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STPS30100ST Power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF(typ) 30 A 100 V 150 C 0.385 V A K A K Features and Benefits Avalanche rated Low VF Good trade off between leakage current and forward voltage drop High frequency operation Avalanche capability specified TO-220AB STPS30100ST A A K Description Single Schottky rectifier, suited for high frequency switch mode power supply. Packaged in TO-220AB, this device is intended to be used in notebook and game station adaptors, providing in these applications a good efficiency at both low and high load. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj 1. dPtot --------------dTj Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward current Average forward current = 0.5 Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature (1) Tc = 125 C tp = 10 ms sinusoidal tp = 1 s Tj = 25 C Value 100 60 30 300 26400 -65 to + 175 150 Unit V A A A W C C < 1 ------------------------Rth ( j - a ) condition to avoid thermal runaway for a diode on its own heatsink October 2006 Rev 1 1/7 www.st.com 7 Characteristics STPS30100ST 1 Characteristics Table 2. Symbol Rth(j-c) Junction to case Thermal resistance Parameter Value 1 Unit C/W Table 3. Symbol Static electrical characteristics (per diode) Parameter Test Conditions Tj = 25 C VR = VRRM Min. Typ. Max. 175 20 50 60 VR = 70 V 10 0.475 IF = 5 A 0.385 0.555 IF = 10 A 0.475 V 0.620 IF = 15 A 0.525 0.740 IF = 30 A 0.605 0.660 0.565 0.800 0.655 20 Unit A mA A mA IR(1) Reverse leakage current Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C VF(2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.475 x IF(AV) + 0.006 x IF2(RMS) 2/7 STPS30100ST Characteristics Figure 1. PF (av)(W) Conduction losses versus average Figure 2. current 35 =0.05 =0.1 =0.2 =0.5 =1 Average forward current versus ambient temperature ( = 0.5) 26 24 22 20 18 16 14 12 10 8 6 4 2 0 IF(av)(A) Rth(j-a)=Rth(j-c) 30 25 20 15 10 T T Rth(j-a)=15C/W 5 IF(av)(A) 0 4 8 12 16 20 24 28 =tp/T 32 tp =tp/T 0 0 25 tp Tamb(C) 50 75 100 125 150 36 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1s) 1 1.2 1 PARM(tp) PARM(25C) 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration 350 300 250 200 IM(A) 1.0 0.9 0.8 0.7 0.6 Tc=25C Zth(j-c)/Rth(j-c) 0.5 0.4 0.3 150 100 Tc=75C Tc=125C 50 0 IM t 0.2 0.1 0.0 Single pulse =0.5 t(s) 1.E-02 1.E-01 1.E+00 tp(s) 1.E-02 1.E-01 1.E+00 1.E-03 1.E-03 3/7 Characteristics STPS30100ST Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) F=1M H z Vosc=30m V Tj =25 C 1.E+03 1.E+02 IR(mA) C(pF) 10000 Tj=150C 1.E+01 1.E+00 1.E-01 1.E-02 1.E-03 Tj=125C Tj=100C Tj=75C Tj=50C Tj=25C 1000 VR(V) 1.E-04 0 10 20 30 40 50 60 70 80 90 100 VR ( V) 100 1 10 100 Figure 9. IFM(A) Forward voltage drop versus forward current (high level) Figure 10. Forward voltage drop versus forward current (low level) 30 200 180 160 140 120 100 80 60 40 20 0 IFM(A) Tj=125C (Maximum values) 25 Tj=125C (Maximum values) 20 Tj=125C (Typical values) 15 Tj=125C (Typical values) 10 Tj=25C (Maximum values) Tj=25C (Maximum values) 5 VFM(V) 0 VFM(V) 1.6 1.8 2.0 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 4/7 STPS30100ST Package Information 2 Package Information Epoxy meets UL94,V0 Table 4. TO-220AB dimensions Dimensions Ref. Millimeters Min. A a1 B OI L F A I4 l3 a1 l2 c2 b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a2 B b1 b2 C c1 c2 14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 2.70 0.094 6.60 0.244 3.85 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 a2 e M F c1 b1 e OI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 0.104 1.70 0.044 1.70 0.044 0.102 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering Information STPS30100ST 3 Ordering Information Ordering type STPS30100ST Marking STPS30100ST Package TO-220AB Weight 2.23 g Base qty 50 Delivery mode Tube 4 Revision History Date 24-Oct-2006 Revision 1 First issue Changes 6/7 STPS30100ST Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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