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| 05158 LC0406FC3.3C thru LC0406FC36C LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 0402 CHIP SHOWN FEATURES ESD Protection > 25 kilovolts Available in Voltages Ranging From 3.3V to 36V 200 Watts Peak Pulse Power per Line (tp = 8/20s) Low Clamping Voltage Bidirectional Configuration & Monolithic Structure Protects 3 to 5 Lines Low Capacitance Low Leakage Current RoHS Compliant MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0406 Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Consult Factory for Leaded Device Availability Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel Top Contacts: Solder Bump 0.004" in Height (Nominal) PIN CONFIGURATION 05158.R6 2/07 1 www.protekdevices.com LC0406FC3.3C thru LC0406FC36C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TA TSTG VALUE 200 -55 to 150 -55 to 150 UNITS Watts C C ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 11.0 13.2 19.8 25.4 37.2 70.0 @ 25C Unless Otherwise Specified MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID A 75* 10** 1 1 1 1 1 TYPICAL CAPACITANCE VWM VOLTS LC0406FC3.3C LC0406FC05C LC0406FC08C LC0406FC12C LC0406FC15C LC0406FC24C LC0406FC36C 3.3 5.9 8.0 12.0 15.0 24.0 36.0 @ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 40.0 @8/20s VC @ IPP 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 80.0V @ 2.5A @0V, 1 MHz C pF 70 35 32 30 25 20 18 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 10,000 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 120 100 80 60 40 20 0 tf FIGURE 2 PULSE WAVE FORM Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s 1,000 200W, 8/20s Waveform 100 e-t td = t I /2 PP 10 0.01 1 10 100 td - Pulse Duration - s 1,000 10,000 0 5 10 15 t - Time - s 20 25 30 05158.R6 2/07 2 www.protekdevices.com LC0406FC3.3C thru LC0406FC36C GRAPHS 100 80 % Of Rated Power FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20s 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR LC0406FC05C 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0406FC05C 14 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 15 20 05158.R6 2/07 VC - Clamping Voltage - Volts 3 www.protekdevices.com LC0406FC3.3C thru LC0406FC36C APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - C Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down 05158.R6 2/07 4 www.protekdevices.com LC0406FC3.3C thru LC0406FC36C 0406 PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE DIM A B C A B C PACKAGE DIMENSIONS MILLIMETERS 0.56 NOM 0.86 NOM 0.99 0.0254 0.15 SQ 1.5 0.0254 0.15 NOM 0.127 MAX 0.076 MIN I 0.406 NOM INCHES 0.022 NOM 0.034 NOM 0.039 0.001 0.006 SQ 0.059 0.001 0.006 NOM 0.005 MAX 0.003 MIN 0.016 NOM TOP SIDE E F G H G E F H NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). END I MOUNTING PAD LAYOUT - Option 1 DIM C A D A C D E F G H I NOTE: PAD DIMENSIONS MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 DIE SOLDER BUMPS E H G 1. Preferred: Using 0.1mm (0.004") stencil. I SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK 05158.R6 2/07 5 F www.protekdevices.com LC0406FC3.3C thru LC0406FC36C 0406 PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LAYOUT - Option 2 DIM A COPPER CONTACTS 0.009" [0.23] DIA. PACKAGE DIMENSIONS MILLIMETERS 0.51 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.006 SQ 0.028 0.039 0.020 A F G H I DIE SOLDER BUMPS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. H G I TAPE & REEL ORIENTATION SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK F Triple Die - 0406 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA 481. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., LC0406FC05C-T75-1. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., LC0406FC05C-T75-2. Suffix - LF = Lead-Free, i.e., LC0406FC05C-LF-T75-1. Outline & Dimensions: Rev 3 - 11/02, 06023 COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05158.R6 2/07 6 www.protekdevices.com |
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