOP GAIN vs FREQUENCY
700 AV = +1, RL = 100 VOUT = 0mV to 200mV
80 70 60
600
RISE TIME (ps)
500 CMRR (dB) 50 40 30 20 200 10 0 100K
400
300
100 -60
-40
-20
0
20
40
60
80
100
120
1M
10M FREQUENCY (Hz)
100M
1G
TEMPERATURE (oC)
FIGURE 8. RISE TIME vs TEMPERATURE
FIGURE 9. CMRR vs FREQUENCY
5
HFA-0001 Typical Performance Curves
80 70 OFFSET VOLTAGE (mV) 60 PSRR (dB) 50 40 30 +PSRR 20 10 0 100K
VS = 5V, TA = +25oC, Unless Otherwise Specified (Continued)
25 20 15 10 5 0 -5 -10 -15
-PSRR
1M
10M FREQUENCY (Hz)
100M
1G
-20 -60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (oC)
FIGURE 10. PSRR vs FREQUENCY
FIGURE 11. OFFSET VOLTAGE vs TEMPERATURE (3 REPRESENTATIVE UNITS)
40
20 15
30 OFFSET CURRENT (A) -40 -20 0 20 40 60 80 100 120 10 5 0 -5 -10 -15 -20 -20 -60 -25 -60 -40 -20 0 20 40 60 80 100 120 BIAS CURRENT (A)
20
10
0
-10
TEMPERATURE (oC)
TEMPERATURE (oC)
FIGURE 12. BIAS CURRENT vs TEMPERATURE (3 REPRESENTATIVE UNITS)
FIGURE 13. OFFSET CURRENT vs TEMPERATURE (3 REPRESENTATIVE UNITS)
300 280 260 -AVOL 240 220 200 +AVOL 180 160 140 120 100 80 60 40 20 RL = 1k, VOUT = 0V to 2V 0 -60 -40 -20 0 20 40
4.6 4.4 4.2 OUTPUT VOLTAGE (V) 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 60 80 100 120 2.0 -60 RL = 1k -40 -20 0 20 40 60 80 100 120 +VOUT -VOUT
OPEN LOOP GAIN (V/V)
TEMPERATURE (oC)
TEMPERATURE (oC)
FIGURE 14. OPEN LOOP GAIN vs TEMPERATURE
FIGURE 15. OUTPUT VOLTAGE SWING vs TEMPERATURE
6
HFA-0001 Typical Performance Curves
1200 1100 1000 900 +SLEW RATE 800 700 600 500 -60 AV = +1, RL = 100 VOUT = 3V
VS = 5V, TA = +25oC, Unless Otherwise Specified (Continued)
60 58 56 54 52 CMRR (dB) 50 48 46 44 42 40 38 36 34 -60 +CMRR -CMRR
SLEW RATE (V/s)
-SLEW RATE
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (oC)
TEMPERATURE (oC)
FIGURE 16. SLEW RATE vs TEMPERATURE
FIGURE 17. CMRR vs TEMPERATURE
90 80
VS = 4V TO 6V
70 60 SUPPLY CURRENT (mA) 60 80 100 120 50 40 30 20 10 0
70 60 PSRR (dB) 50 40 30 20 10 0 -60 +PSRR -PSRR
-40
-20
0
20
40
0
1
2
3
4
5
TEMPERATURE (oC)
SUPPLY VOLTAGE (V)
FIGURE 18. PSRR vs TEMPERATURE
FIGURE 19. SUPPLY CURRENT vs SUPPLY VOLTAGE
70 66 SUPPLY CURRENT (mA) 64 62 60 58 56 54 52 50 48 46 44 -60 PEAK OUTPUT VOLTAGE SWING (V) 68
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1M 10M 100M 1G
AV = +1, R L = 100 THD < 1%
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (oC)
FREQUENCY (Hz)
FIGURE 20. SUPPLY CURRENT vs TEMPERATURE
FIGURE 21. MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY
7
HFA-0001 Typical Performance Curves
5.0 PEAK OUTPUT VOLTAGE SWING (V) 4.5 4.0 OPEN LOOP GAIN (V/V) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 10 100 1K LOAD RESISTANCE () 10K AV = +1, fO = 50kHz THD < 1%
VS = 5V, TA = +25oC, Unless Otherwise Specified (Continued)
240 220 200 180 160 140 120 100 80 60 40 10 100 1K LOAD RESISTANCE () 10K -AVOL +AVOL
VOUT = 2V
FIGURE 22. OUTPUT VOLTAGE SWING vs LOAD RESISTANCE
FIGURE 23. OPEN LOOP GAIN vs LOAD RESISTANCE
8 7 NOISE VOLTAGE (V/Hz) 6 5 4 3 2 NOISE VOLTAGE 1 0 1 10 100 1K 10K FREQUENCY (Hz) NOISE CURRENT
8 7 NOISE CURRENT (nA/Hz) 6 5 4 3 2 1 0 100K NOISE VOLTAGE (nV/Hz)
600
600
500
500 NOISE CURRENT (pA/Hz)
400
400
300 200 NOISE CURRENT
300 200
100
NOISE VOLTAGE
100
0 100
1K 10K FREQUENCY (Hz)
0 100K
FIGURE 24. INPUT NOISE vs FREQUENCY
FIGURE 25. INPUT NOISE vs FREQUENCY
FIGURE 26. INPUT VOLTAGE NOISE 0.1Hz to 10Hz AV = 50, Noise Voltage = 1.605Vrms (RTI) Noise Voltage = 10.12VP-P
FIGURE 27. INPUT NOISE VOLTAGE 10Hz to 1MHz AV = 50, Noise Voltage = 5.36Vrms (RTI) Noise Voltage = 29.88VP-P
8
HFA-0001 Applications Information
Offset Adjustment
When applications require the offset voltage to be as low as possible, the figure below shows two possible schemes for adjusting offset voltage. For a voltage follower application, use the circuit in Figure 29 without R2 and with RI shorted. R1 should be 1M to 10M. The adjustment resistors will cause only a very small gain error.
RF +5V VIN 50kK R1 100k -5V R2 100 RI + VOUT
This 50 resistor can be used as the series resistor instead of an external resistor.
VIN + 50 50 50 COAX CABLE VOUT
50 RF
FIGURE 30.
PC board traces can be made to look like a 50 or 75 transmission line, called microstrip. Microstrip is a PC board trace with a ground plane directly beneath, on the opposite side of the board, as shown in Figure 31.
SIGNAL TRACE w t
FIGURE 28. INVERTING GAIN
GROUND PLANE VIN R1 100k 50k R2 100 -V RF RI DIELECTRIC (PC BOARD)
+V
+ -
O
FIGURE 29. NON-INVERTING GAIN
PC Board Layout Guidelines
When designing with the HFA-0001, good high frequency (RF) techniques should be used when making a PC board. A massive ground plane should be used to maintain a low impedance ground. Proper shielding and use of short interconnection leads are also very important. To achieve maximum high frequency performance, the use of low impedance transmission lines with impedance matching is recommended: 50 lines are common in communications and 75 lines in video systems. Impedance matching is important to minimize reflected energy therefore minimizing transmitted signal distortion. This is accomplished by using a series matching resistor (50 or 75), matched transmission line (50 or 75), and a matched terminating resistor, as shown in Figure 30. Note that there will be a 6dB loss from input to output.The HFA0001 has an integral 50 20% resistor connected to the op amps output with the other end of the resistor pinned out.
9

