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| INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification "bumped sawn wafer on UV-tape" Product Specification Revision 3.0 PUBLIC August 2004 Philips Semiconductors Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS 1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 5 6 6.1 6.2 7 8 9 SCOPE............................................................................................................................. 3 REFERENCE DOCUMENTS.............................................................................................. 3 Philips Documents............................................................................................................. 3 MECHANICAL SPECIFICATION ........................................................................................ 3 Wafer................................................................................................................................ 3 Wafer Backside ................................................................................................................. 3 Chip Dimensions ............................................................................................................... 3 Passivation........................................................................................................................ 3 Au Bump........................................................................................................................... 3 ORDERING INFORMATION .............................................................................................. 3 Bumped die on sawn wafer ................................................................................................ 3 CHIP ORIENTATION AND BONDPAD LOCATIONS ........................................................... 4 ELECTRICAL SPECIFICATIONS ....................................................................................... 5 Absolute Maximum Ratings ................................................................................................ 5 AC Characteristics............................................................................................................. 5 DEFINITIONS ................................................................................................................... 6 LIFE SUPPORT APPLICATIONS ....................................................................................... 6 REVISION HISTORY ......................................................................................................... 6 Contact Information........................................................................................................................ 7 MIFARE(R) is a registered trademark of Philips Electronics N.V. 2 PUBLIC Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 1 SCOPE The MF1 ICS 50 05 is a contactless Smart Card IC designed for card IC coils following the MIFARE (R) Card IC Coil Design Guide and is qualified to work properly in Philips reader environment, which is built according to Philips specification. This specification describes electrical, physical and dimensional properties of sawn bumped wafers on UV-tape. 3.4 Passivation * * * Type: Material: Thickness: sandwich structure PSG / Nitride (on top) 500 nm / 600 nm 3.5 Au Bump * * * * * Bump material: Bump hardness: Bump shear strength: Bump height: Bump height uniformity: within a die: within a wafer: wafer to wafer: Bump flatness: Bump size: 1 LA, LB, VSS 1 TESTIO Bump size variation: Under bump metallisation: > 99.9% pure Au 35 - 80 HV 0.005 > 70 MPa 18 m 2 m 3 m 4 m 1.5 m 104 x 104 m 89 x 104 m 5 m sputtered TiW 2 REFERENCE DOCUMENTS 2.1 Philips Documents * * * * * * Data Sheet "General Specification for 8" Wafer on UV-tape" Data Sheet "Au Bumps Layout Rules and Specification" Data Sheet "Standard Card IC MF1 IC S50 Memory Contents After Test" Data Sheet "Standard Card IC MF1 IC S50 Functional Specification" Product Qualification Package "Standard Card IC MF1 IC S50 05" Application Note "MIFARE (R) Card IC Coil Design Guide" * * * * 4 ORDERING INFORMATION 4.1 Bumped die on sawn wafer * * Order Code: 12NC: MF1ICS5005W/V1D 9352 774 55005 3 MECHANICAL SPECIFICATION 3.1 Wafer * * * * Diameter: Thickness: Flatness: PGDW: 8" 150 m 15 m not applicable 24892 3.2 Wafer Backside * * * Material: Treatment: Roughness: Si ground and etched Ra max. 0.5 m Rt max. 5 m 3.3 Chip Dimensions * * Chip size: Scribe lines: x-line: y-line: 1.11 x 1.06 mm 91.2 m 91.2 m 3 Note: Substrate is connected to VSS. 1 Pads VSS and TESTIO are disconnected when wafer is sawn. PUBLIC Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 5 CHIP ORIENTATION AND BONDPAD LOCATIONS Widths and lengths are measured from metal to metal. PAD(center) x [m] VSS TESTIO LA Y LB 0.0 252.2 17.4 712.4 y [m] 0.0 602.3 596.1 0.0 (1) (5) (6) LA TESTIO (4) VSS MF1ICS5005 LB (8) X (7) (2) (3) (1) (2) (3) (4) X-Scribeline width: Y-Scribeline width: Chip step, x-length: Chip step, y-length: 91.2 m 91.2 m 1.11 mm 1.06 mm (5) (6) (7) (8) LA bump edge to chip edge, y-length: LA bump edge to chip edge, x-length: LB bump edge to chip edge, y-length: LB bump edge to chip edge, x-length: 106.5 m 103.0 m 133.4 m 88.6 m Figure 1 4 PUBLIC Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 6 ELECTRICAL SPECIFICATIONS 6.1 Absolute Maximum Ratings SYMBOL IIN PTOT TSTOR TOP VESD ILU PARAMETER input current total power dissipation storage temperature operating temperature electrostatic discharge voltage 2 LA-LB latchup current MIN -55 -25 2 100 MAX 30 200 125 70 - UNIT mA mW C C kV mA 6.2 AC Characteristics SYMBOL fIN CIN tW tRET NWE PARAMETER input frequency Input capacitance (LCR meter HP4258) EEPROM write time EEPROM data retention EEPROM write endurance CONDITIONS 22C, Cp-D, 13.56 MHz, 2 V MIN 14.4 10 105 TYP 13.56 16.1 2.9 MAX 17.4 - UNIT MHz pF ms years cycles 2 MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k 5 PUBLIC Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 7 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics section of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. This data sheet contains final product specifications. 8 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 9 REVISION HISTORY Table 1 Bumped Wafer Specification MF1 IC S50 05 Revision History REVISION DATE CPCN PAGE DESCRIPTION 3.0 August 2004 - Initital version. 6 PUBLIC Philips Semiconductors - a worldwide company Contact Information For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. SCA74 The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Philips Semiconductors |
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