R2 Adjustment Range V ------R 1

R F Gain 1 + ------------------R +R I 2
Power supply decoupling is essential for high frequency op amps. A 0.01F high quality ceramic capacitor at each supply pin in parallel with a 1F tantalum capacitor will provide excellent decoupling as shown in Figure 32.
V+ 1.0F
0.01F
+ 0.01F
1.0F
V-
FIGURE 32. POWER SUPPLY DECOUPLING

R2 Adjustment Range V ------R 1

h ER
FIGURE 31.
VOUT
When manufacturing pc boards, the trace width can be calculated based on a number of variables. The following equation is reasonably accurate for calculating the proper trace width for a 50 transmission line.
5.98h 87 = ------------------------------ ln -------------------- 0.8w + t E + 1.41 R
Z
HFA-0001
V+ C
Thermal Management
The HFA-0001 can sink and source a large amount of current making it very useful in many applications. Care must be taken not to exceed the power handling capability of the part to insure proper performance and maintain high reliability. The following graph shows the maximum power handling capability of the HFA-0001 without exceeding the maximum allowable junction temperature of +175oC. The curves also show the improved power handling capability when heatsinks are used based on AVVID heatsink #5801B for the 8 lead Plastic DIP and IERC heatsink #PEP50AB for the 14 lead Sidebraze DIP. These curves are based on natural convection. Forced air will greatly improve the power dissipation capabilities of a heatsink.
3.0 2.8 B 2.6 2.4 A 2.2 2.0 1.8 D 1.6 1.4 C 1.2 1.0 0.8 0.6 A: 8 LEAD PLASTIC DIP WITH HEATSINK B: 14 LEAD SIDEBRAZE DIP WITH HEATSINK 0.4 C: 8 LEAD PLASTIC DIP ONLY 0.2 D: 14 LEAD SIDEBRAZE DIP ONLY 0 20 40 60 80 100 AMBIENT TEMPERATURE (oC)
R C
+ C
R C
V-
FIGURE 33. IMPROVED DECOUPLING/CURRENT LIMITING
Saturation Recovery
When an op amp is over driven output devices can saturate and sometimes take a long time to recover. By clamping the input to safe levels, output saturation can be avoided. If output saturation cannot be avoided, the recovery time from 25% over-drive is 20ns and 30ns from 50% over-drive.
POWER DISSIPATION (W)
Chip capacitors produce the best results due to ease of placement next to the op amp and they have negligible lead inductance. If leaded capacitors are used, the leads should be kept as short as possible to minimize lead inductance. Figures 32 and 33 illustrate two different decoupling schemes. Figure 33 improves the PSRR because the resistor and capacitors create low pass filters. Note that the supply current will create a voltage drop across the resistor.
120
FIGURE 34.
10

▲Up To Search▲

Price & Availability of HFA3-0001-5

	To Download HFA3-0001-5 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .